公开(公告)号：GB2491519B

公开(公告)日：2014-03-19

申请号：GB201215987

申请日：2011-01-20

Applicant: IBM

Inventor： ANDRY PAUL S ,  BRUNSCHWILER THOMAS J ,  COLGAN EVAN ,  MAGERLEIN JOHN H

IPC: H01L23/14 ,  H01L23/367 ,  H01L23/473 ,  H01L23/498 ,  H01L25/065 ,  H05K7/20

Abstract: A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.

公开(公告)号：GB2497246A

公开(公告)日：2013-06-05

申请号：GB201305369

申请日：2011-08-04

Applicant: IBM

Inventor： BRUNSCHWILER THOMAS J ,  MICHEL BRUNO ,  RUCH PATRICK

IPC: H01L23/58 ,  H01M8/10 ,  H01M8/18

Abstract: The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.