公开(公告)号：GB2515940A

公开(公告)日：2015-01-07

申请号：GB201417884

申请日：2013-03-27

Applicant: IBM

Inventor： KAMINSKI NOAM ,  ELAD DANNY ,  SHUMAKER EVGENY ,  OKAMOTO KEISHI ,  TORIYAMA KAZUSHIGE

IPC: H01L23/66

Abstract: A mm Wave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mm Wave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mm Wave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.