公开(公告)号：JP2011109152A

公开(公告)日：2011-06-02

申请号：JP2011050952

申请日：2011-03-09

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： MORI HIROYUKI ,  KAWASAKI KAZUSHIGE

IPC: H01L23/12 ,  H01L21/60

CPC classification number: H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/15311

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board in which a solder bump of a mounted semiconductor chip is unlikely to break. SOLUTION: A coreless substrate 20 which is a kind of printed wiring board includes an insulating layer 26a having a principal surface and a connection pad 24 buried in the insulating layer 26a. The connection pad 24 is in a shape of a hat with a brim. Namely, the connection pad 24 comprises a plate portion 36 having a diameter ϕ1 of 95 μm and a contact portion 38 having a diameter ϕc of 75 μm. A principal surface 39 of the contact portion 38 is exposed on the principal surface 7 of the insulating layer 26a. Since the diameter ϕc of the contact portion 38 is substantially equal to a diameter ϕ2 of a bump base metal 11 on the side of the semiconductor chip 8, mechanical stress applied in a direction wherein a semiconductor chip 8 is drawn and peeled from the coreless substrate 20 is dispersed equally to both sides of the connection pad 24 and bump base metal 11 in such a case, so that breakage is unlikely to occur. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供其中安装的半导体芯片的焊料凸块不太可能破裂的印刷线路板。 解决方案：作为一种印刷电路板的无芯基板20包括具有主表面的绝缘层26a和埋在绝缘层26a中的连接焊盘24。 连接垫24是具有边缘的帽子的形状。 也就是说，连接垫24包括直径φ1为95μm的板部36和直径φc为75μm的接触部38。 接触部分38的主表面39暴露在绝缘层26a的主表面7上。 由于接触部分38的直径φc基本上等于半导体芯片8一侧的凸点母材11的直径φ2，所以在半导体芯片8被拉出并从无芯基板剥离的方向上施加的机械应力 在这种情况下，20均匀地分散到连接焊盘24的两侧并且凸起基底金属11，使得不可能发生断裂。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2002094205A

公开(公告)日：2002-03-29

申请号：JP2000271251

申请日：2000-09-07

Applicant: IBM

Inventor： KOBAYASHI KAORU ,  MORI HIROYUKI ,  YAMANAKA KIMIHIRO

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

Abstract: PROBLEM TO BE SOLVED: To provide a through-hole structure used for connecting connectors for high frequency to a printed board and to provide a printed board containing the through-hole structure. SOLUTION: The through-hole structure 2 used for connecting connectors to the printed board 1 contains a through-hole 3 for signal which is treated to become conductive for supplying signals, through-holes 4 for power which are treated to become conductive for supplying electric power, and dielectric constant adjusting sections 5 formed between the through-holes 3 and 4. The printed board 1 contains the through-hole structure 2.