公开(公告)号：EP1662850A4

公开(公告)日：2008-10-22

申请号：EP04771846

申请日：2004-08-19

Applicant: IBM

Inventor： OHSUMI KOHICHI ,  KOBAYASHI KAORU

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  H05K3/42

CPC classification number: H05K3/426 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: [PROBLEMS] A printed wiring board having a through hole conductor is disclosed which can be manufactured by both subtractive process and additive process. [MEANS FOR SOLVING PROBLEMS] A printed wiring board (100) comprises a through hole conductor (6) which is formed on the surface of a through hole (5) formed in a copper-clad laminate (1) and on a part of the surface of the copper-clad laminate (1) surrounding the opening of the through hole (5). The through hole conductor (6) is filled with a positive photosensitive resin (7), and a lid conductor (8) is formed on top of the positive photosensitive resin (7) and the through hole conductor (6). A circuit pattern (14) is formed on the surface of the copper-clad laminate (1). An insulating layer (3) is formed over the upper surface of the copper-clad laminate (1), the lid conductor (8) and the circuit pattern (14), and a via hole (16) is so formed in the insulating layer (3) as to range from the surface of the layer (3) to the lid conductor (8). A via conductor (10) is formed in the via hole (16) and on a part of the surface of the insulating layer (3) surrounding the opening of the via hole (16).

公开(公告)号：JP2002094205A

公开(公告)日：2002-03-29

申请号：JP2000271251

申请日：2000-09-07

Applicant: IBM

Inventor： KOBAYASHI KAORU ,  MORI HIROYUKI ,  YAMANAKA KIMIHIRO

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

Abstract: PROBLEM TO BE SOLVED: To provide a through-hole structure used for connecting connectors for high frequency to a printed board and to provide a printed board containing the through-hole structure. SOLUTION: The through-hole structure 2 used for connecting connectors to the printed board 1 contains a through-hole 3 for signal which is treated to become conductive for supplying signals, through-holes 4 for power which are treated to become conductive for supplying electric power, and dielectric constant adjusting sections 5 formed between the through-holes 3 and 4. The printed board 1 contains the through-hole structure 2.