公开(公告)号：JP2002072484A

公开(公告)日：2002-03-12

申请号：JP2001108824

申请日：2001-04-06

Applicant: JSR CORP ,  IBM

Inventor： NISHIMURA YUKIO ,  YAMAHARA NOBORU ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU ,  ITO HIROSHI

IPC: C08K5/00 ,  C08L33/06 ,  C08L35/00 ,  C08L45/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.