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公开(公告)号:DE60143178D1
公开(公告)日:2010-11-18
申请号:DE60143178
申请日:2001-06-15
Inventor: NISHIMURA YUKIO , YAMAHARA NOBORU , YAMAMOTO MASAFUMI , KAJITA TORU , SHIMOKAWA TSUTOMU , ITO HIROSHI
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公开(公告)号:JP2011070209A
公开(公告)日:2011-04-07
申请号:JP2010246045
申请日:2010-11-02
Applicant: Internatl Business Mach Corp
, Jsr Corp , Jsr株式会社 , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor: NISHIMURA YUKIO , YAMAHARA NOBORU , YAMAMOTO MASASHI , KAJITA TORU , SHIMOKAWA TSUTOMU , ITO HIROSHI
IPC: G03F7/039 , C08F214/18 , C08F220/22 , C08F220/24 , C08F232/08 , C08G61/08 , C08K5/10 , C08L27/12 , C08L33/06 , C08L33/16 , C08L35/00 , C08L101/08 , G03F20060101 , G03F7/004 , H01L21/027
Abstract: PROBLEM TO BE SOLVED: To provide a novel radiation sensitive resin composition having high transparency to radiation, excellent basic physical properties for a resist pattern such as in sensitivity, resolution, and pattern shapes, without causing development defects during fine machining, to manufacture semiconductor elements at a high yield.
SOLUTION: The radiation-sensitive resin compositions comprises (A) a resin containing an acid dissociable group obtained by the open ring polymerization of the norbornene derivative having a structure shown by the following general formula (1), and (B) a radiation-sensitive acid generator. In the general formula (1), R
1 represents a hydrogen atom and a univalent acid dissociation group, X
1 a low-grade fluorinated alkyl group, and R
2 a hydrogen atom, an alkyl group or a fluorinated alkyl group.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题:提供一种对辐射具有高透明度的新颖的辐射敏感性树脂组合物,用于抗敏剂图案的极好的基本物理性能,例如灵敏度,分辨率和图案形状,而不会在精加工期间引起显影缺陷, 以高产率制造半导体元件。 解决方案:辐射敏感性树脂组合物包含(A)含有通过具有下列通式(1)所示结构的降冰片烯衍生物的开环聚合获得的酸解离基的树脂,(B) 辐射敏感酸发生器。 在通式(1)中,R
1 SP>表示氢原子和一价酸解离基团,低级氟化烷基,X 1, 2个氢原子,烷基或氟化烷基。 版权所有(C)2011,JPO&INPIT -
公开(公告)号:JP2002072484A
公开(公告)日:2002-03-12
申请号:JP2001108824
申请日:2001-04-06
Inventor: NISHIMURA YUKIO , YAMAHARA NOBORU , YAMAMOTO MASASHI , KAJITA TORU , SHIMOKAWA TSUTOMU , ITO HIROSHI
Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.
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公开(公告)号:DE60018350D1
公开(公告)日:2005-04-07
申请号:DE60018350
申请日:2000-11-08
Applicant: JSR CORP
Inventor: WANG YONG , KOBAYASHI EIICHI , MIYAJI MASAAKI , NUMATA JUN , SHIMOKAWA TSUTOMU
IPC: G03F7/028 , C07D207/46 , C07D209/76 , G03F7/004 , G03F7/038 , G03F7/039 , C07D209/48
Abstract: An N-sulfonyloxyimide compound having the formula (1): wherein X represents a single bond or a double bond, Y and Z represent a hydrogen atom or others and may combine to form a cyclic structure; and R is a group having the formula (2): wherein X represents an organic group having an ester linkage, R represents an alkyl group or an alkoxyl group; and m is an integer of 1 to 11 and n is an integer of 0 to 10, satisfying m + n ≤ 11; and chemically amplified positive and negative radiation-sensitive resin compositions using the compound are provided. The N-sulfonyloxyimide compound is a good radiation-sensitive acid-generating agent, has no problem of volatilization or side reaction, can keep dark reaction from taking place during the storage. The compound is useful as a component of radiation-sensitive chemically amplified resists.
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公开(公告)号:AU8015701A
公开(公告)日:2002-03-13
申请号:AU8015701
申请日:2001-08-24
Applicant: JSR CORP
Inventor: NISHIMURA ISAO , BESSHO NOBUO , KUMANO ATSUSHI , SHIMOKAWA TSUTOMU , YAMADA KENJI
IPC: C08L67/00 , C08L69/00 , C08L83/14 , G02B1/04 , G02B5/18 , G02B6/124 , G03F7/00 , G03F7/004 , G03F7/039 , G03F7/075 , G03F7/36 , C08L101/00 , G02B3/00 , G02B6/12 , G03H1/02
Abstract: A radiation sensitive refractive index changing composition comprising (A) a decomposable compound, (B) a non-decomposable compound having a lower refractive index than the decomposable compound (A), (C) a radiation sensitive decomposer and (D) a stabilizer. By exposing the composition to radiation through a pattern mask, the above components (C) and (A) of an exposed portion are decomposed and a refractive index difference is made between the exposed portion and unexposed portion, thereby forming a pattern having different refractive indices.
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公开(公告)号:DE60018350T2
公开(公告)日:2006-07-06
申请号:DE60018350
申请日:2000-11-08
Applicant: JSR CORP
Inventor: WANG YONG , KOBAYASHI EIICHI , MIYAJI MASAAKI , NUMATA JUN , SHIMOKAWA TSUTOMU
IPC: C07D209/48 , G03F7/028 , C07D207/46 , C07D209/76 , G03F7/004 , G03F7/038 , G03F7/039
Abstract: An N-sulfonyloxyimide compound having the formula (1): wherein X represents a single bond or a double bond, Y and Z represent a hydrogen atom or others and may combine to form a cyclic structure; and R is a group having the formula (2): wherein X represents an organic group having an ester linkage, R represents an alkyl group or an alkoxyl group; and m is an integer of 1 to 11 and n is an integer of 0 to 10, satisfying m + n ≤ 11; and chemically amplified positive and negative radiation-sensitive resin compositions using the compound are provided. The N-sulfonyloxyimide compound is a good radiation-sensitive acid-generating agent, has no problem of volatilization or side reaction, can keep dark reaction from taking place during the storage. The compound is useful as a component of radiation-sensitive chemically amplified resists.
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公开(公告)号:DE60105523D1
公开(公告)日:2004-10-21
申请号:DE60105523
申请日:2001-11-13
Applicant: JSR CORP
Inventor: KAWAGUCHI KAZUO , TANAKA MASATO , SHIMOKAWA TSUTOMU
Abstract: An anti-reflection coating-forming composition is provided. This composition includes a polymer and a solvent. The polymer has a structural unit represented by the formula (1): wherein R1 is a monovalent atom other than a hydrogen atom or a monovalent group, and n is an integer of 0-4, provided that when n is an integer of 2-4, a plural number of R1's are the same or different; R2 and R3 are each a monovalent atom or group; and X is a bivalent group. The anti-reflection coating formed from this composition has a high antireflective effect, does not generate intermixing with a resist film, and enables a good resist pattern profile excellent in resolution and precision in cooperation with a positive or negative resist.
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公开(公告)号:CA2431358A1
公开(公告)日:2002-06-20
申请号:CA2431358
申请日:2001-12-06
Applicant: JSR CORP
Inventor: SHIMOKAWA TSUTOMU , NISHIMURA ISAO , YAMADA KENJI , BESSHO NOBUO , KUMANO ATSUSHI
Abstract: A radiation-sensitive composition changing in refractive index which compris es (A) a decomposable compound, (B) a nondecomposable compound having a higher refractive index than the decomposable compound (A), (C) a radiation-sensiti ve decomposer, and (D) a stabilizer. When the composition is irradiated with a radiation through a pattern mask, the ingredients (C) and (A) in the irradiated areas decompose to cause a difference in refractive index between the irradiated areas and the unirradiated areas. Thus, a pattern having different refractive indexes is formed.
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公开(公告)号:AT315245T
公开(公告)日:2006-02-15
申请号:AT00120000
申请日:2000-09-14
Applicant: JSR CORP
Inventor: DOUKI KATSUJI , MURATA KIYOSHI , ISHII HIROYUKI , KAJITA TORU , SHIMOKAWA TSUTOMU
Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.
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公开(公告)号:AU2001280157B2
公开(公告)日:2005-08-11
申请号:AU2001280157
申请日:2001-08-24
Applicant: JSR CORP
Inventor: SHIMOKAWA TSUTOMU , KUMANO ATSUSHI , BESSHO NOBUO , NISHIMURA ISAO , YAMADA KENJI
IPC: C08L67/00 , C08L69/00 , C08L83/14 , G02B1/04 , G02B5/18 , G02B6/124 , G03F7/00 , G03F7/004 , G03F7/039 , G03F7/075 , G03F007/004 , G03H001/02 , G02B006/12 , G02B005/18 , G02B003/00 , C08L101/00 , C08L083/14 , G03F007/36
Abstract: A radiation sensitive refractive index changing composition comprising (A) a decomposable compound, (B) a non-decomposable compound having a lower refractive index than the decomposable compound (A), (C) a radiation sensitive decomposer and (D) a stabilizer. By exposing the composition to radiation through a pattern mask, the above components (C) and (A) of an exposed portion are decomposed and a refractive index difference is made between the exposed portion and unexposed portion, thereby forming a pattern having different refractive indices.
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