Abstract:
PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a novel radiation sensitive resin composition having high transparency to radiation, excellent basic physical properties for a resist pattern such as in sensitivity, resolution, and pattern shapes, without causing development defects during fine machining, to manufacture semiconductor elements at a high yield. SOLUTION: The radiation-sensitive resin compositions comprises (A) a resin containing an acid dissociable group obtained by the open ring polymerization of the norbornene derivative having a structure shown by the following general formula (1), and (B) a radiation-sensitive acid generator. In the general formula (1), R 1 represents a hydrogen atom and a univalent acid dissociation group, X 1 a low-grade fluorinated alkyl group, and R 2 a hydrogen atom, an alkyl group or a fluorinated alkyl group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation and useful as a chemically amplified resist excellent in sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin typified by a copolymer of 2-methyl-2-adamantyl methacrylate, 3-hydroxy-1- adamantyl methacrylate and a methacrylic ester of formula (1), (B) a radiation- sensitive acid generator typified by triphenylsulfonium nonafluoro-n- butanesulfonate or 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium perfluoro-n- octanesulfonate and (C) a solvent. Preferably the solvent (C) includes at least one selected from the group comprising propylene glycol monomethyl ether acetate, 2-heptanone and cyclohexanone. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation, excellent in basic physical properties as a resist, such as sensitivity, resolution and pattern shape, and useful particularly as a chemically amplified resist excellent in focus latitude. SOLUTION: The radiation-sensitive resin composition comprises (A) a mixture of alkali-insoluble or slightly alkali-soluble resins having separate repeating units protected with acid-dissociating protective groups and typified by repeating units derived from 2-methyl-2-adamantyl (meth)acrylate, 1-ethylcyclohexyl (meth)acrylate, etc., wherein the acid-dissociating protective group of at least one of the resins is different from that of the other, and (B) a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a composition having high transparency for radiation at short wavelengths, excellent solubility with a developer and excellent sensitivity, pattern profile and etching resistance. SOLUTION: The radiation-sensitive resin composition contains a resin having a functional group which increases solubility with an alkali by the effect of an acid, and a radiation-sensitive acid generating agent. The resin has a repeating unit expressed by formula (1). In formula (1), R independently represents a hydrogen atom, a 1-4C alkyl group or a 1-4C perfluoroalkyl group, R 1 represents a hydrocarbon group or an oxygen-containing hydrocarbon group, n is 0 or 1 and m is 1 or 2. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a new acid-dissociating group-containing resin and a radiation-sensitive resin composition having high transparency to a radiation, satisfying basic performances required by a resist, such as sensitivity, resolution, dry etching resistance and pattern shape, excellent in adhesiveness to a substrate, causing no development defect in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The acid-dissociating group-containing resin is alkali-insoluble or slightly alkali-soluble, becomes readily alkali-soluble by the action of an acid and contains a repeating unit containing an ether bond in the principal chain. The radiation-sensitive resin composition comprises the acid-dissociating group-containing resin and a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition useful as a chemically amplified resist having high transmittance of radiation and excelling in sensitivity, resolution, dry etching resistance and pattern profile. SOLUTION: The radiation-sensitive resin composition comprises (A) resin having at least two recurring units selected out of recurring units derived from (meta) acrylic ester having a specific alicyclic hydrocarbon group, in the total amount of 5-70 mol% but each in the amount of 1-49 mol%, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a (meth)acrylic polymer high in transparency to radiation, excellent in basic properties as a resist such as sensitivity, resolution, dry etching resistance, pattern form, etc. especially excellent in the solubility to a resist solvent, and suitable for a radiation-sensitive resin compound which reduces the roughness on a pattern sidewall after developing. SOLUTION: This (meth)acrylic polymer contains a repeating unit represented by formula (1) wherein R represents hydrogen or a methyl group, X represents a single bond or a 1-3C divalent organic group, Y represents a mutually independent single bond or a 1-3C divalent organic group, and R 1 represents a mutually independent hydrogen atom, a hydroxy group, a cyano group, or a -COOR 3 group. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, having excellent sensitivity, resolution, dry etching resistance, pattern shape, etc., and having small temperature dependence in heating after exposure. SOLUTION: The radiation sensitive resin composition contains (A) a resin comprising a copolymer of (meth)acrylic esters having an acid dissociable group- containing alicyclic structure represented by 5-t-butoxycarbonylnorbornyl (meth) acrylate and 8-t-butoxycarbonyltetracyclododecane (meth)acrylate and (meth) acrylic esters having a lactone-containing heterocyclic structure typified by compounds of formula (1) and (B) a radiation sensitive acid generating agent represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n- octanesulfonate, 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n- butanesulfonate or the like.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive composition being effectively responsive to various types of radiations, having excellent sensitivity and resolution, and also having excellent long-term shelf stability and useful as a positive type chemical amplification type multilayer resist. SOLUTION: The positive type radiation sensitive resin composition for the upper layer resist of a multilayer resist contains (A) a low molecular compound obtained by preparing a compound having at least one amino group with one or two hydrogen atoms combining with a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of the hydrogen atoms of the amino group, (B) a radiation sensitive acid generating agent and (C) an alkali- insoluble or slightly alkali-soluble silicon-containing resin protected with an acid dissociable group and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.