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    RADIATION-SENSITIVE RESIN COMPOSITION
    2.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：JP2003241383A

    公开(公告)日：2003-08-27

    申请号：JP2002046520

    申请日：2002-02-22

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  HOSHI MICHIAKI ,  SOYANO AKIMASA ,  KAJITA TORU ,  ALLEN ROBERT D ,  VARANASI PUSHKARA RAO

    IPC: G03F7/039 ,  C08F220/26 ,  C08F220/34 ,  C08F220/38 ,  C08F222/06 ,  C08F232/08 ,  G03F7/004 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in contrast, capable of forming a fine resist pattern with a high degree of accuracy and excellent also in transparency to a radiation, sensitivity and resolution. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin comprising an acid-dissociable group-containing norbornene compound typified by 5-[(1-methylcyclohexyl)oxycarbonyl]norbornene or 5-(2-methyl-1- adamantyloxycarbonyl)norbornene and maleic anhydride, (B) a radiation-sensitive acid generator and (C) a compound typified by a di-t-butyl 1,3- adamantanedicarboxylate or 2,5-dimethyl-2,5-di(1-adamantylcarbonyloxy)hexane. Preferably the resin (A) further comprises a polar group-containing alicyclic ester of (meth)acrylic acid typified by 3-hydroxy-1-adamantyl (meth)acrylate. COPYRIGHT: (C)2003,JPO

    RADIATION SENSITIVE RESIN COMPOSITION
    3.
    发明专利
    RADIATION SENSITIVE RESIN COMPOSITION 失效

    公开(公告)号：JP2002072484A

    公开(公告)日：2002-03-12

    申请号：JP2001108824

    申请日：2001-04-06

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  YAMAHARA NOBORU ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU ,  ITO HIROSHI

    IPC: C08K5/00 ,  C08L33/06 ,  C08L35/00 ,  C08L45/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.

    6.
    发明专利
    未知

    公开(公告)号：DE69728366T2

    公开(公告)日：2005-02-24

    申请号：DE69728366

    申请日：1997-12-12

    Applicant: JSR CORP

    Inventor： SUWA MITSUHITO ,  IWASAWA HARUO ,  KAJITA TORU ,  IWANAGA SHIN-ICHIRO

    IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039

    Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.

    Radiation-sensitive resin composition
    8.
    发明专利
    Radiation-sensitive resin composition 未知

    公开(公告)号：SG125883A1

    公开(公告)日：2006-10-30

    申请号：SG200004850

    申请日：2000-09-16

    Applicant: JSR CORP

    Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

    IPC: G03F7/027 ,  G03F7/004 ,  G03F7/039

    Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

    9.
    发明专利
    未知

    公开(公告)号：DE60025297T2

    公开(公告)日：2006-08-17

    申请号：DE60025297

    申请日：2000-09-14

    Applicant: JSR CORP

    Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

    IPC: G03F7/027 ,  G03F7/039 ,  G03F7/004

    Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

    10.
    发明专利
    未知

    公开(公告)号：DE60025297D1

    公开(公告)日：2006-03-30

    申请号：DE60025297

    申请日：2000-09-14

    Applicant: JSR CORP

    Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

    IPC: G03F7/027 ,  G03F7/039 ,  G03F7/004

    Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

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