公开(公告)号：GB2581291B

公开(公告)日：2022-11-23

申请号：GB202006022

申请日：2018-09-13

Applicant: IBM

Inventor： YUKSEL TEMIZ ,  EMMANUEL DELAMARCHE ,  SUFI ZAFAR

IPC: B01L3/00

Abstract: The invention is notably directed to a microfluidic device. The device comprises a substrate with a microchannel formed as a groove on a main surface of the substrate. The device further comprises one or more conduits extending parallel to the main surface of the substrate, and from a lateral surface of the substrate up to a lateral wall of the microchannel. The one or more conduits are configured so as to allow insertion of one or more electrodes therein, respectively, and such that an end of each of the one or more electrodes can reach into the microchannel. The invention is further directed to related sets of components, which include the above microfluidic device, as well as a housing, with electronics, and, possibly, a porous support (e.g., a membrane) and a cap. Biosensing applications are notably contemplated. The invention is further directed to methods of operating a microfluidic device.

公开(公告)号：IL295391A

公开(公告)日：2022-10-01

申请号：IL29539122

申请日：2022-08-04

Applicant: IBM ,  ROBERT DEAN LOVCHIK ,  JONAS WEISS ,  YUKSEL TEMIZ ,  EMMANUEL DELAMARCHE

Inventor： ROBERT DEAN LOVCHIK ,  JONAS WEISS ,  YUKSEL TEMIZ ,  EMMANUEL DELAMARCHE

IPC: G06K19/06 ,  G06V20/56 ,  G06V20/59 ,  G06V40/16

Abstract: Technology for managing objects. A method is applied to a set of objects, for example, in view of commissioning such objects. The method includes patterning a surface of each object of a set of objects to be managed. The patterning is accomplished by using hard particles to make indentations in a surface of each object of the set of object, with the pattern formed on each object being a unique physical fingerprint that can be used to identify the object when performing various manage method(s) on the objects.

公开(公告)号：GB2558839B

公开(公告)日：2021-04-14

申请号：GB201807075

申请日：2016-10-13

Applicant: IBM

Inventor： EMMANUEL DELAMARCHE ,  YUKSEL TEMIZ

IPC: B01L3/00 ,  G01F1/56 ,  G01F1/64 ,  G01N27/22

Abstract: A microfluidic chip comprising a microchannel fillable with a liquid, the microchannel comprises a pair of electrodes, and a liquid flow path defined between the electrodes, wherein each of the electrodes extends along the flow path and parallel to a direction of a liquid filling the microchannel, in operation, and an electrical circuitry connected to each of the electrodes and configured to continuously measure, via the electrodes, a capacitance of the electrodes being wet by a liquid continuously filling the flow path, as a function of time, in operation.

公开(公告)号：GB2558839A

公开(公告)日：2018-07-18

申请号：GB201807075

申请日：2016-10-13

Applicant: IBM

Inventor： EMMANUEL DELAMARCHE ,  YUKSEL TEMIZ

IPC: B01L3/00 ,  G01N27/22

Abstract: A microfluidic chip (10) comprising a microchannel (11,11a) fillable with a liquid (5), the microchannel (11,11a) comprises a pair of electrodes (21,22,21a,22a), and a liquid flow path (12) defined between the electrodes (21,22,21a,22a), wherein each of the electrodes (21,22,21a,22a) extends along the flow path (12) and parallel to a direction of a liquid (5) filling the microchannel (11,11a), in operation, and an electrical circuitry connected to each of the electrodes (21,22,21a,22a) and configured to continuously measure, via the electrodes (21,22,21a,22a), a capacitance of the electrodes (21,22,21a,22a) being wet by a liquid (5) continuously filling the flow path (12), as a function of time, in operation.

公开(公告)号：GB2548941A

公开(公告)日：2017-10-04

申请号：GB201617833

申请日：2015-03-04

Applicant: IBM

Inventor： EMMANUEL DELAMARCHE ,  YUKSEL TEMIZ

IPC: B01L3/00 ,  G01N33/53 ,  G01N33/543 ,  G01N33/554 ,  H01L21/00

Abstract: A microfluidic chip (100) comprises a layer (10, 60) with an array (30) of bead trapping cavities (20) provided in that layer (10, 60), wherein each of the cavities (20) has a conic shape, defined by one or more lateral walls (21-24) that are, each, hydrophilic, and wherein each of the cavities (20) extends as a blind hole in the thickness of said layer (10, 60). Methods of fabrication of such a chip are further provided.