公开(公告)号：WO0211506A3

公开(公告)日：2002-04-04

申请号：PCT/US0124477

申请日：2001-08-02

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  RAISZADEH FARHAD

IPC: G06F1/18 ,  H01L23/427 ,  H01R12/16 ,  H05K1/02 ,  H05K3/36 ,  H05K7/20

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0263 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.

Abstract translation: 公开了一种传热装置，其中蒸气室与销结构结合，销结构允许高导热冷却蒸气在销阵列的销内流动，从而将散热器的两个部件的效率最大化为一个单元。 在一个实施例中，传热装置包括导热腔室，该导热腔室具有第一导热腔室部分，该第一导热腔室部分具有可热连接至散热装置的基座; 第二导热腔室部分，其具有多个中空突出部，所述多个中空突出部远离第一导热腔室部分延伸并与第一导热腔室部分流体连通，其中所述导热腔室包括流体，所述流体在与所述散热装置热连通时可蒸发并且在热连通时可冷凝 与空心突起。

公开(公告)号：WO0133927A8

公开(公告)日：2003-10-23

申请号：PCT/US0029452

申请日：2000-10-24

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID

IPC: H05K1/11 ,  G06F1/18 ,  H01R4/64 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20 ,  H01R12/04

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/2036

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Abstract translation: 公开了一种封装电路组件和用于制造用于电力输送的封装电路组件的方法。 组件包括第一印刷电路板，第二印刷电路板和机械耦合器。 机械耦合器耦合在第一印刷电路板和第二印刷电路板之间并且设置在第一印刷电路板和第二印刷电路板之间。 机械耦合器在第一印刷电路板上的迹线和第二印刷电路板上的迹线之间提供实质的电连续性。

公开(公告)号：WO0165344B1

公开(公告)日：2002-06-27

申请号：PCT/US0105067

申请日：2001-02-16

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID ,  KASKADE JAMES HJERPE ,  HOGE CARL E

IPC: H05K3/34 ,  G06F1/18 ,  H01L23/32 ,  H01L23/427 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10

CPC classification number: H01L23/427 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract translation: 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：WO0165344A3

公开(公告)日：2002-04-25

申请号：PCT/US0105067

申请日：2001-02-16

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID ,  KASKADE JAMES HJERPE ,  HOGE CARL E

IPC: H05K3/34 ,  G06F1/18 ,  H01L23/32 ,  H01L23/427 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10

CPC classification number: H01L23/427 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.