11.
    发明专利
    未知

    公开(公告)号:DE10153497B4

    公开(公告)日:2006-04-06

    申请号:DE10153497

    申请日:2001-10-31

    Abstract: Method for reinforcing a structured photoresist comprising a polymer having anchor groups comprises applying a silicon compound having linker groups, where the anchor groups are iso(thio)cyanate groups and the linker groups are nucleophilic groups, or vice versa Method for reinforcing a structured photoresist comprises: (a) coating a substrate with a chemically reinforced photoresist comprising (i) a film-forming polymer having acid-labile groups that are cleaved with acid to form optionally protected anchor groups and groups that increase the solubility of the polymer in aqueous alkaline developers, (ii) a photochemical acid precursor and (iii) a solvent; (b) drying the resist to form a film; (c) structuring the film; (d) deprotecting the anchor groups if necessary; (e) applying a reinforcing agent comprising one or more silicon-containing groups and one or more linker groups, where the anchor groups are iso(thio)cyanate groups and the linker groups are nucleophilic groups, or vice versa, so that the anchor and linker groups react to form covalent bonds; and (f) removing excess reinforcing agent.

    Reinforcing a structured photoresist comprises reacting a polymer having iso(thio)cyanate groups with a silicon compound having nucleophilic groups, or vice versa

    公开(公告)号:DE10153497A1

    公开(公告)日:2003-06-05

    申请号:DE10153497

    申请日:2001-10-31

    Abstract: Method for reinforcing a structured photoresist comprising a polymer having anchor groups comprises applying a silicon compound having linker groups, where the anchor groups are iso(thio)cyanate groups and the linker groups are nucleophilic groups, or vice versa Method for reinforcing a structured photoresist comprises: (a) coating a substrate with a chemically reinforced photoresist comprising (i) a film-forming polymer having acid-labile groups that are cleaved with acid to form optionally protected anchor groups and groups that increase the solubility of the polymer in aqueous alkaline developers, (ii) a photochemical acid precursor and (iii) a solvent; (b) drying the resist to form a film; (c) structuring the film; (d) deprotecting the anchor groups if necessary; (e) applying a reinforcing agent comprising one or more silicon-containing groups and one or more linker groups, where the anchor groups are iso(thio)cyanate groups and the linker groups are nucleophilic groups, or vice versa, so that the anchor and linker groups react to form covalent bonds; and (f) removing excess reinforcing agent.

    A chemically strengthened resist useful for semiconductor microchips comprises a film forming polymer

    公开(公告)号:DE10131670A1

    公开(公告)日:2003-01-16

    申请号:DE10131670

    申请日:2001-06-29

    Abstract: A chemically strengthened resist comprises a film forming polymer, a photoacid and a solvent. The polymer comprises acid labile groups, free groups to make the polymer more soluble in aqueous alkalis, and primary polymer structural units derived from primary monomers, substituted by fluorine(s) and an anchor group for binding a strengthening agent, which optionally comprises a protecting group. An Independent claim is included for post-strengthening of resist structures comprising the steps: (1) application of the resist to a substrate; (2) drying of the resist; (3) exposure of the dried resist to give a resist having a latent image; (4) heating of the exposed resist to a first temperature at which the latent image is converted to a chemical profile and polymer polar groups are released; (5) development of the resist with an aqueous alkaline developer, where the chemical profile region which contains the polymer polar groups is dissolved from the substrate, and a structured resist is obtained; (6) optionally freeing of the anchor groups from the protected anchor groups; (7) application of a strengthening agent to the structured resist; and (8) washing off excess strengthening agent.

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