公开(公告)号：DE10006445C2

公开(公告)日：2002-03-28

申请号：DE10006445

申请日：2000-02-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS

IPC: H01L23/495 ,  H01L25/10 ,  H01L23/50

Abstract: The leadframe interposer is provided with an upset which is formed by shaping in a central region and enlarges the vertical dimension of the interposer there in such a way that, during the assembly of a housing stack of a plurality of semiconductor chips, the upset presses against a topside or underside of a chip housing in such a way that a compensating torque is exerted on the interposer, which prevents a possible strain or deformation when the leads are pressed onto the contact regions of the interposer. The contact regions are laterally offset with respect to one another.

公开(公告)号：DE102013111004A1

公开(公告)日：2014-04-17

申请号：DE102013111004

申请日：2013-10-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STEINKIRCHNER ERWIN ,  WOERZ ANDREAS

IPC: H01L23/544 ,  H01L21/027 ,  H01L21/66

Abstract: Eine Ausrichtungsmarke (304) kann Folgendes aufweisen: ein längliches Muster (342), das einen ersten Endabschnitt (344) und einen zweiten Endabschnitt (346) aufweist und einen zentralen Abschnitt (348), der zwischen dem ersten Endabschnitt (344) und dem zweiten Endabschnitt (346) angeordnet ist, wobei der erste Endabschnitt (344) und/oder der zweite Endabschnitt (346) eine größere Breite als der zentrale Abschnitt (348) aufweist.

公开(公告)号：DE50011642D1

公开(公告)日：2005-12-22

申请号：DE50011642

申请日：2000-05-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  VIDAL ULRICH ,  FERSTL KLEMENS

IPC: H01L21/60 ,  H01L23/495 ,  H01L25/065

Abstract: A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.

公开(公告)号：DE10106346A1

公开(公告)日：2002-09-12

申请号：DE10106346

申请日：2001-02-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/36 ,  H01L21/56 ,  H01L23/04

Abstract: An arrangement comprises an electronic component; a semiconductor chip (2); and a wiring plate (4) on which the electronic component lies in the assembled state. The surfaces of the electronic component facing away from the wiring plate are provided with a three-dimensional structure in the form of regularly arranged cooling elements made from injection molded plastic. An Independent claim is also included for a process for the production of the arrangement.

公开(公告)号：DE10012883A1

公开(公告)日：2001-09-27

申请号：DE10012883

申请日：2000-03-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAHR ANDREAS ,  WOERZ ANDREAS

IPC: H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01L23/28

Abstract: The method involves contacting the memory chips (1,2) with an external lead-frame (4,5). The memory chips are connected together by an internal lead-frame (6). Tape pieces are applied to the internal lead-frame during manufacture to hold the internal lead-frame in position relative to the memory chips. After application of the tape pieces, the internal lead-frame holder is removed by stamping and the internal lead-frame is held to the chips only by the tape pieces.

公开(公告)号：DE10006445A1

公开(公告)日：2001-08-23

申请号：DE10006445

申请日：2000-02-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS

IPC: H01L23/495 ,  H01L25/10 ,  H01L23/50

Abstract: The invention relates to a leadframe interposer provided with an upset which is formed by an elevated section in a middle area, and the vertical dimensions of the interposer are enlarged there so that when assembling a housing stack consisting of a number of semiconductor chips, the elevated section presses against an upper side or lower side of a chip housing thereby exerting a compensating turning moment onto the interposer which prevents a possible twisting or deformation from occurring when applying the connecting conductors to the laterally offset contact regions of the interposer.

公开(公告)号：DE102008028528A1

公开(公告)日：2009-01-08

申请号：DE102008028528

申请日：2008-06-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STEINKIRCHNER ERWIN ,  WOERZ ANDREAS

IPC: H01L21/312 ,  H01L21/32

Abstract: An apparatus includes a substrate and a photoresist material structure arranged adjacent to the substrate so that a cavity is formed between the substrate and the photoresist material structure. The cavity has an opening. The photoresist material structure includes a frame portion disposed on a main side of the substrate and a cap portion spanning over a part of the main side of the substrate at a distance to the main side. The cap portion is formed in the first photoresist layer and the frame portion is formed in the second photoresist layer.

公开(公告)号：DE10325863A1

公开(公告)日：2005-01-05

申请号：DE10325863

申请日：2003-06-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  LINDNER CHRISTINE

IPC: B60R16/02 ,  B81B1/00 ,  G06K9/00 ,  G06K19/077 ,  H01L21/56 ,  H01L23/31 ,  H01L23/50

Abstract: The invention relates to, inter alia, a method for producing a fingerprint sensor comprising a dirt-repellent protective layer. In order to apply the protective layer, a starting material therefor is injected into a gap between a substrate of the sensor and a pressure plate, cf. method step (112). In this way, highly dirt-repellent protective layers can be structured without having recourse to photographic technology and abrasive processes.

公开(公告)号：DE10044148A1

公开(公告)日：2002-03-21

申请号：DE10044148

申请日：2000-09-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WENNEMUTH INGO

IPC: H01L25/18 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L23/58 ,  H01L23/525 ,  H01L23/538

Abstract: Each structural block (1-n) has a chip (C1-Cn). Each chip is mounted on an interleaved surface (Z1-Zn) in a stack. The interleaved surfaces have identical layouts. Chip selector circuits (A1-An) on the chips capable of adjusting irreversibly by means of contact surfaces (CS1-CSn,CS11-CSnn) enable an irreversible allocation of the contact surfaces to the interleaved surfaces.

公开(公告)号：DE10016380A1

公开(公告)日：2001-10-11

申请号：DE10016380

申请日：2000-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  WOERZ ANDREAS

IPC: H01L23/552 ,  H01L23/31 ,  H05K9/00

Abstract: The invention relates to a housing for an electronic component, comprising filling materials which are provided with a magnetically conductive coating. Said filling materials act as a shield for the electronic component.