公开(公告)号：WO0188979A3

公开(公告)日：2002-06-20

申请号：PCT/DE0101522

申请日：2001-04-20

Applicant: INFINEON TECHNOLOGIES AG ,  HAUSER CHRISTIAN ,  MUENCH THOMAS ,  NEU ACHIM ,  REISS MARTIN ,  WINDERL JOHANN

Inventor： HAUSER CHRISTIAN ,  MUENCH THOMAS ,  NEU ACHIM ,  REISS MARTIN ,  WINDERL JOHANN

IPC: H01L23/31

CPC classification number: H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The invention relates to a semi-conductor component, comprising a semi-conductor chip having contact pads on the first main surface area thereof. A wiring film is applied to the first main surface area, avoiding the contact pads. On the opposite side of the first main side of the semi-conductor chip, said wiring film has a solder stop mask which covers the conductors. Contact pads lying in at least one groove are wired to the adjacent ends of the conductors in order to connect the contact pads to the soldering contacts lying in the grooves of the solder stop mask. Each wire connection and the end of the conductor thereof is enveloped by a casting material. Said solder stop mask comprises at least one depression and one rise, enabling the casting material to be spread in a directed manner when applied to the semi-conductor component.

Abstract translation: 本发明提出的半导体装置从其中一个接触垫节约Umverdrahtungsfolie在应用于具有上侧远离覆盖阻焊掩模的导电迹线的半导体芯片侧的第一主面的第一主表面，其特征在于具有具有其第一主表面的接触焊盘的半导体芯片上， 用于连接焊盘连接到位于在焊锡掩模的凹部的焊料接触接触所述导体中的至少一个凹部由引线键合躺在接触垫与相邻的导体电缆端部，并且其中每条有线链路与用封装化合物相关Leiterzugende包围在一起。 在此，阻焊层具有至少一个凹部和/或至少一个凸起由当施加到半导体器件中的封装化合物的传播可以具体涉及。

公开(公告)号：DE10201782A1

公开(公告)日：2003-03-27

申请号：DE10201782

申请日：2002-01-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN ,  HAALBOOM THOMAS ,  REIS MARTIN

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/50 ,  H01L21/60

Abstract: The chip (4) is mounted on a wiring panel (6) with track layers (61, 62). It is connected via bonding wires (8) to contact areas (64). The tracks (63) are connected by through-contacts (vias). These are arranged at a surrounding edge (68) of a bond channel (67), and at least over sections, form the edge of the bond channel. An Independent claim is included for the method of making the corresponding component.

公开(公告)号：DE10106346A1

公开(公告)日：2002-09-12

申请号：DE10106346

申请日：2001-02-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/36 ,  H01L21/56 ,  H01L23/04

Abstract: An arrangement comprises an electronic component; a semiconductor chip (2); and a wiring plate (4) on which the electronic component lies in the assembled state. The surfaces of the electronic component facing away from the wiring plate are provided with a three-dimensional structure in the form of regularly arranged cooling elements made from injection molded plastic. An Independent claim is also included for a process for the production of the arrangement.

公开(公告)号：DE10133571B4

公开(公告)日：2005-12-22

申请号：DE10133571

申请日：2001-07-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN ,  HAUSER CHRISTIAN

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/14 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10134648A1

公开(公告)日：2002-10-10

申请号：DE10134648

申请日：2001-07-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN ,  HAUSER CHRISTIAN

IPC: H01L25/10 ,  H01L25/065 ,  H01L23/50

Abstract: The device has a stack of electronic components, each having a wiring plate (10) mounted on a semiconductor chip (4), mechanically and electrically coupled together and to a carrier plate (34) via pins (32) extending perpendicular to the major surfaces of the electronic components. An Independent claim for a method for manufacture of a device with at least 2 stacked electronic components is also included.

公开(公告)号：DE10107399A1

公开(公告)日：2002-09-12

申请号：DE10107399

申请日：2001-02-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  NEUMAYER MARTIN

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28 ,  H01L23/50 ,  H01L21/56 ,  H01L21/301

Abstract: Device comprises: an electronic component; a mechanically and electrically connected wiring plate (4) with contact connections (6); and a flexible layer around the peripheral edges of the rear side (21) of the electronic component facing away from the wiring plate. An Independent claim is also included for a process for the production of the device. Preferred Features: The flexible layer is fixed to the edge of the wiring plate protruding over the electronic component. The layer has a recess (12) which exposes the rear side of the electronic component up to a peripheral edge along the edge of the rear side.

公开(公告)号：DE10024376A1

公开(公告)日：2001-12-06

申请号：DE10024376

申请日：2000-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  HAUSER CHRISTIAN ,  REISS MARTIN ,  MUENCH THOMAS ,  NEU ACHIM

IPC: H01L23/31 ,  H01L23/16 ,  H01L21/00 ,  H01L23/50 ,  H01L21/56

Abstract: The invention relates to a semi-conductor component, comprising a semi-conductor chip having contact pads on the first main surface area thereof. A wiring film is applied to the first main surface area, avoiding the contact pads. On the opposite side of the first main side of the semi-conductor chip, said wiring film has a solder stop mask which covers the conductors. Contact pads lying in at least one groove are wired to the adjacent ends of the conductors in order to connect the contact pads to the soldering contacts lying in the grooves of the solder stop mask. Each wire connection and the end of the conductor thereof is enveloped by a casting material. Said solder stop mask comprises at least one depression and one rise, enabling the casting material to be spread in a directed manner when applied to the semi-conductor component.

公开(公告)号：DE19962628A1

公开(公告)日：2001-07-05

申请号：DE19962628

申请日：1999-12-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN ,  MUENCH THOMAS

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/12 ,  H01L23/50

Abstract: A semiconductor component has first and second main sides (8,9) and includes a semiconductor chip (1) on the first main side (8), a wiring foil on the second main side (9) consisting of conductor paths (2) with connection surfaces (13), and a foil mask (3) having a number of recesses (10), in each of which is mounted a solder ball (4) away from the second main surface (9), and is electrically connected to one of the connection surfaces (13). The arrangement also includes a housing encapsulation (6) and a bracing element (7), the latter being mounted on the second main side (9).

公开(公告)号：DE19944518A1

公开(公告)日：2000-12-21

申请号：DE19944518

申请日：1999-09-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN

IPC: H01L21/60 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

Abstract: Soldering an integrated circuit or integrated circuit housing onto a substrate, especially a circuit board having a conducting pathway (3) comprises using a lacquer or a film mask with non-circular openings. Preferred Features: The openings have the basic shape of a circle with run-off regions (15a) from the periphery of the circle.

公开(公告)号：DE19916071B4

公开(公告)日：2005-10-13

申请号：DE19916071

申请日：1999-04-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： POHL JENS ,  WUTZ OLIVER ,  WINDERL JOHANN

IPC: H01L21/78

Abstract: Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.