公开(公告)号：JP2002164499A

公开(公告)日：2002-06-07

申请号：JP2001270931

申请日：2001-09-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WENNEMUTH INGO

IPC: H01L25/18 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To significantly reduce design cost for stack interfaces, to enable to simply assure addressing of each component and to provide a method for manufacturing an electronic unit by improving the electronic unit having stacked components. SOLUTION: The electronic unit has the stacked components wherein each component has a chip (C1-Cn) mounted on the stack interface (Z1-Zn), the stack interfaces have the same layout, chip selection circuits (A1-An) which are non- reversibly adjustable are formed on the chips via contact regions (CS1-CSn and CS11-CSnn) and the contact regions (CS1-CSn and CS11-CSnn) are allocated to the stack interfaces by the chip select circuits.

公开(公告)号：WO2005081316A3

公开(公告)日：2006-01-12

申请号：PCT/DE2005000302

申请日：2005-02-22

Applicant: INFINEON TECHNOLOGIES AG ,  HETZEL WOLFGANG ,  THOMAS JOCHEN ,  WEITZ PETER ,  WENNEMUTH INGO

Inventor： HETZEL WOLFGANG ,  THOMAS JOCHEN ,  WEITZ PETER ,  WENNEMUTH INGO

IPC: H01L23/31 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a semiconductor component (10) comprising an interposer substrate (1) and provided in the form of a stack element of a semiconductor component stack (25). The interposer substrate (1) comprises, on one of the interposer substrate sides (2, 4), a semiconductor chip that is protected in its lateral edges (22) by a plastic compound (12). An interposer structure (3) is placed on the interposer side (2, 4) opposite the semiconductor chip (6) and is partially covered by a plastic compound (12). Edge areas (11) of the interposer substrate (1) remain free from any plastic compound (12) and have, on both interposer sides (2, 4), outer lands (7) which are connected to one another by via holes (8).

Abstract translation: 本发明涉及具有内插基板（1）作为半导体元件堆（25）的堆叠元件的半导体器件（10）。 内插基板（1）具有半导体芯片，其通过塑性体（12）在其侧边缘（22）保护的Umverdrahtungssubstratseiten（2,4）中的一个。 设置在半导体芯片（6）Umverdrahtungsseite相对上（2,4）是一个再布线结构（3），其部分地由塑性体（12）覆盖。 内插基板（1）的边缘部分（11）保持自由的任何塑料材料（12）的和具有两个Umverdrahtungsseiten（2,4）的外部接触垫（7），其经由通过触点电连接（8）。

公开(公告)号：WO2005022588A2

公开(公告)日：2005-03-10

申请号：PCT/DE2004001853

申请日：2004-08-19

Applicant: INFINEON TECHNOLOGIES AG ,  GOSPODINOVA-DALTCHEVA MINKA ,  HUEBERT HARRY ,  SUBRAYA RAJESH ,  THOMAS JOCHEN ,  WENNEMUTH INGO

Inventor： GOSPODINOVA-DALTCHEVA MINKA ,  HUEBERT HARRY ,  SUBRAYA RAJESH ,  THOMAS JOCHEN ,  WENNEMUTH INGO

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065 ,  H01L

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The invention relates to a semiconductor component comprising a plastic housing (41), at least one semiconductor chip (1), and a rewiring layer (8). The rewiring layer (8) is provided with an insulating level (9) and a rewiring level (10). The rewiring level (10) encompasses alternately disposed parallel signal conductors (12) and ground or power supply conductors (13) or exclusively parallel signal conductors (12). In the latter case, a electrically conducting metallic layer that can be connected to ground potential or power supply potential is additionally provided to close the rewiring layer or in the form of a coating.

Abstract translation: 本发明涉及一种具有塑料外壳（41），至少一个半导体芯片（1）和重新布线层（8）的半导体器件。 再布线层（8）具有绝缘层（9）和再布线层（10）。 重新布线层（10）彼此平行并且交替地布置信号导体迹线（12）和接地或供电导体迹线（13）或者仅彼此平行布置的信号导体迹线（12）。 在后一种情况下，可以连接到接地或供电电位的导电金属层作为再布线层的终端或以覆盖层的形式额外提供。

公开(公告)号：DE102004031889A1

公开(公告)日：2006-01-26

申请号：DE102004031889

申请日：2004-06-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： CARMONA MANUEL ,  LEGEN ANTON ,  WENNEMUTH INGO

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/427

公开(公告)号：DE102004031888A1

公开(公告)日：2005-10-20

申请号：DE102004031888

申请日：2004-06-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： CARMONA MANUEL ,  LEGEN ANTON ,  WENNEMUTH INGO

IPC: H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34

Abstract: Semiconductor component with outer contacts (1) in the form of solder beads (2) including a housing with a semiconductor chip (3) and a wiring substrate (8), with the chip on its upper side and the solder beads on its lower side, where at least one of the solder beads is fixed to a flexible membrane (3), which covers an opening (4) with a suspended membrane region (5) and the flat extent of membrane region (5) is greater than the diameter of the solder bead fixed on it. An independent claim is included for production of the component as described above.

公开(公告)号：DE10016380C2

公开(公告)日：2002-01-24

申请号：DE10016380

申请日：2000-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  WOERZ ANDREAS

IPC: H01L23/552 ,  H01L23/31 ,  H05K9/00

公开(公告)号：DE10339770A1

公开(公告)日：2005-03-31

申请号：DE10339770

申请日：2003-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA-DALTCHEVA MINKA ,  KUZMENKA MAKSIM

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/50

Abstract: The FBGA (fine pitch ball grid array) connection device (5) is for face-down integrated circuit chips (6). It has balls of solder (14) acting as electrical contacts on the underside of the chip. The balls are in contact with through-connectors (13) under a copper layer (18) and the chip. The connectors extend through two substrate plates (1,2). A central bonding channel extends through holes in the substrate. It consists of a stepped diameter cast mass of insulating material (16) containing bridging wires (10). The chip is encapsulated in a molding compound (17).

公开(公告)号：DE10137619A1

公开(公告)日：2003-02-27

申请号：DE10137619

申请日：2001-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  STRUTZ VOLKER ,  WENNEMUTH INGO

IPC: H01L23/10 ,  H01L25/065 ,  H01L23/04

Abstract: A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component ( 4 ) to be protected occurs.

公开(公告)号：DE10120408A1

公开(公告)日：2002-10-31

申请号：DE10120408

申请日：2001-04-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  HEDLER HARRY

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  H01L21/60 ,  H01L21/78

Abstract: An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of structured conductive tracks for providing an electrical connection from the active front face to the passive rear face. An electronic assembly formed of stacked semiconductor chips, and a method for producing the electronic component and the electronic assembly are also provided.

公开(公告)号：DE10101875A1

公开(公告)日：2002-08-01

申请号：DE10101875

申请日：2001-01-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  GEBAUER UTA

IPC: H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  G11C5/02 ,  H01L21/60 ,  H01L23/538