公开(公告)号：JP2002164499A

公开(公告)日：2002-06-07

申请号：JP2001270931

申请日：2001-09-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WENNEMUTH INGO

IPC: H01L25/18 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To significantly reduce design cost for stack interfaces, to enable to simply assure addressing of each component and to provide a method for manufacturing an electronic unit by improving the electronic unit having stacked components. SOLUTION: The electronic unit has the stacked components wherein each component has a chip (C1-Cn) mounted on the stack interface (Z1-Zn), the stack interfaces have the same layout, chip selection circuits (A1-An) which are non- reversibly adjustable are formed on the chips via contact regions (CS1-CSn and CS11-CSnn) and the contact regions (CS1-CSn and CS11-CSnn) are allocated to the stack interfaces by the chip select circuits.

公开(公告)号：WO02099871A3

公开(公告)日：2003-03-06

申请号：PCT/DE0202044

申请日：2002-06-05

Applicant: INFINEON TECHNOLOGIES AG ,  WOERZ ANDREAS ,  ZEILER THOMAS

Inventor： WOERZ ANDREAS ,  ZEILER THOMAS

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a plastic housing (14) comprising several semiconductor chips (3) and a wiring modification plate (11), on which the semiconductor chips (3) are arranged, and to an injection moulding-mould for producing said plastic housing (14), in addition to an electronic component, which can be produced by the combination of the injection-moulding mould, wiring modification plate (11) and plastic housing (14). The invention also relates to a method, which uses the inventive wiring modification plate (11) and the two-part injection-moulding mould, to produce a plastic housing of this type (14) comprising several semiconductor chips (3) for several electronic components.

Abstract translation: 本发明涉及一种具有多个半导体芯片（3）的塑料外壳（14）和重新布线（11），在其上（3）被布置在半导体芯片，和一注射模具用于制造塑料壳体（14）和电子部件中，与所述辅助 注射模具，重新布线（11）和塑料外壳（14）的组合被产生。 此外，本发明涉及使用本发明的再布线（11）和两部分组成的注塑模的方法允许具有多个半导体芯片（3），用于多个电子部件的例如塑料壳体的制造（14）。

公开(公告)号：DE10127009A1

公开(公告)日：2002-12-12

申请号：DE10127009

申请日：2001-06-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  ZEILER THOMAS

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/50 ,  H01L25/065

Abstract: Plastic housing comprises semiconductor chips (3) arranged in lines (1) and gaps (2). The chips have active upper sides (4), passive rear sides (5) and edge sides (6, 7, 8, 9). The active upper sides of the chips are arranged on an upper side of a wiring plate (11) which has bonding channels (12) to their lower side (13). Plastic housing comprises semiconductor chips (3) arranged in lines (1) and gaps (2). The chips have active upper sides (4), passive rear sides (5) and edge sides (6, 7, 8, 9). The active upper sides of the chips are arranged on an upper side of a wiring plate (11) which has bonding channels (12) to their lower side (13). The plastic housing covers the upper side of the wiring plate and the edge sides of the chip. The housing has a lower side consisting of the lower side of the wiring plate with external contact regions and strip-like bond channel covers (18) for the bonding channels. Independent claims are included for: (1) a wiring plate; (2) an electronic component; (3) an injection mold for producing the plastic housing; (4) and a process for the production of the plastic housing.

公开(公告)号：DE102008028528B4

公开(公告)日：2014-02-27

申请号：DE102008028528

申请日：2008-06-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STEINKIRCHNER ERWIN ,  WOERZ ANDREAS

IPC: H01L21/312 ,  B81C1/00 ,  G03F7/00 ,  H01L21/32

Abstract: Vorrichtung, die folgende Merkmale aufweist: ein Substrat (13, 83) mit einer Hauptseite; eine Photoresistmaterialstruktur, die benachbart zu dem Substrat (13, 83) angeordnet ist, so dass ein Hohlraum (23, 91) zwischen dem Substrat (13, 83) und der Photoresistmaterialstruktur gebildet ist, wobei der Hohlraum (23, 91) mindestens eine Öffnung (25a, 89) in der Photoresistmaterialstruktur aufweist; wobei die Photoresistmaterialstruktur einen Rahmenabschnitt, der an der Hauptseite des Substrats (13, 83) angeordnet ist, und einen Abdeckungsabschnitt aufweist, der einen Teil der Hauptseite des Substrats (13, 83) in einem Abstand zu der Hauptseite überspannt und die mindestens eine Öffnung (25a, 89) aufweist; und wobei die Photoresistmaterialstruktur aus einer ersten Photoresistschicht (15) und einer zweiten Photoresistschicht (19), die in direktem Kontakt zueinander stehen, gebildet ist, wobei der Abdeckungsabschnitt in der zweiten Photoresistschicht (19) gebildet ist und der Rahmenabschnitt in der ersten Photoresistschicht (15) gebildet ist und die erste Photoresistschicht (15) ein erstes Photoresistmaterial aufweist und die zweite Photoresistschicht (19) ein zweites Photoresistmaterial aufweist, wobei das erste Photoresistmaterial ein negatives Resist ist, wobei das zweite Photoresistmaterial ein positives Resist ist und wobei das zweite Photoresistmaterial bei einer vordefinierten Wellenlänge einen höheren Absorptionskoeffizienten als das erste Photoresistmaterial aufweist.

公开(公告)号：DE10106346B4

公开(公告)日：2007-03-01

申请号：DE10106346

申请日：2001-02-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN

IPC: H01L23/36 ,  H01L21/56 ,  H01L23/04 ,  H01L23/31 ,  H01L23/367

公开(公告)号：DE10133571A1

公开(公告)日：2003-01-30

申请号：DE10133571

申请日：2001-07-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN ,  HAUSER CHRISTIAN

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/14 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10016380C2

公开(公告)日：2002-01-24

申请号：DE10016380

申请日：2000-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  WOERZ ANDREAS

IPC: H01L23/552 ,  H01L23/31 ,  H05K9/00

公开(公告)号：DE10133571B4

公开(公告)日：2005-12-22

申请号：DE10133571

申请日：2001-07-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN ,  HAUSER CHRISTIAN

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/14 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10134648A1

公开(公告)日：2002-10-10

申请号：DE10134648

申请日：2001-07-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN ,  HAUSER CHRISTIAN

IPC: H01L25/10 ,  H01L25/065 ,  H01L23/50

Abstract: The device has a stack of electronic components, each having a wiring plate (10) mounted on a semiconductor chip (4), mechanically and electrically coupled together and to a carrier plate (34) via pins (32) extending perpendicular to the major surfaces of the electronic components. An Independent claim for a method for manufacture of a device with at least 2 stacked electronic components is also included.

公开(公告)号：DE10104221A1

公开(公告)日：2002-04-18

申请号：DE10104221

申请日：2001-01-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WENNEMUTH INGO

IPC: H01L23/10 ,  H01L23/16 ,  H01L23/552 ,  H01L23/66 ,  H01L21/60 ,  H01L23/50

Abstract: A semiconductor component has at least one integrated circuit (1) a lead-frame (10) in which the integrated circuit (1) is placed on the main face of the leadframe to which it is electrically and mechanically connected. The first covering hood (20) on the first main face of the lead-frame (10) surrounds the integrated circuit, such that the covering hood (20) is mechanically joined to the leadframe (10).