公开(公告)号：DE10262102B4

公开(公告)日：2006-06-22

申请号：DE10262102

申请日：2002-06-25

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  ERB UWE ,  MCCREA JONATHAN ,  HIBBARD GLENN D ,  BROOKS IAIN ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS

IPC: C25D5/18

Abstract: A reinforcing metallic patch is electroplated to cover the degraded portion without covering the non-degraded portion of metallic workpiece, where the electrodeposited metal of metallic patch has an average grain size of 1000 nm or less. An independent claim is also included for process for in-situ electroforming structural reinforcing layer.

公开(公告)号：DE10228323A1

公开(公告)日：2004-01-29

申请号：DE10228323

申请日：2002-06-25

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  ERB UWE ,  MCCREA JONATHAN ,  HIBBARD GLENN D ,  BROOKS IAIN ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS

IPC: C25D5/02 ,  C25D5/06 ,  C25D5/18 ,  C25D7/04 ,  C25D15/02

Abstract: A reinforcing metallic patch is electroplated to cover the degraded portion without covering the non-degraded portion of metallic workpiece, where the electrodeposited metal of metallic patch has an average grain size of 1000 nm or less. An independent claim is also included for process for in-situ electroforming structural reinforcing layer.