公开(公告)号：WO2018004868A1

公开(公告)日：2018-01-04

申请号：PCT/US2017/033383

申请日：2017-05-18

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  OSTER, Sasha N. ,  DOGIAMIS, Georgios C. ,  SOUNART, Thomas L. ,  ELSHERBINI, Adel A. ,  LIFF, Shawna M. ,  SWAN, Johanna M.

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/22

Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.

Abstract translation: 本发明的实施例包括温度感测装置，该温度感测装置包括位于有机衬底的空腔附近的基底结构，耦合到基底结构的输入变换器和耦合到基底结构的输出变换器 基础结构。 输入变换器包括第一压电材料以产生响应于施加到输入变换器的输入信号而在基底结构上传输的振动。 输出变换器包括第二压电材料以接收振动并产生用于确定环境温度变化的输出信号。

公开(公告)号：EP4356424A1

公开(公告)日：2024-04-24

申请号：EP22825491.8

申请日：2022-03-29

Applicant: INTEL Corporation

Inventor： ALEKSOV, Aleksandar ,  KAMGAING, Telesphor ,  PRABHU GAUNKAR, Neelam ,  DOGIAMIS, Georgios C. ,  STRONG, Veronica

IPC: H01L23/498 ,  H01L23/492 ,  H01L23/15

CPC classification number: H01L23/13 ,  H01L23/473 ,  H01L23/3677 ,  H01L23/5384 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/15

公开(公告)号：EP3437189A1

公开(公告)日：2019-02-06

申请号：EP17776106.1

申请日：2017-02-13

Applicant: Intel Corporation

Inventor： NAIR, Vijay K. ,  EID, Feras ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  RAO, Valluri R. ,  SWAN, Johanna M.

IPC: H03H3/02 ,  H03H9/58 ,  H03H9/02 ,  H03H3/007

公开(公告)号：WO2019133018A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/069156

申请日：2017-12-30

Applicant: INTEL CORPORATION ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  SHOEMAKER, Kenneth ,  EWY, Erich N. ,  ELSHERBINI, Adel A.

Inventor： DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  SHOEMAKER, Kenneth ,  EWY, Erich N. ,  ELSHERBINI, Adel A.

IPC: H01P3/16 ,  H01P3/13

Abstract: Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.

公开(公告)号：WO2019132937A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068795

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

Inventor： KAMGAING, Telesphor ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/145 ,  H03H9/64

CPC classification number: H03H9/0542 ,  H03H7/09 ,  H03H7/1766 ,  H03H7/1775 ,  H03H9/0552 ,  H03H9/0557 ,  H03H9/0561 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/542 ,  H03H2001/0085

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter incudes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

公开(公告)号：WO2019066994A1

公开(公告)日：2019-04-04

申请号：PCT/US2017/054678

申请日：2017-09-30

Applicant: INTEL CORPORATION ,  BRAUNISCH, Henning ,  EID, Feras ,  DOGIAMIS, Georgios C.

Inventor： BRAUNISCH, Henning ,  EID, Feras ,  DOGIAMIS, Georgios C.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/12 ,  H01L23/40

Abstract: An inductor in a device package and a method of forming the inductor in the device package are described. The inductor includes a first conductive layer disposed on a substrate. The inductor also has one or more hybrid magnetic additively manufactured (HMAM) layers disposed over and around the first conductive layer to form one or more via openings over the first conductive layer. The inductor further includes one or more vias disposed into the one or more via openings, wherein the one or more vias are only disposed on the portions of the exposed first conductive layer. The inductor has a dielectric layer disposed over and around the one or more vias, the HMAM layers, and the substrate. The inductor also has a second conductive layer disposed over the one or more vias and the dielectric layer.

公开(公告)号：WO2019005021A1

公开(公告)日：2019-01-03

申请号：PCT/US2017/039598

申请日：2017-06-27

Applicant: INTEL CORPORATION

Inventor： SOUNART, Thomas L. ,  ALEKSOV, Aleksandar ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna ,  DARMAWIKARTA, Kristof

IPC: H01L23/522 ,  H01L23/482

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a capacitor formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. The capacitor includes first and second conductive electrodes and an ultra-high-k dielectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：WO2018063417A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/055086

申请日：2016-10-01

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  ALEKSOV, Aleksandar ,  SWAN, Johanna M.

IPC: G06F1/16 ,  G06F3/01

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

Abstract translation: 根据所公开的实施例，提供了用于实现触觉反馈系统的增加的人类感知的系统，方法和装置。 例如，根据一个实施例公开了一种可穿戴设备，其中具有：可穿戴设备壳体; 可穿装置壳体内的多个致动器，每个致动器独立地或组合地振动; 其中所述多个致动器中的每一个的一个表面暴露在所述可穿装置壳体的表面处; 围绕可穿装置壳体内的多个致动器中的每一个的侧面的弹性体，以将致动器保持在可穿装置壳体内的适当位置; 以及从多个致动器中的每一个到可穿戴设备的内部半导体组件的电互连。 披露了其他相关的实施例。

公开(公告)号：WO2018063341A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054832

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha, N. ,  DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  RAWLINGS, Brandon M. ,  DISCHLER, Richard, J.

IPC: H01P3/02 ,  H01P3/127 ,  H01P3/12 ,  H01P3/16

CPC classification number: H01P3/122 ,  H01P3/127 ,  H01P3/16 ,  H01P11/002

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

Abstract translation: 一种装置包括波导，该波导包括：包括电介质材料的细长波导芯，其中该波导芯包括沿着该波导芯纵向排列的至少一个空间，该空间没有该电介质材料; 以及围绕波导芯设置的导电层。

公开(公告)号：WO2018063136A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/000080

申请日：2016-10-01

Applicant: INTEL CORPORATION ,  ALEKSOV, Aleksandar ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M.

Inventor： ALEKSOV, Aleksandar ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M.

IPC: G06F1/16 ,  G06F3/01

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; one or more pins attached to each of the plurality of actuators, one end of each of the plurality of pins affixed to the actuators extrudes beyond surface of the wearable device case and is exposed outside of the wearable device case; electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

Abstract translation: 根据所公开的实施例，提供了用于实现触觉反馈系统的增加的人类感知的系统，方法和装置。 例如，根据一个实施例公开了一种可穿戴设备，其中具有：可穿戴设备壳体; 可穿装置壳体内的多个致动器，每个致动器独立地或组合地振动; 连接到所述多个致动器中的每一个的一个或多个销，固定到所述致动器的所述多个销中的每一个的一端挤出超出所述可穿装置外壳的表面并且暴露在所述可穿装置外壳的外面; 从多个致动器中的每一个到可穿戴设备的内部半导体组件的电互连。 披露了其他相关的实施例。