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    Thermal management solutions for integrated circuit packages
    13.
    发明授权
    Thermal management solutions for integrated circuit packages 有权

    公开(公告)号：US11482471B2

    公开(公告)日：2022-10-25

    申请号：US16287728

    申请日：2019-02-27

    Applicant: Intel Corporation

    Inventor： Cheng Xu ,  Junnan Zhao ,  Zhimin Wan ,  Ying Wang ,  Yikang Deng ,  Chong Zhang ,  Jiwei Sun ,  Zhenguo Jiang ,  Kyu-Oh Lee

    IPC: H01L23/46 ,  H01L23/467 ,  H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  H01L23/473 ,  H01L23/66 ,  H01L23/31

    Abstract: An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

    Slow wave structure for millimeter wave antennas
    14.
    发明授权
    Slow wave structure for millimeter wave antennas 有权

    公开(公告)号：US11095045B2

    公开(公告)日：2021-08-17

    申请号：US16493520

    申请日：2017-03-30

    Applicant: Intel Corporation

    Inventor： Zhichao Zhang ,  Jiwei Sun ,  Kemal Aygun

    IPC: H01Q21/24 ,  H05K1/02 ,  H01P9/00

    Abstract: Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a first electronic signal over a first conductive path to a first destination and a second electronic signal over a second conductive path to a second destination. A first slow wave structure comprises the first conductive path and a second slow wave structure comprises the second conductive path. The effective relative permittivity of the first slow wave structure is tuned such that the first electronic signal arrives at its destination at a first time and at a first phase, and the effective relative permittivity of the second slow wave structure is tuned such that the second electronic signal arrives at its destination at a second time and at a second phase.

    SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS
    15.
    发明申请
    SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS 审中-公开

    公开(公告)号：US20200014122A1

    公开(公告)日：2020-01-09

    申请号：US16493520

    申请日：2017-03-30

    Applicant: Intel Corporation

    Inventor： Zhichao Zhang ,  Jiwei Sun ,  Kemal Aygun

    IPC: H01Q21/24 ,  H05K1/02

    Abstract: Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a first electronic signal over a first conductive path to a first destination and a second electronic signal over a second conductive path to a second destination. A first slow wave structure comprises the first conductive path and a second slow wave structure comprises the second conductive path. The effective relative permittivity of the first slow wave structure is tuned such that the first electronic signal arrives at its destination at a first time and at a first phase, and the effective relative permittivity of the second slow wave structure is tuned such that the second electronic signal arrives at its destination at a second time and at a second phase.

    Interconnect loss of high density package with magnetic material
    18.
    发明授权
    Interconnect loss of high density package with magnetic material 有权

    公开(公告)号：US12009320B2

    公开(公告)日：2024-06-11

    申请号：US16596383

    申请日：2019-10-08

    Applicant: Intel Corporation

    Inventor： Zhiguo Qian ,  Cemil Geyik ,  Jiwei Sun ,  Gang Duan ,  Kemal Aygün

    IPC: H01L23/49 ,  H01L23/498 ,  H01L23/64

    CPC classification number: H01L23/645 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866

    Abstract: Embodiments include package substrates and a semiconductor package with such package substrates. A package substrate includes a first conductive layer in a first magnetic layer, and a second magnetic layer over the first magnetic layer, where the first and second magnetic layers include magnetic materials. The package substrate also includes a second conductive layer in the second magnetic layer. The second conductive layer includes a plurality of first traces fully surrounded by the first and second magnetic layers. The package substrate includes a third conductive layer over the second magnetic layer. The magnetic materials may include manganese Mn ferrite materials, Zn/Mn ferrite materials, or Ni/Zn ferrite materials. The magnetic materials include material properties with a low constant value, a magnetic tangent value, a frequency, a base filler chemistry, a filler shape, a filler orientation, a filler percentage, a loading fraction value, a permeability, an insertion loss, and a resin formulation.

    INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS
    19.
    发明公开
    INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS 审中-公开

    公开(公告)号：US20240006323A1

    公开(公告)日：2024-01-04

    申请号：US17853018

    申请日：2022-06-29

    Applicant: Intel Corporation

    Inventor： Lijiang Wang ,  Naren Sreenivas Viswanathan ,  Sujit Sharan ,  Jiwei Sun

    IPC: H01L23/538 ,  H01L25/065

    CPC classification number: H01L23/5381 ,  H01L23/5386 ,  H01L23/5383 ,  H01L25/0655

    Abstract: An electronic device may include an interconnect bridge. The interconnect bridge may include a first electrical routing trace having a first routing length and a corresponding first transit time for a first electrical signal to transmit across the first routing length. The first electrical routing trace may transmit the first electrical signal along a major plane of the interconnect bridge between a first interconnect and a second interconnect. The interconnect bridge may include a routing trace deviation in communication with the first electrical routing trace. The routing trace deviation is outside a direct route between the first interconnect and the second interconnect. The routing trace deviation may alter one or more of capacitance or resistance of the first electrical routing trace and correspondingly alter the first routing time.

    Slow wave structure for millimeter wave antennas
    20.
    发明授权
    Slow wave structure for millimeter wave antennas 有权

    公开(公告)号：US11715889B2

    公开(公告)日：2023-08-01

    申请号：US17402916

    申请日：2021-08-16

    Applicant: Intel Corporation

    Inventor： Zhichao Zhang ,  Jiwei Sun ,  Kemal Aygun

    IPC: H01Q21/24 ,  H05K1/02 ,  H01P9/00

    CPC classification number: H01Q21/24 ,  H05K1/0243 ,  H05K1/0248 ,  H01P9/00 ,  H05K2201/10098

    Abstract: Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a first electronic signal over a first conductive path to a first destination and a second electronic signal over a second conductive path to a second destination. A first slow wave structure comprises the first conductive path and a second slow wave structure comprises the second conductive path. The effective relative permittivity of the first slow wave structure is tuned such that the first electronic signal arrives at its destination at a first time and at a first phase, and the effective relative permittivity of the second slow wave structure is tuned such that the second electronic signal arrives at its destination at a second time and at a second phase.

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