公开(公告)号：US20250102745A1

公开(公告)日：2025-03-27

申请号：US18475907

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Mohanraj Prabhugoud ,  David Shia ,  Hari Mahalingam ,  John M. Heck ,  John Robert Macdonald ,  Duncan Peter Dore ,  Eric J. M. Moret ,  Nicholas D. Psaila ,  Sang Yup Kim ,  Shane Kevin Yerkes ,  Harel Frish

IPC: G02B6/42

Abstract: In one embodiment, a device includes a fiber array unit (FAU) coupled to a photonics integrated circuit (PIC) die. The PIC die includes a cavity defined at an edge of the PIC die, with outer edges of the cavity being formed at an angle less than 90 degrees with respect to a bottom surface of the cavity. The PIC die further includes first waveguides protruding into the cavity of the PIC die. The FAU includes a shelf portion extending from a body portion, and a plurality of second waveguides protruding from an outer edge of the shelf portion opposite the body portion. The FAU further includes alignment structures on outer edges of the shelf portion that are in contact with the angled edges of the cavity of the PIC die.

公开(公告)号：US20250004225A1

公开(公告)日：2025-01-02

申请号：US18345106

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Mohanraj Prabhugoud ,  David Shia ,  Tarek A. Ibrahim ,  Yuxin Fang

IPC: G02B6/42

Abstract: Technologies for substrate features for a pluggable optical connectors in an integrated circuit package are disclosed. In the illustrative embodiment, a substrate includes a cavity cut through a substrate of the integrated circuit package. Sidewalls of the cavity establish coarse lateral alignment features for an optical plug. The optical plug and optical socket include additional alignment features to more precisely align optical fibers in the optical plug to an optical interposer mounted on the substrate. The cavity cut through the substrate may also include indents that can mate with protrusions of the optical plug to retain the optical plug. The optical interposer may be mounted on a recessed shelf in the substrate.

公开(公告)号：US12127363B2

公开(公告)日：2024-10-22

申请号：US17033401

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Thomas Boyd ,  Kuang Liu ,  Steven A. Klein ,  Daniel Neumann ,  Mohanraj Prabhugoud

IPC: H05K7/10 ,  H01R12/52

CPC classification number: H05K7/1069 ,  H01R12/523

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20210216121A1

公开(公告)日：2021-07-15

申请号：US17214230

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  David Rodriguez ,  Jin Yang ,  David Shia ,  Jimmy Chuang ,  Mohanraj Prabhugoud ,  Mark Edmund Sprenger

IPC: G06F1/20 ,  H05K7/20

Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

公开(公告)号：US10595439B2

公开(公告)日：2020-03-17

申请号：US16017731

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： David Shia ,  Evan Chenelly ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  F28D15/02 ,  H05K1/18 ,  H05K1/02 ,  G06F1/20 ,  H01L23/427 ,  F28F1/30 ,  H01L23/467 ,  H01L23/367

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.

公开(公告)号：US20190045663A1

公开(公告)日：2019-02-07

申请号：US16017731

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： David Shia ,  Evan Chenelly ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.

公开(公告)号：US12293956B2

公开(公告)日：2025-05-06

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin Yang ,  Jimmy Chuang ,  Xicai Jing ,  Yuan-Liang Li ,  Yuyang Xia ,  David Shia ,  Mohanraj Prabhugoud ,  Maria de la Luz Belmont ,  Oscar Farias Moguel ,  Andres Ramirez Macias ,  Javier Avalos Garcia ,  Jessica Gullbrand ,  Shaorong Zhou ,  Chia-Pin Chiu ,  Xiaojin Gu

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20250089192A1

公开(公告)日：2025-03-13

申请号：US18961017

申请日：2024-11-26

Applicant: Intel Corporation

Inventor： Phil Geng ,  Dongwang Chen ,  Fernando Gonzalez Lenero ,  Chuansheng Liu ,  Lejie Liu ,  Ralph V. Miele ,  Mohanraj Prabhugoud ,  Sanjoy Saha ,  David Shia ,  Jeffory L. Smalley ,  Ke Song ,  Meng Wang ,  Xiaoning Ye ,  Juan Zermeno Carriedo ,  Yipeng Zhong

IPC: H05K5/02 ,  H05K5/04

Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.

公开(公告)号：US20230395460A1

公开(公告)日：2023-12-07

申请号：US18450928

申请日：2023-08-16

Applicant: Intel Corporation

Inventor： David Shia ,  Rick Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  John Beatty ,  Kenan Arik ,  Mohanraj Prabhugoud ,  Kirk Wheeler ,  Shelby Ferguson ,  Jorge Contreras Perez ,  Daniel Neumann ,  Ernesto Borboa Lizarraga

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.

公开(公告)号：US11683890B2

公开(公告)日：2023-06-20

申请号：US16227243

申请日：2018-12-20

Applicant: INTEL CORPORATION

Inventor： Jonathan W. Thibado ,  Jeffory L. Smalley ,  John C. Gulick ,  Phi Thanh ,  Mohanraj Prabhugoud

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  G06F1/16 ,  H01L23/498

CPC classification number: H05K3/3494 ,  G06F1/16 ,  H01L23/49816 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/112 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.