公开(公告)号：US09123752B2

公开(公告)日：2015-09-01

申请号：US14531723

申请日：2014-11-03

Applicant: Japan Science and Technology Agency

Inventor： Tatsuya Shimoda ,  Eisuke Tokumitsu ,  Takaaki Miyasako ,  Toshihiko Kaneda

IPC: H01L29/10 ,  H01L29/66 ,  B41J2/16 ,  C23C18/12 ,  B05D5/06 ,  H01L21/02 ,  H01L21/368 ,  H01L29/786 ,  H01L41/33 ,  H01L41/318 ,  H01L27/12 ,  C23C18/06 ,  H01L21/441 ,  H01L41/09

CPC classification number: H01L29/66969 ,  B05D5/06 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1643 ,  B41J2/1645 ,  C23C18/06 ,  C23C18/1216 ,  C23C18/1254 ,  C23C18/1279 ,  C23C18/1283 ,  C23C18/1295 ,  H01L21/02104 ,  H01L21/0237 ,  H01L21/02521 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/38 ,  H01L21/441 ,  H01L27/1225 ,  H01L27/1292 ,  H01L29/786 ,  H01L29/7869 ,  H01L41/0973 ,  H01L41/318 ,  H01L41/33

Abstract: A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.

Abstract translation: 本发明的功能元件的制造方法依次包括功能固体材料前体层的形成工序，将功能性液态材料涂布在基材上形成功能性固体材料的前体层; 所述干燥步骤将所述前体层加热至80℃至250℃的第一温度，以预先降低所述前体层的流动性; 将加热到80℃至300℃的第二温度的前体层的压印步骤，在前体层上形成压印结构; 以及在高于第二温度的第三温度下对前体层进行热处理以将前体层转变成功能性固体材料层的功能性固体材料层形成步骤。

公开(公告)号：US20140319660A1

公开(公告)日：2014-10-30

申请号：US14357167

申请日：2012-10-25

Applicant: Japan Science and Technology Agency

Inventor： Tatsuya Shimoda ,  Eisuke Tokumitsu ,  Masatoshi Onoue ,  Takaaki Miyasako

IPC: H01L21/02

CPC classification number: H01G4/1254 ,  H01G4/1263 ,  H01G4/306 ,  H01L21/02205 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/76817 ,  H01L27/016 ,  H01L28/40 ,  H01L29/84

Abstract: A solid-state electronic device according to the present invention includes: an oxide layer (possibly containing inevitable impurities) that is formed by heating, in an atmosphere containing oxygen, a precursor layer obtained from a precursor solution as a start material including both a precursor containing bismuth (Bi) and a precursor containing niobium (Nb) as solutes, the oxide layer consisting of the bismuth (Bi) and the niobium (Nb); wherein the oxide layer is formed by heating at a heating temperature from 520° C. to 650° C.

Abstract translation: 根据本发明的固态电子器件包括：氧化物层（可能含有不可避免的杂质），其通过在包含氧气的气氛中加热由作为起始材料的前体溶液获得的前体层而形成，该起始材料包括前体 含有铋（Bi）和含有铌（Nb）作为溶质的前体，由铋（Bi）和铌（Nb）构成的氧化物层。 其中通过在520℃至650℃的加热温度下加热形成氧化物层。

公开(公告)号：US20150102340A1

公开(公告)日：2015-04-16

申请号：US14382457

申请日：2013-02-28

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Tatsuya Shimoda ,  Jinwang Li

IPC: H01L21/02 ,  H01L29/24

CPC classification number: H01L21/02565 ,  C23C18/1216 ,  C23C18/1233 ,  C23C18/1241 ,  C23C18/1245 ,  C23C18/1279 ,  C23C18/1283 ,  C23C18/1295 ,  H01L21/02381 ,  H01L21/0242 ,  H01L21/02488 ,  H01L21/02592 ,  H01L21/02614 ,  H01L21/02664 ,  H01L21/288 ,  H01L29/247

Abstract: A method of forming a conductive film, comprising the steps of: applying a composition comprising at least one metal compound selected from the group consisting of carboxylate salt, alkoxide, diketonato and nitrosylcarboxylate salt of a metal selected from among copper, palladium, rhodium, ruthenium, iridium, nickel and bismuth and a solvent to a substrate to form a coating film; and supplying a hydrogen radical to the coating film to carry out a hydrogen radical treatment.

Abstract translation: 一种形成导电膜的方法，包括以下步骤：施加包含至少一种金属化合物的组合物，所述金属化合物选自铜，钯，铑，钌中的金属，所述金属化合物选自羧酸盐，醇盐，二酮基和亚硝酰基羧酸盐 ，铱，镍和铋以及溶剂添加到基材上以形成涂膜; 向该涂膜供给氢自由基进行氢根处理。

公开(公告)号：US20150004762A1

公开(公告)日：2015-01-01

申请号：US14357138

申请日：2012-11-07

Applicant: Japan Science and Technology Agency

Inventor： Tatsuya Shimoda ,  Toshihiko Kaneda

IPC: H01L27/12 ,  H01L21/67 ,  H01L27/108

CPC classification number: H01L27/1255 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1637 ,  B41J2/1645 ,  H01L21/28291 ,  H01L21/67098 ,  H01L27/10805 ,  H01L27/10873 ,  H01L27/1262 ,  H01L27/127 ,  H01L28/55 ,  H01L29/78391 ,  H01L29/7869 ,  H01L41/0973 ,  H01L41/317 ,  H01L41/332 ,  H01L45/1206 ,  H01L45/1226 ,  H01L45/147 ,  H01L45/1608

Abstract: According to the present invention, a method of producing a functional device includes the imprinting step and the functional solid material layer formation step. In the imprinting step, a functional solid material precursor layer obtained from a functional solid material precursor solution as a start material is imprinted so that a first temperature of a heat source for supplying heat to the functional solid material precursor layer is higher than a second temperature of the functional solid material precursor layer in at least part of a time period while a mold for forming an imprinted structure is pressed against the functional solid material precursor layer. In the functional solid material layer formation step, after the imprinting step, the functional solid material precursor layer is heat treated at a third temperature higher than the first temperature in an atmosphere containing oxygen to form a functional solid material layer from the functional solid material precursor layer.

Abstract translation: 根据本发明，制造功能元件的方法包括压印步骤和功能固体材料层形成步骤。 在压印步骤中，将由作为起始材料的功能固体材料前体溶液获得的功能固体材料前体层压印，使得用于向功能性固体材料前体层供给热量的热源的第一温度高于第二温度 的功能固体材料前体层的至少一部分，同时用于形成压印结构的模具被压在功能固体材料前体层上。 在功能固体材料层形成工序中，在压印步骤之后，在含氧气氛中，在高于第一温度的第三温度下对功能固体材料前体层进行热处理，从功能性固体材料前体形成功能固体材料层 层。

公开(公告)号：US20140367674A1

公开(公告)日：2014-12-18

申请号：US14344072

申请日：2012-11-15

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Tatsuya Shimoda ,  Jinwang Li

IPC: H01L21/02 ,  H01L29/24

CPC classification number: H01L21/02565 ,  H01B1/08 ,  H01L21/02614 ,  H01L29/247 ,  H01L29/7869

Abstract: A process for forming an amorphous conductive oxide film, comprising the steps of: applying a composition which comprises (A1) a×y parts by mole of at least one metal compound selected from the group consisting of carboxylate salts, alkoxides, diketonates, nitrate salts and halides of a metal selected from among lanthanoids (excluding cerium), (A2) a×(1−y) parts by mole of at least one metal compound selected from the group consisting of carboxylate salts, alkoxides, diketonates, nitrate salts and halides of a metal selected from among lead, bismuth, nickel, palladium, copper and silver, (B) 1 part by mole of at least one metal compound selected from the group consisting of carboxylate salts, alkoxides, diketonates, nitrate salts, halides, nitrosylcarboxylate salts, nitrosylnitrate salts, nitrosylsulfate salts and nitrosylhalides of a metal selected from among ruthenium, iridium, rhodium and cobalt, and (C) a solvent containing at least one selected from the group consisting of carboxylic acids, alcohols, ketones, diols and glycol ethers to a substrate to form a coating film; and heating the coating film in an oxidizing atmosphere.

Abstract translation: 一种形成非晶导电氧化物膜的方法，包括以下步骤：施加一种组合物，其包含（A1）a×y份摩尔选自羧酸盐，醇盐，二酮盐，硝酸盐的至少一种金属化合物 和选自镧系元素（不包括铈）的金属的卤化物，（A2）a×（1-y）摩尔的至少一种选自羧酸盐，醇盐，二酮盐，硝酸盐和卤化物的金属化合物 选自铅，铋，镍，钯，铜和银的金属，（B）1份（摩尔）选自羧酸盐，醇盐，二酮化物，硝酸盐，卤化物，亚硝酰基羧酸盐中的至少一种金属化合物 选自钌，铱，铑和钴的金属的盐，亚硝基硝酸盐，亚硝酰基硫酸盐和亚硝酰卤，和（C）含有选自汽车 酚醛酸，醇，酮，二醇和二醇醚，形成一个涂膜; 并在氧化气氛中加热涂膜。