公开(公告)号：JPH09183061A

公开(公告)日：1997-07-15

申请号：JP35354795

申请日：1995-12-29

Applicant: KAO CORP

Inventor： YAMAMOTO YUZO ,  SHIBATA MANABU

IPC: B24B37/00 ,  G11B5/84

Abstract: PROBLEM TO BE SOLVED: To prevent microcracking from occurring by polishing the surface of a board before baking and grinding its surface by a ductile mode finish. SOLUTION: The surface of a cured board is polished so as to level the flatness Ra of it and improve the irregularities of board thickness of each cured board and dispersion of average board thickness between cured boards. Also the polished cured board is baked so as to obtain a baked board. The surface of the baked board thus obtained is ground by a ductile mode finish so as to obtain a surface finished board. Because the amount of biting of each abrasive to each board can be set below the ductility brittleness transition point or below of the board after the surface of a brittle material board is ground by the ductile mode finish, the finish configuration of boards can be controlled from a brittle fracture to a ductile deformation center so as to suppress microcracking from occurring.

公开(公告)号：JPH09102126A

公开(公告)日：1997-04-15

申请号：JP25654795

申请日：1995-10-03

Applicant: KAO CORP

Inventor： YAMAMOTO YUZO

IPC: G11B5/84

Abstract: PROBLEM TO BE SOLVED: To provide the method for recovering a substrate for a magnetic recording medium by which magnetic layers and the like can be uniformly and rapidly removed without giving any damages causing medium error to the substrate. SOLUTION: In this recovering method, the magnetic recording medium produced by forming at least a chromium base layer, a metal thin film magnetic layer and a protective layer on a metal substrate is subjected to wet treatment in aq. acidic or alkaline son. containing a surfactant and/or an org. solvent to remove the chromium base layer, metal thin film magnetic layer and protective layer. Thereby, the substrate can be reproduced at a low cost.

公开(公告)号：JPH0976147A

公开(公告)日：1997-03-25

申请号：JP25697895

申请日：1995-09-08

Applicant: KAO CORP ,  NISSIN MACHINE WORKS

Inventor： YAMAMOTO YUZO ,  NODA AKIRA ,  KOBAYASHI MIKIO ,  DAITO KIYOMASA

IPC: B24B1/00 ,  G11B5/73 ,  G11B5/82 ,  G11B5/84 ,  H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a surface-machined substrate free of micro-cracks by grinding a substrate by means of a grinding wheel and under a ductile mode so as to form sector-form machining traces. SOLUTION: The generating-line form of a shoulder of a grinding wheel is adjusted by precise turning, so that the depth of cut of individual abrasive grains becomes lower than the ductility-brittleness transition point (about 50nm) of a carbon substrate. The substrate is fixed by a great many of vacuum suction holes made in a work table, or by a vacuum chucking method, and both surfaces the substrate are machined under a ductile mode. Thus, sector-form machining traces are formed on the surface-machined substrate. In this case, no cross-over of these machining traces is formed. With this, the occurrence of micro-cracks is restricted, while Ra (surface roughness) becomes 1 to 100Å and Rp (projection height)/Ra 2 to 10.

公开(公告)号：JPH08306040A

公开(公告)日：1996-11-22

申请号：JP11057095

申请日：1995-05-09

Applicant: KAO CORP

Inventor： YAMAMOTO YUZO

IPC: C23C16/48 ,  G11B5/84

Abstract: PURPOSE: To prevent the occurrence of flows on the surface of a disk and to improve error characteristics and sliding durability to a head by carrying out a vanishing process by oxidation treatment and forming a lubricant layer by vapor phase polymn. CONSTITUTION: This magnetic recording medium is produced through a process for forming a magnetic layer on a nonmagnetic substrate, a process for forming a protective layer on the magnetic layer, a vanishing process for reducing the height of abnormal protrusions existing on the surface of the protective layer and a process for forming a lubricant layer on the protective layer. The vanishing process is carried out by oxidation treatment by heating the substrate at 400-600 deg.C in an oxidizing atmosphere of air, ozone, CO2 , steam, etc. The lubricant layer is formed by bringing a fluorocarbon compd., preferably this compd. and oxygen into vapor phase polymn. under vacuum conditions.

公开(公告)号：JPH05135619A

公开(公告)日：1993-06-01

申请号：JP32644791

申请日：1991-11-13

Applicant: KAO CORP

Inventor： YONEDA YASUHIRO ,  YAMAMOTO YUZO

IPC: B29B7/52 ,  B29B7/90 ,  B29K103/06 ,  B29K105/16 ,  C08J3/20 ,  C08K3/02 ,  C08K3/08 ,  C09D5/24 ,  H01B1/22 ,  H05K1/09

Abstract: PURPOSE:To eliminate deterioration of conductivity for a long time by a method wherein a composition whose essential components are at least copper powder, organic binder, additive and solvent is made to pass through between the rolls of a pressed rolling mill so that the essential components are kneaded and the quantity of use of the additive is controlled end the resistance is lowered by a simple method. CONSTITUTION:A conductive copper paste is manufactured by making a composition whose essential components are at least copper powder, organic binder, additive and solvent pass through between the rolls of a rolling mill to knead the composition. Arborescent, globular or indeterminate-form copper powder may be used, but the arborescent copper powder is preferable. It is preferable that the average grain size of the copper powder is 100mum or less, and it is more preferable that the average grain size thereof is 1-30mum or so. It is preferable that the organic binder is phenol resin, amino resin, urea resin, etc., and may be used as single or a mixture of 2 or more thereof. The compounding quantity of the organic binder is 5-40 parts by weight with reference to additive, 100 parts by weight of copper powder. As the additive, resin acids, alkyl benzonic acids, and others are used. A total pressure of 2-200kg/cm is applied between the rolls of the rolling mill, and the composition is made to pass through the rolls 1-40 times.

公开(公告)号：JPH05114772A

公开(公告)日：1993-05-07

申请号：JP12671691

申请日：1991-04-29

Applicant: KAO CORP

Inventor： YAMAMOTO YUZO ,  HAYASHI HIROMITSU ,  IWASAKI MASANORI

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/12 ,  H05K3/24 ,  H05K3/38

Abstract: PURPOSE:To enable conductive powder to be enhanced in oxidation stability by controlling it in affinity and reactivity to the surface of metal by using conductive paste which contains hydroxystyrene copolymer of specific weight- average molecular weight and/or its derivative as organic binder. CONSTITUTION:In hydroxystyrene copolymer and/or its derivative represented by a formula: m and n are set to arbitrary numbers until the copolymer concerned becomes 10-2 million in weight-average molecular weight and so set as to satisfy formulas, m>=0 and n>=3; k, p, and u are so set as to satisfy formulas, 0 -R indicate alkyl groups whose number of carbon or hydrogen atoms is 1-5; X indicates polymerizable vinyl monomer; and Y and Z are the same or different in kinds and selected from prescribed substituting groups or alkyl or aryl groups whose number of carbon atoms is 1-18. It is preferable that the compounding ratio of the copolymer to thermosetting resin is set to 95/5-40/60. It is preferable that the compounding ratio of conductive powder to conductive paste except solvent ranges from 50 to 95wt.%.

公开(公告)号：JPH04334805A

公开(公告)日：1992-11-20

申请号：JP13551991

申请日：1991-05-11

Applicant: KAO CORP

Inventor： NISHIUCHI YUMI ,  YAMAMOTO YUZO ,  HAYASHI HIROMITSU

IPC: C09D5/24 ,  C09D161/28 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K9/00

Abstract: PURPOSE:To reduce to hardening temperature and to increase the adhesion of a conductive paste obtained, by using a low temperature hardening type melamine resin with a specific chemical structure in an organic binder, and furthermore, by leading in a hydroxystyrene type copolymer and/or its derivative. CONSTITUTION:This is a conductive paste including a conductive powder, an organic binder, and a solvent as the essential components, and the specific feature of this conductive paste is to include a low temperature hardening type melamine resin in the organic binder.

公开(公告)号：JPH04214773A

公开(公告)日：1992-08-05

申请号：JP34107490

申请日：1990-11-30

Applicant: KAO CORP

Inventor： TOKUNAGA HIROSHI ,  YAMAMOTO YUZO

IPC: C08F220/28 ,  C08F20/26 ,  C08F22/36 ,  C08F222/02 ,  C08F222/40 ,  C08F290/00 ,  C08F299/00 ,  C08G18/62 ,  C08G59/00 ,  C08G59/40 ,  C08G59/62 ,  C08K3/08 ,  C08L25/00 ,  C08L25/18 ,  C08L63/00 ,  C09D5/24 ,  C09D7/12 ,  C09D125/00 ,  C09D125/18 ,  C09D133/04 ,  C09D133/06 ,  C09D161/04 ,  C09D161/06 ,  C09D161/20 ,  C09D161/28 ,  C09D175/04 ,  H01B1/20 ,  H05K1/09 ,  H05K9/00

Abstract: PURPOSE:To obtain an electrically conductive paste having high electrical conductivity while keeping the adhesivity over a long period by compounding a hydroxystyrene copolymer (derivative) as an organic binder and a metal chelating agent as an additive. CONSTITUTION:The objective electrically conductive paste is produced by compounding, as essential components, (A) a hydroxystyrene copolymer (derivative) having a weight-average molecular weight of 1,000-2,000,000, preferably an organic polymer of formula (R to R are H or 1-5C alkyl; X is polymerizable vinyl monomer; Y and Z are 1-18C alkyl, -CH2OH, etc.; m>=0; n>=3) as an organic binder, (B) a metal chelating agent such as o-aminophenol as an additive, (C) electrically conductive powder such as copper powder and (D) a solvent such as benzene.

公开(公告)号：JPH04214770A

公开(公告)日：1992-08-05

申请号：JP34108090

申请日：1990-11-30

Applicant: KAO CORP

Inventor： YONEDA YASUHIRO ,  YAMAMOTO YUZO ,  MIZUSHIMA YOUSEN

IPC: B22F1/02 ,  C09C1/62 ,  C09D5/24 ,  H05K1/09 ,  H05K9/00

Abstract: PURPOSE:To obtain the subject treating agent capable of remarkably improving the heat-resistance and moisture-resistant reliability of copper powder by using a specific phenol adduct, a polyhydroxystyrene (derivative) and a hydroxystyrene copolymer (derivative) as main components. CONSTITUTION:The objective treating agent capable of improving the affinity of copper powder to a resin binder is composed mainly of (A) a monohydric or polyhydric phenol adduct of an unsaturated fatty acid (ester), (B) a monohydric or polyhydric phenol adduct of an unsaturated fatty acid (ester) of the component A wherein the phenol in the component A is an (un)saturated fatty acid ester, (C) a monohydric or polyhydric phenol adduct of an unsaturated fatty acid (ester) of the component A wherein the phenol in the component A is an arylsulfonated product or arylaminated product and (D) a polyhydroxystyrene (derivative) and/or (E) a hydroxystyrene copolymer (derivative).

公开(公告)号：JPH04139267A

公开(公告)日：1992-05-13

申请号：JP26228190

申请日：1990-09-29

Applicant: KAO CORP

Inventor： IWASAKI MASANORI ,  YAMAMOTO YUZO ,  HAYASHI HIROMITSU

IPC: H05K1/09 ,  C09D5/24 ,  C09D129/14 ,  H01B1/22

Abstract: PURPOSE:To obtain a paste having improved adhesivity to the surface of a copper foil, insulation layer, etc., while keeping high electrical conductivity and useful for an electrode, etc., of electronic part and circuit part by compounding electrically conductive powder, a thermosetting organic binder, a specific polyvinyl acetal and a solvent. CONSTITUTION:The objective paste contains (A) preferably 80-95wt.% of electrically conductive powder (preferably copper powder), (B) a thermosetting organic binder (preferably resol-type phenolic resin or amino resin), (C) a polyvinyl acetal of formula [(l), (m) and (n) are constitution ratio of each unit and 0.5