ACTIVATION OF RESINOUS BODIES
    11.
    发明专利

    公开(公告)号:AU8556375A

    公开(公告)日:1977-04-21

    申请号:AU8556375

    申请日:1975-10-08

    Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Resinous surfaces so treated are neutralized in a process including treatment with hydrazine in order to yield metallized resinous surfaces exhibiting superior peel strengths following electroless metal deposition.

    SENSITIZED SUBSTRATES
    15.
    发明专利

    公开(公告)号:AU4502172A

    公开(公告)日:1974-01-31

    申请号:AU4502172

    申请日:1972-07-26

    Abstract: There are provided new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

    COMPOSITION AND PROCESS FOR THE ACTIVATION OF RESINOUS BODIES FOR ADHERENT METALLIZATION

    公开(公告)号:CA1057468A

    公开(公告)日:1979-07-03

    申请号:CA280903

    申请日:1977-06-20

    Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of permanganate to manganate being up to about 1.2, and the composition having a pH controlled in the range of 4 to 13. Means to regenerate the composition are also described. The process and compositions of this invention are useful in preparing base materials having a resinous surface for metallization by electroless technique. :, :

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