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11.发明申请公开(公告)号：US20170299632A1
公开(公告)日：2017-10-19
申请号：US15130982
申请日：2016-04-17
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: G01R1/07378 , G01R1/07328 , G01R31/2808
Abstract: A printed circuit board (PCB) test fixture includes a substrate, a first insulation layer formed on the substrate, a conductor layer formed on the first insulation layer and electrically connected to the upper electrodes through at least one first connection member, a second insulation layer formed on the first insulation layer, and multiple conductive cones arranged on the second insulation layer in a matrix form. A part of the conductive cones is electrically connected to the conductor layer through at least one second connection member. The circuit layout of the conductor layer, the at least one first connection member and the at least one second connection member is employed to supply testing power to a part of the conductive cones and an adjustable arrangement of the conductive cones to enhance density of test probes upon electrical testing.
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公开(公告)号：US20160262269A1
公开(公告)日：2016-09-08
申请号：US14640993
申请日：2015-03-06
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K3/205 , H05K2201/0376 , H05K2203/0376
Abstract: Disclosed is a copper etching method for manufacturing a circuit board, including steps of electroplating a metal copper support layer, coating a thermal sensitive photo resist layer, coating a photo resist layer, performing a process of pattern transfer, removing part of the photo resist layer to form a photo resist pattern, electroplating a metal copper layer to form a circuit pattern, peeling off the photo resist layer, pressing a stacked body composed of a stacked substrate and a stacked material layer onto the circuit pattern to embed the circuit pattern in the stacked material layer, removing the base layer, performing a copper etching process to removing the metal copper support layer, and removing the thermal sensitive photo resist layer to expose the circuit pattern. In particular, the circuit pattern protrudes from the stacked material layer so as to facilitate the subsequent process of forming solder balls.
Abstract translation: 公开了一种用于制造电路板的铜蚀刻方法，包括以下步骤：电镀金属铜支撑层，涂覆热敏光致抗蚀剂层，涂覆光致抗蚀剂层，执行图案转印工艺，去除部分光致抗蚀剂层 以形成光刻胶图形，电镀金属铜层以形成电路图案，剥离光致抗蚀剂层，将由堆叠的基板和堆叠的材料层组成的堆叠体压在电路图案上，以将电路图案嵌入到 层叠材料层，去除基底层，进行铜蚀刻工艺以除去金属铜载体层，以及去除热敏光刻胶层以暴露电路图案。 特别地，电路图案从堆叠的材料层突出，以便于随后的形成焊球的工艺。
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公开(公告)号：US10720694B2
公开(公告)日：2020-07-21
申请号：US16175807
申请日：2018-10-30
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Yung-Lin Chia , Chiao-Cheng Chang
Abstract: An antenna carrier plate structure has a first circuit board and a second circuit board. The first circuit board has a first substrate and a conductive connector disposed in the first substrate. The conductive connector has two opposite connecting ends respectively protruding from two opposite surfaces of the first substrate. The second circuit board has a second substrate formed with a through hole, and a connecting plug is disposed in the through hole. One end of the connecting plug is formed with an engaging concave portion for engaging one end of the conductive connector of the first substrate. Therefore, each circuit board can be firmly fixed and electrically connected by engaging to form a multi-layer circuit board module, thereby avoiding joint tolerances during soldering and ensuring a correct connection of the joints.
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公开(公告)号：US10256030B2
公开(公告)日：2019-04-09
申请号：US15811317
申请日：2017-11-13
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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公开(公告)号：US20190014695A1
公开(公告)日：2019-01-10
申请号：US16115119
申请日：2018-08-28
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yung-Lin Chia
IPC: H05K9/00
CPC classification number: H05K9/0024 , H05K9/003 , H05K9/0037 , H05K9/0088 , H05K9/0092
Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20180068777A1
公开(公告)日：2018-03-08
申请号：US15811317
申请日：2017-11-13
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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公开(公告)号：US09847165B2
公开(公告)日：2017-12-19
申请号：US14877981
申请日：2015-10-08
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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公开(公告)号：US09570227B1
公开(公告)日：2017-02-14
申请号：US14809295
申请日：2015-07-27
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804
Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.
Abstract translation: 公开了一种磁激励线圈结构，其包括由薄膜形成的作为具有中空孔的圆筒体并被卷绕的电磁线圈片，以及覆盖由用于保护的电磁线圈片形成的圆筒体的外表面的绝缘层。 磁性线圈片包括柔性衬底，附着到柔性衬底的电介质层和嵌入在柔性衬底中并与电介质层接触的多个图案化电路层。 每个图案化电路层是分离的，并且图案化电路层的上表面和柔性基板的上表面形成共面。 磁线圈结构提供线圈的电功能，由于其电路的高纵横比而由图案化电路层增强，从而大大增加了整个磁通量和电磁效应。
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公开(公告)号：US09439290B1
公开(公告)日：2016-09-06
申请号：US14817268
申请日：2015-08-04
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/028 , H01F17/0013 , H05K1/118 , H05K1/165 , H05K2201/09036 , H05K2201/09063
Abstract: A carrier board structure includes at least one upper magnetic coil, at least one lower magnetic coil, a flexible board, a dielectric layer, at least one connection pad and at least one gold finger. The flexible board has a middle region having a middle hole, and two side regions thinner than the middle region. A groove used as a fold line is provided on the lower surface of each side region bordering on the middle region. The upper and lower magnetic coils are configured in the flexible board and separated by the dielectric layer. The gold fingers are provided on the two side regions and connected to the upper magnetic coils. The upper and lower magnetic coils are around the middle hole and connected by the connection pads. The fold lines help the two side regions to fold without damage to the upper and lower magnetic coils.
Abstract translation: 载体板结构包括至少一个上部磁线圈，至少一个下部磁线圈，柔性电路板，电介质层，至少一个连接焊盘和至少一个金手指。 柔性板具有中间区域，中间部分具有比中间区域薄的两个侧面区域。 用作折线的槽设置在与中间区域接壤的每个侧面的下表面上。 上下磁性线圈配置在柔性电路板中，由电介质层隔开。 金手指设置在两个侧面区域上并连接到上部磁性线圈。 上下磁性线圈围绕中间孔并通过连接垫连接。 折叠线帮助两个侧面区域折叠而不损坏上部和下部磁性线圈。
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公开(公告)号：US11495390B2
公开(公告)日：2022-11-08
申请号：US16285138
申请日：2019-02-25
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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