DEVICE HAVING MASK WITH HINGE AND FORMATION OF MICROELECTROMECHANICAL SYSTEM DEVICE

    公开(公告)号:JPH1138591A

    公开(公告)日:1999-02-12

    申请号:JP13289398

    申请日:1998-05-15

    Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an MEMS(microelectromechanical system) device capable of facilitating alignment without restricting the composition of film or the constitution of the MEMS device. SOLUTION: The masks with hinge 60 and 70 and the MEMS device 80 are partially formed on a substrate 58 at the same time. Apertures 62 and 72 formed on the masks 60 and 70 regulate a pattern, which is transferred in the form of a pattern layer. After releasing the device 80, the mask 60 is turned by about 180 deg. and arranged on the device 80 so as to be used as a shadow mask of micro size, whereby the optional pattern layer is formed on the device 80. By forming the mask with a hinge by initial-stage lithography, the mask is accurately aligned with the MEMS device. Continuously, the mask 70 is similarly used to form the pattern layer.

    PARTIAL OPTICAL PACKAGE ASSEMBLY AND OPTICAL COMMUNICATION SYSTEM

    公开(公告)号:JPH10197748A

    公开(公告)日:1998-07-31

    申请号:JP36017597

    申请日:1997-12-26

    Abstract: PROBLEM TO BE SOLVED: To provide an optical package assembly for a transmissive optical device by optically aligning a housed optical fiber with a window inside a package component in the state of optical communication with the optical device. SOLUTION: An input optical device 13 is housed in a bore 7 in an input part 3a of ferule 3. This input optical fiber 13 is moved into an input fiber alignment area 23 inside a package component 9 and terminated on a window 27 and similarly, an output optical fiber 15 is housed in the bore 7 in an output part 3b of ferule 3. The output optical fiber 15 is moved into a fiber alignment area 46 in a modulator chip 11 and terminated on a window 49. When positioning the optical fiber in the fiber alignment area 23 or 46, a refraction factor matching fluid can be used. Then, the housed optical fiber can be optically aligned with the window inside the package component in the state of optical communication with the optical device.

    16.
    发明专利
    未知

    公开(公告)号:DE69731178T2

    公开(公告)日:2006-03-02

    申请号:DE69731178

    申请日:1997-12-16

    Abstract: Packaging for a transmissive optical device, methods for manufacturing the packaging, and use of the packaging in an optical communications system are disclosed. The optical package assembly includes a optical package and an optical subassembly. The optical package receives the optical subassembly, which includes a packaging component attached to a transmissive optical device. One end of the optical package receives a first optical fiber that is delivered to a first fiber alignment region in the packaging component. The other end of the optical package receives a second optical fiber that is delivered to a second fiber alignment region in the transmissive optical device. The optical package and fiber alignment regions align the first fiber with the second fiber.

    17.
    发明专利
    未知

    公开(公告)号:DE69817438D1

    公开(公告)日:2003-10-02

    申请号:DE69817438

    申请日:1998-05-05

    Abstract: A method for forming micron-sized or smaller drops of liquid, and the use of the method in fabricating micro electro mechanical and micro mechanical devices is disclosed. A micropipette (4) is formed having an inside diameter no larger than the size of the drops to be formed. The micropipette is connected to a system (14) capable of developing a positive and optionally negative pressure within the micropipette. The tip of the micropipette is placed in liquid. The liquid is drawn into the micropipette via capillary action or from the negative pressure developed by the system. The micropipette is then positioned to deliver liquid to an intended location on a surface. To deliver the liquid, a positive pressure is developed within the micropipette (4). The positive pressure forces a micron-sized or smaller drop of liquid out of the micropipette. The method can be used to form micron-sized or smaller drops of adhesive for fixing in place various structural members that form microdevices.

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