ARTICLE INCLUDING DEFORMABLE MIRROR

    公开(公告)号:JP2001091866A

    公开(公告)日:2001-04-06

    申请号:JP2000130593

    申请日:2000-04-28

    Abstract: PROBLEM TO BE SOLVED: To provide adaptive optics in the type of a micromachined mirror to eliminate the optical/mechanical independence of a uniform reflection layer and to eliminate the many actuators of the conventional mirror arrays. SOLUTION: This article for directing a light signal between optical waveguides is disclosed. The article includes plural mirror elements which are mechanically and electrically interconnected and form reflection surfaces. The reflection surfaces can be deformed by impression of voltage. The light signal sent from the source waveguide can be directed to the different destination waveguides when the reflection surfaces are deformed. The plural mirror elements are actuated by the single actuator.

    ARTICLE INCLUDING VARIABLE INDUCTOR

    公开(公告)号:JP2001076935A

    公开(公告)日:2001-03-23

    申请号:JP2000213586

    申请日:2000-07-14

    Abstract: PROBLEM TO BE SOLVED: To vary inductance by changing the geometrical relationship between a ground plane and a loop. SOLUTION: An inductor 100 is configured such that a differential motion occurs in a space between a loop 110 and a ground plane 104. In this case, the loop 110 is fixed on a base material 102. Meanwhile, on the ground plane 104, a free end 105 can move by a vector 106 but is restrained at a fixed end 103. Moreover, since the loop 110 cannot move when the ground plane 104 makes a motion, a differential motion occurs in a space between the loop and the ground plane and the space is changed. Additionally, the ground plane 104 is made of a magnetic material or a material provided with magnetism by other methods.

    CIRCUIT ELEMENT AND METHOD FOR USING THE SAME

    公开(公告)号:JP2000100659A

    公开(公告)日:2000-04-07

    申请号:JP25739099

    申请日:1999-09-10

    Abstract: PROBLEM TO BE SOLVED: To provide a multi-port variable capacitor based on an MEMS(micro electromechanical system). SOLUTION: A circuit element is provided with a movable plate 308 supported on first and second coplanar fixed electrodes. A bias power source 324 is electrically connected to the first fixed electrode 316 and the plate 308, and applies a bias voltage V1 across the electrode 316 and plate 308. An AC signal carrying line is electrically connected to the fixed second electrode 322 and plate 308. When the bias voltage V1 is applied, an electrostatic attracting force acts between the first electrode 316 and plate 308. Consequently, the plate 308 moves downward toward the electrode 316 and the distance between the plate 308 and electrode 316 is reduced. Accordingly, the capacitance of a multi-port variable capacitor 302 increases. In this capacitor 302, the bias voltages and signals are electrically separated (isolated) from each other.

    METHOD FOR MANUFACTURING PIEZOELECTRIC FILM BY USING ROTATING MAGNETRON SPUTTERING SYSTEM

    公开(公告)号:JP2001279438A

    公开(公告)日:2001-10-10

    申请号:JP2001033034

    申请日:2001-02-09

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric film for a resonator with quality assurance used for an electronic device, particularly an RF filter. SOLUTION: The method consists of a step determining the surface roughness of an insulating substrate on which a piezoelectric film is to be deposited and a step reducing the surface roughness sufficiently to attain a high quality piezoelectric film. The reduction of the surface roughness of the insulating substrate can be attained by using a rotating magnet magnetron system in order to improve the uniformity of the deposit film. Moreover, the high quality piezoelectric film can be assured by setting a crossover point of a reactant gas and/or by monitoring and calibrating the surface roughness of the insulating substrate by trial manufacturing of piezoelectric films.

    ISOLATING METHOD AND ACOUSTIC RESONANCE DEVICE

    公开(公告)号:JP2001223410A

    公开(公告)日:2001-08-17

    申请号:JP2001026212

    申请日:2001-02-02

    Abstract: PROBLEM TO BE SOLVED: To isolate a bulk acoustic device like an acoustic resonator from adverse influence which is exerted on efficiency and performance of the device by a wave generated in the lateral direction of the device. SOLUTION: A method which isolates a piezoelectric thin film acoustic resonance device is provided in order to prevent a wave which is generated with the device and propagates in the lateral direction from leaving the device and/or interfering with an adjacent device or a system. Especially, this isolation technique includes operation or isolation of a piezoelectric material layer between the devices, in order to restrain the quantity of acoustic energy which leaves the device and propagates in the lateral direction. In one embodiment, at least a part of piezoelectric material which is not relative to signal transmission due to conversion between RF energy and acoustic energy is eliminated from the device. In other embodiment, growth of the piezoelectric material is restricted within a specified region during manufacturing the device. Further in other embodiment, in order to form a region having superior piezoelectric characteristic and a region where piezoelectric characteristic is low, crystal orientation of the piezoelectric material is interrupted or changed during manufacturing the device.

    ARTICLE HAVING PASSIVE SELF-ASSEMBLY INDUCTOR

    公开(公告)号:JP2000150251A

    公开(公告)日:2000-05-30

    申请号:JP25568699

    申请日:1999-09-09

    Abstract: PROBLEM TO BE SOLVED: To provide an MEMS(microelectromachining system) type inductor capable of monolithic integration. SOLUTION: An inductor 102 is constituted of a conductive loop 104, whose one or more coils are suspended above the upper part of a substrate 100 by at least two conductive supports 110 and 114, including a passive self-assembly means. In an example, the passive self-assembly means includes a layer, having a high level specific stress provided on the conductive supports 110 and 114. A stress layer is accumulated on the structure layer (for example, polysilicon) of the conductive supports 110 and 114. When the structure of the supports of the inductor is 'released' in manufacture process by removing a certain sacrificial layer, the stress layer contracts and residual distortion can be reduced. As a result, an upward force is impressed to the free edge of the supports to which the conductive loop belongs. Thus, the supports 110 and 114 and the loop can be separated and lifted up from the substrate 100.

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