公开(公告)号：IT201900009651A1

公开(公告)日：2020-12-20

申请号：IT201900009651

申请日：2019-06-20

Applicant: ST MICROELECTRONICS SRL

Inventor： GATTERE GABRIELE ,  RIZZINI FRANCESCO ,  TOCCHIO ALESSANDRO

IPC: H01L20060101

公开(公告)号：IT201600098502A1

公开(公告)日：2018-03-30

申请号：IT201600098502

申请日：2016-09-30

Applicant: ST MICROELECTRONICS SRL

Inventor： GATTERE GABRIELE ,  TOCCHIO ALESSANDRO ,  VALZASINA CARLO

IPC: G01C19/5726 ,  G01C19/574 ,  G01C19/5755

公开(公告)号：IT201900024475A1

公开(公告)日：2021-06-18

申请号：IT201900024475

申请日：2019-12-18

Applicant: ST MICROELECTRONICS SRL

Inventor： DARMANIN JEAN MARIE ,  VALZASINA CARLO ,  TOCCHIO ALESSANDRO ,  GATTERE GABRIELE

IPC: G01P20060101

公开(公告)号：IT201900000190A1

公开(公告)日：2020-07-08

申请号：IT201900000190

申请日：2019-01-08

Applicant: ST MICROELECTRONICS SRL

Inventor： RIZZINI FRANCESCO ,  TOCCHIO ALESSANDRO

IPC: B81B20060101

公开(公告)号：IT201700057086A1

公开(公告)日：2018-11-25

申请号：IT201700057086

申请日：2017-05-25

Applicant: ST MICROELECTRONICS SRL

Inventor： GATTERE GABRIELE ,  TOCCHIO ALESSANDRO ,  VALZASINA CARLO

公开(公告)号：IT201600110354A1

公开(公告)日：2018-05-03

申请号：IT201600110354

申请日：2016-11-03

Applicant: ST MICROELECTRONICS SRL

Inventor： TOCCHIO ALESSANDRO ,  RIZZINI FRANCESCO

IPC: G01P15/125 ,  G01P15/18

公开(公告)号：IT201600083804A1

公开(公告)日：2018-02-09

申请号：IT201600083804

申请日：2016-08-09

Applicant: ST MICROELECTRONICS SRL

Inventor： TOCCHIO ALESSANDRO ,  CORSO LORENZO

公开(公告)号：ITUB20154017A1

公开(公告)日：2017-03-30

申请号：ITUB20154017

申请日：2015-09-30

Applicant: ST MICROELECTRONICS SRL

Inventor： TOCCHIO ALESSANDRO ,  VALZASINA CARLO ,  GUERINONI LUCA ,  ALLEGATO GIORGIO

IPC: H01L23/13 ,  G01L19/14 ,  H01L21/56

Abstract: An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.