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    2.
    发明专利
    未知

    公开(公告)号：ITUB20154667A1

    公开(公告)日：2017-04-14

    申请号：ITUB20154667

    申请日：2015-10-14

    Applicant: ST MICROELECTRONICS SRL

    Inventor： TOCCHIO ALESSANDRO ,  RIZZINI FRANCESCO ,  GUERINONI LUCA

    IPC: G01P15/125 ,  G01C19/5755 ,  G01P15/08

    Abstract: A MEMS sensor device (41) provided with a sensing structure (20), having: a substrate (2) with a top surface (2a) extending in a horizontal plane (xy); an inertial mass (30), suspended over the substrate (2); elastic coupling elements (32), elastically connected to the inertial mass (30) so as to enable inertial movement thereof with respect to the substrate (2) as a function of a quantity to be detected along a sensing axis (x) belonging to the horizontal plane (xy); and sensing electrodes (35a, 35b), capacitively coupled to the inertial mass (30) so as to form at least one sensing capacitor (C 1 , C 2 ), a value of capacitance of which is indicative of the quantity to be detected. The sensing structure (20) moreover has a suspension structure (21), to which the sensing electrodes (35a, 35b) are rigidly coupled, and to which the inertial mass (30) is elastically coupled through the elastic coupling elements (32); the suspension structure (21) is connected to an anchorage structure (23), fixed with respect to the substrate (2), by means of elastic suspension elements (28).

    4.
    发明专利
    未知

    公开(公告)号：ITUB20154017A1

    公开(公告)日：2017-03-30

    申请号：ITUB20154017

    申请日：2015-09-30

    Applicant: ST MICROELECTRONICS SRL

    Inventor： TOCCHIO ALESSANDRO ,  VALZASINA CARLO ,  GUERINONI LUCA ,  ALLEGATO GIORGIO

    IPC: H01L23/13 ,  G01L19/14 ,  H01L21/56

    Abstract: An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

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