9.
    发明专利
    未知

    公开(公告)号:ITUB20154017A1

    公开(公告)日:2017-03-30

    申请号:ITUB20154017

    申请日:2015-09-30

    Abstract: An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

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