-
公开(公告)号:ITUA20162172A1
公开(公告)日:2017-10-01
申请号:ITUA20162172
申请日:2016-03-31
Applicant: ST MICROELECTRONICS SRL , MILANO POLITECNICO
Inventor: TOCCHIO ALESSANDRO , RIZZINI FRANCESCO , VALZASINA CARLO , LANGFELDER GIACOMO
IPC: G01P15/125
-
公开(公告)号:ITTO20120542A1
公开(公告)日:2013-12-21
申请号:ITTO20120542
申请日:2012-06-20
Applicant: ST MICROELECTRONICS SRL
Inventor: ALLEGATO GIORGIO , CORSO LORENZO , SIMONI BARBARA , VALZASINA CARLO
-
公开(公告)号:IT201700124320A1
公开(公告)日:2019-05-01
申请号:IT201700124320
申请日:2017-10-31
Applicant: ST MICROELECTRONICS SRL , MILANO POLITECNICO
Inventor: VALZASINA CARLO , GATTERE GABRIELE , TOCCHIO ALESSANDRO , LANGFELDER GIACOMO
-
公开(公告)号:ITUA20162160A1
公开(公告)日:2017-10-01
申请号:ITUA20162160
申请日:2016-03-31
Applicant: ST MICROELECTRONICS SRL
Inventor: GATTERE GABRIELE , VALZASINA CARLO , FALORNI LUCA GIUSEPPE
IPC: G01C19/5712
-
公开(公告)号:ITTO20110806A1
公开(公告)日:2013-03-13
申请号:ITTO20110806
申请日:2011-09-12
Applicant: ST MICROELECTRONICS SRL
Inventor: VALZASINA CARLO , ZERBINI SARAH
-
公开(公告)号:ITTO20110779A1
公开(公告)日:2013-02-27
申请号:ITTO20110779
申请日:2011-08-26
Applicant: ST MICROELECTRONICS SRL
Inventor: FERRARI PAOLO , VALZASINA CARLO , VIGNA BENEDETTO , ZERBINI SARAH
-
公开(公告)号:IT201900024475A1
公开(公告)日:2021-06-18
申请号:IT201900024475
申请日:2019-12-18
Applicant: ST MICROELECTRONICS SRL
Inventor: DARMANIN JEAN MARIE , VALZASINA CARLO , TOCCHIO ALESSANDRO , GATTERE GABRIELE
IPC: G01P20060101
-
公开(公告)号:IT201700057086A1
公开(公告)日:2018-11-25
申请号:IT201700057086
申请日:2017-05-25
Applicant: ST MICROELECTRONICS SRL
Inventor: GATTERE GABRIELE , TOCCHIO ALESSANDRO , VALZASINA CARLO
-
公开(公告)号:ITUB20154017A1
公开(公告)日:2017-03-30
申请号:ITUB20154017
申请日:2015-09-30
Applicant: ST MICROELECTRONICS SRL
Inventor: TOCCHIO ALESSANDRO , VALZASINA CARLO , GUERINONI LUCA , ALLEGATO GIORGIO
Abstract: An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.
-
公开(公告)号:IT201700057094A1
公开(公告)日:2018-11-25
申请号:IT201700057094
申请日:2017-05-25
Applicant: ST MICROELECTRONICS SRL
Inventor: GATTERE GABRIELE , CORSO LORENZO , TOCCHIO ALESSANDRO , VALZASINA CARLO
-
-
-
-
-
-
-
-
-