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    POLYIMIDE HAVING EXCELLENT THERMAL STABILITY AND PRODUCTION THEREOF
    11.
    发明专利
    POLYIMIDE HAVING EXCELLENT THERMAL STABILITY AND PRODUCTION THEREOF 失效

    公开(公告)号：JPH055033A

    公开(公告)日：1993-01-14

    申请号：JP30507191

    申请日：1991-11-20

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  KOGA NOBUSHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10

    Abstract: PURPOSE:To obtain a polyimide having excellent heat-resistant stability, maintaining the stability for many hours by blocking molecular ends of a polymer molecule with a dicarboxylic acid anhydride containing a specific repeating structural unit. CONSTITUTION:A polyimide having a structural unit shown by formula II wherein molecular ends of a polymer molecule are sealed with a dicarboxylic acid anhydride shown by formula I (Z is bifunctional group selected from 6-15C monocyclic aromatic residue which does not substantially contain substituent group or is replaced with a group having no reactivity with amine or dicarboxylic acid anhydride, condensed polycyclic aromatic residue and noncondensed polycyclic aromatic group wherein aromatic groups are directly connected or mutually bonded through crosslinking member). The polyimide is obtained by reacting a diamine compound shown by formula III with 0.9-1.0mol based on 1mol diamine compound of a tetracarboxylic acid dianhydride shown by formula IV in the presence of 0.001-1.0mol based on 1mol diamine compound of a dicarboxylic acid anhydride shown by formula I.

    POLYAMIDE RESIN AND ITS COMPOSITION
    12.
    发明专利
    POLYAMIDE RESIN AND ITS COMPOSITION 失效

    公开(公告)号：JPH04249532A

    公开(公告)日：1992-09-04

    申请号：JP41550790

    申请日：1990-12-28

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： KATAOKA TOSHIYUKI ,  OIKAWA HIDEAKI ,  KOGA NOBUSHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G69/28 ,  C08G69/32 ,  C08K7/02 ,  C08L77/00 ,  C08L77/10

    Abstract: PURPOSE:To improve mechanical strengths, dimensional stability, heat resistance, and processability, and reduce water absorption by polycondensing a specific diamine with an arom. dicarboxylic acid dihalide in the presence of a dehydrohalogenating agent. CONSTITUTION:A diamine component comprising 6,6'-bis(4- aminophenoxy)-3,3,3',3'-tetramethyl-1,1'-spiroinadane and/or 6,6-bis(3- aminophenoxy)-3,3,3',3'-tetramethyl-1,1'-spiroindane of formula I is polycondensed with an arom. dicarboxylic acid dihalide in the presence of a dehydrohalogenating agent in an org. solvent at 60 deg.C or lower to give an arom. polyamide of formula II [wherein X is a condensed polycyclic arom. group or a group of formula III {wherein Y is a direct bond, -O-, -S-, -SO2-, -CH2-, -C(CH3)2-, or -C(CF3)2-; R is 1-4C alkyl, alkoxy, halogen, or phenyl; a is 0-2; and b is 0-4}; and n is 1-1000].

    AROMATIC POLYETHER KETONE-BASED RESIN VARNISH AND ITS PREPARATION
    13.
    发明专利
    AROMATIC POLYETHER KETONE-BASED RESIN VARNISH AND ITS PREPARATION 失效

    公开(公告)号：JPH0476077A

    公开(公告)日：1992-03-10

    申请号：JP18788490

    申请日：1990-07-18

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OTA MASAHIRO ,  OIKAWA HIDEAKI ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO

    IPC: C09D171/10 ,  C09D163/00

    Abstract: PURPOSE:To obtain an aromatic polyether ketone-based resin varnish which is effective for use in a coating material, a coating agent, a sealer and an adhesive varnish by incorporating a specific amount of an aromatic polyether ketone-based resin having a specific repeating unit. CONSTITUTION:0.01 to 30wt.% of one or more aromatic polyether ketone-based resins having a repeating unit represented by any one of formulae I to V is dissolved preferably in a phenol-based solvent (e.g. p-chlorophenol) at 20 to 30O deg.C, followed by adding into a varnish.

    POLYIMIDE RESIN COMPOSITION
    14.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH0441560A

    公开(公告)日：1992-02-12

    申请号：JP14867390

    申请日：1990-06-08

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OTA MASAHIRO ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO

    IPC: C08L67/02 ,  C08G73/10 ,  C08L67/00 ,  C08L79/08

    Abstract: PURPOSE:To improve moldability while maintaining excellent characteristics inherent in a polyimide resin by compounding a specific polyimide resin with a polyester resin. CONSTITUTION:An arom. diamine of formula I is allowed to react with a tetracarboxylic acid dianhydride of formula II (wherein R is a 2C or higher aliph. group, a cycloaliph. group, a monocyclic arom. group, a condensed polycyclic arom. group, or a non-condensed polycyclic arom. group wherein arom groups are combined with each other directly or through a crosslinking member) in an org. solvent at 0-250 deg.C for 30min to 24hr to give a polyamic acid, which is imidized to give a polyamide resin having repeating units of formula III. 99.9-50wt.% said resin is compounded with 0.1-50wt.% flowability improver comprising a polyester resin, e.g., one capable of forming an anisotropic melt phase at 420 deg.C or lower.

    THERMOSETTING RESIN COMPOSITION
    15.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPH0418443A

    公开(公告)日：1992-01-22

    申请号：JP33525690

    申请日：1990-11-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C08L35/00 ,  C08F20/52 ,  C08F222/40 ,  C08G59/40 ,  C08G59/56 ,  C08G73/12 ,  C08L33/24

    Abstract: PURPOSE:To obtain a composition, excellent in heat resistance and quick curability and suitable for impregnation, prepregs, etc., by blending a specific maleimide compound with an aliphatic maleimide and, as necessary, an amino compound and/or an epoxy resin. CONSTITUTION:A thermosetting resin composition is obtained by blending (A) 2-99wt.% maleimide compound (e.g. N-(o-vinylphenyl)maleimide) selected from N-(alkenylphenyl) maleimide derivatives expressed by the formula [R1 to R6 are H, halogen, 1-10C alkyl, etc.; X is H, halogen, carboxyl, etc.; m1 to m3 are 0-4; (m1+-m2+m3) is 5; R7 is 1-10C alkyl, etc.], dimers and polymers thereof with (B) 98-1wt.% one or more aliphatic maleimides (e.g. N-2,2'- hydroxyethoxyethylmaleimide), as necessary, (C) an amino compound and/or (D) an epoxy resin.

    THERMOSETTING RESIN COMPOSITION
    16.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPH0418408A

    公开(公告)日：1992-01-22

    申请号：JP33525590

    申请日：1990-11-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C08F22/40 ,  C08F20/52 ,  C08F22/36 ,  C08F222/40 ,  C08F290/00 ,  C08F299/00 ,  C08G59/40 ,  C08G59/56 ,  C08G73/12 ,  H05K1/03

    Abstract: PURPOSE:To obtain the subject new composition having excellent solubility in an organic solvent, heat resistance and quick curing property with a low melting point comprising a specific maleimide compound, ether bonding- containing aliphatic maleimide and an epoxy resin. CONSTITUTION:The aimed composition is composed of (A) a maleimide compound [e.g. N-(O-vinyl phenyl) maleimide] selected from an N-(alkenyl phenyl) maleimide derivative expressed by the formula (R to R are H or halogen, etc.; X is H or carboxyl, etc.; m1 to m3 are 0-4 with a proviso that m1+m2+m3=5), dimer of the derivative and polymer of the derivative, (B) an ether bonding- containing aliphatic maleimide (e.g., N-2,2'-hydroxyethoxyethyl maleimide) and (C) an epoxy resin. Besides, each component is preferably mixed so as the component A to be 5-95wt.% to total amount of the components A and B and as the component C to be

    POLYIMIDE RESIN COMPOSITION
    18.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH03195772A

    公开(公告)日：1991-08-27

    申请号：JP33481489

    申请日：1989-12-26

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OTA MASAHIRO ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO

    IPC: C08L67/02 ,  C08L67/00 ,  C08L67/03 ,  C08L79/08

    Abstract: PURPOSE:To obtain the title composition extremely good in fluidity when melted without impairing the characteristics inherent in polyimide by incorporating a specific polyimide with a specified amount of a polyester resin. CONSTITUTION:(A) 99.9-50wt.% of a polyimide having recurring unit of formula III, produced by either heating dehydration or imidation using an imidating agent of a polyamic acid having recurring unit of formula II (R is tetravalent group selected from 2C aliphatic group, alicyclic group, monocyclic aromatic group, etc.) prepared by reaction between an aromatic diamine of formula I and at least one tetracarboxylic dianhydride and (B) 0.1-50wt.% of a polyester resin [e.g. (aromatic) polyester capable of forming an anisotropic melt phase at

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