公开(公告)号：FR2726205B1

公开(公告)日：1997-09-26

申请号：FR9511552

申请日：1995-10-02

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  MAGERA YAROSLAW A ,  BROWN VERNON L

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/18 ,  B05D5/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To generate catalytic islands around a small granular metal oxide and to form a sufficient quantity of solid copper thereon by a method, wherein a conductor, a via or a pad exposes a resin and a small granular metal oxide on the surface thereof at a required part, before a circuit board is immersed into a reducing solution. SOLUTION: A two derivative continuous processing board is reduced for 5 min in a solution of 1.0 mol. hydrogenated boron and 0.25 mol. EDTA. The substrate is then cleaned with deionized water and immersed into ion palladium solution for 10 seconds. Subsequently, it is cleaned with deionized water and left as it is for 2 minutes in an electroless bath. According to the method, the deriving time is shortened, while increasing the density at the bonding part and the size of copper particle plating the conductors, pads and vias on a circuit board can be reduced.

公开(公告)号：DE19544514C2

公开(公告)日：1997-07-10

申请号：DE19544514

申请日：1995-11-29

Applicant: MOTOROLA INC

Inventor： MAGERA YAROSLAW A ,  SAVIC JOVICA ,  BROWN VERNON L

IPC: C23C18/16 ,  C23C18/28 ,  H05K3/18 ,  C23C18/20 ,  C23C18/31

Abstract: A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu2O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.

公开(公告)号：FR2726205A1

公开(公告)日：1996-05-03

申请号：FR9511552

申请日：1995-10-02

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  MAGERA YAROSLAW A ,  BROWN VERNON L

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/18 ,  B05D5/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To generate catalytic islands around a small granular metal oxide and to form a sufficient quantity of solid copper thereon by a method, wherein a conductor, a via or a pad exposes a resin and a small granular metal oxide on the surface thereof at a required part, before a circuit board is immersed into a reducing solution. SOLUTION: A two derivative continuous processing board is reduced for 5 min in a solution of 1.0 mol. hydrogenated boron and 0.25 mol. EDTA. The substrate is then cleaned with deionized water and immersed into ion palladium solution for 10 seconds. Subsequently, it is cleaned with deionized water and left as it is for 2 minutes in an electroless bath. According to the method, the deriving time is shortened, while increasing the density at the bonding part and the size of copper particle plating the conductors, pads and vias on a circuit board can be reduced.

公开(公告)号：FR2679926B1

公开(公告)日：1995-08-18

申请号：FR9209583

申请日：1992-07-31

Applicant: MOTOROLA INC

Inventor： BROWN VERNON L ,  JOHNSON JULIA S ,  MAGERA YAROSLAW A

IPC: C23C18/16 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C23C18/20 ,  C23C18/28 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

Abstract: A unique process metallizes a substrate surface using a reducing agent including a borohydride to reduce, in a starved reaction, metal oxide particles (300) substantially uniformly distributed and at a controlled concentration in a particle-filled resin (204) to produce catalytic island areas (301). The catalytic island areas (301) formed have a surface resistivity greater than 106 ohms per square. These catalytic island areas (301) are then electrolessly metallized to a predetermined thickness, such that adjacent catalytic island areas (301) are interconnected and form metallic features, such as pads, vias (213), and conductors (210, 211 and 212). The starved reaction limits the reduction of metal oxide particles (300) to catalytic island areas (301) and prevents migration of reduced metal beyond each of the exposed surfaces of particle-filled resin (204) which are to be metallized.

公开(公告)号：FR2679926A1

公开(公告)日：1993-02-05

申请号：FR9209583

申请日：1992-07-31

Applicant: MOTOROLA INC

Inventor： BROWN VERNON L ,  JOHNSON JULIA S ,  MAGERA YAROSLAW A

IPC: C23C18/16 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C23C18/20 ,  C23C18/28 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

Abstract: A unique process metallizes a substrate surface using a reducing agent including a borohydride to reduce, in a starved reaction, metal oxide particles (300) substantially uniformly distributed and at a controlled concentration in a particle-filled resin (204) to produce catalytic island areas (301). The catalytic island areas (301) formed have a surface resistivity greater than 106 ohms per square. These catalytic island areas (301) are then electrolessly metallized to a predetermined thickness, such that adjacent catalytic island areas (301) are interconnected and form metallic features, such as pads, vias (213), and conductors (210, 211 and 212). The starved reaction limits the reduction of metal oxide particles (300) to catalytic island areas (301) and prevents migration of reduced metal beyond each of the exposed surfaces of particle-filled resin (204) which are to be metallized.