Abstract:
A method of encapsulating a crystal oscillator (100). First, a dielectric material is assembled or connected to the bottom side of a lead frame (102). Second, oscillator components including a piezoelectric element, capacitors and an integrated circuit are attached on the lead frame (104). Third, an epoxy dam is dispensed around the periphery of the oscillator component locations (106). Fourth, an encapsulant is dispensed within the epoxy dam to encapsulate the oscillator components (108). Fifth, the epoxy dam and encapsulant are cured (110). Thereafter, the oscillator is singulated from the lead frame and the leads are formed for mounting (112).
Abstract:
A method of manufacturing is employed to produce a size-reduced frequency control device (300), according to the present invention. A temperature compensation circuit (304) and an unsealed piezoelectric element (302) are disposed on a substrate (306) such that the compensation circuit and the unsealed piezolectric element are electrically connected. A hermetic seal (318) is established between a lid (308) and the substrate such that the unsealed piezoelectric element and at least a temperature sensitive portion of the temperature compensation circuit occupy a sealed environment (320). In this manner, dimensions (322, 324) of the frequency control device are reduced.
Abstract:
A surface mountable piezoelectric device that includes an in situ finish plate mask is mounted on a substrate (20) that includes feedthrough holes (26, 28 and 30) to conduct signals from a piezoelectric element (40) that may include multiple resonator stages (48, 46, 50 and 56). A metallic support structure (70), which acts as a finish plate mask, includes windows or holes therethrough (72, 74 and 76) permits tuning of the piezoelectric device by mass loading during manufacturing, compliantly supports the piezoelectric element (40), provides RF shielding for the resonators, and is an in situ finish plate mask.
Abstract:
A piezoelectric component-mounting foil and foil making method are disclosed, whereby a first portion (102) of the foil in a first plane substantially parallel to a second portion (124) of the foil in a second plane are connected by a central portion (108) not in the first or second plane, the central portion (108) having at least one width dimension (120) of the central portion (108) less than at least one length dimension (122) of the central portion (108). A conductive foil material, appropriate thickness, overall geometry, and if desired, appropriate notch configuration are selected for a desired implementation of the foil for conductively attaching and at least partially supporting at least one piezoelectric component (904) such as a quartz crystal.
Abstract:
A function-differentiated temperature compensated crystal oscillator (10) is disclosed having an integrated circuit, at least one capacitor and a piezoelectric element being electrically coupled to a leadframe, and being encapsulated in a molded package body (36). The leadframe includes two pluralities of leads (20, 26), each plurality accessing different functionalities of the temperature compensated crystal oscillator. In accordance with one embodiment of this invention, the first plurality of leads (20) may be excised preventing user access to internal functions of the oscillator. In accordance with another embodiment of this invention, the second plurality of leads (26) may be excised allowing user access to the internal functions of the oscillator. This configuration enables a single package to be used for different user applications and functions.
Abstract:
A method of manufacturing is employed to produce a size-reduced frequency control device (300), according to the present invention. A temperature compensation circuit (304) and an unsealed piezoelectric element (302) are disposed on a substrate (306) such that the compensation circuit and the unsealed piezolectric element are electrically connected. A hermetic seal (318) is established between a lid (308) and the substrate such that the unsealed piezoelectric element and at least a temperature sensitive portion of the temperature compensation circuit occupy a sealed environment (320). In this manner, dimensions (322, 324) of the frequency control device are reduced.
Abstract:
A method of mounting a piezoelectric element (102) with a substrate (106). First, a compliant material is dispensed on at least one side of the substrate and cured. Next, a first conductive adhesive (112) is applied on the other side of the substrate. Third, a piezoelectric element is positioned over the substrate. Thereafter, a second compliant conductive adhesive (113) is selectively dispensed such that it contacts an upper portion of one side of the piezoelectric element and the substrate.