FUNCTION-DIFFERENTIATED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR AND METHOD OF PRODUCING THE SAME
    1.
    发明申请
    FUNCTION-DIFFERENTIATED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR AND METHOD OF PRODUCING THE SAME 审中-公开
    功能差分温度补偿晶体振荡器及其生产方法

    公开(公告)号:WO1997014183A1

    公开(公告)日:1997-04-17

    申请号:PCT/US1996012726

    申请日:1996-08-05

    Applicant: MOTOROLA INC.

    Abstract: A function-differentiated temperature compensated crystal oscillator (10) is disclosed having an integrated circuit, at least one capacitor and a piezoelectric element being electrically coupled to a leadframe, and being encapsulated in a molded package body (36). The leadframe includes two pluralities of leads (20, 26), each plurality accessing different functionalities of the temperature compensated crystal oscillator. In accordance with one embodiment of this invention, the first plurality of leads (20) may be excised preventing user access to internal functions of the oscillator. In accordance with another embodiment of this invention, the second plurality of leads (26) may be excised allowing user access to the internal functions of the oscillator. This configuration enables a single package to be used for different user applications and functions.

    Abstract translation: 公开了一种功能分化温度补偿晶体振荡器(10),其具有集成电路,至少一个电容器和压电元件电耦合到引线框架,并被封装在模制封装主体(36)中。 引线框架包括两个多个引线(20,26),每个引线都访问温度补偿晶体振荡器的不同功能。 根据本发明的一个实施例,可以切除第一组多个引线(20),防止用户访问振荡器的内部功能。 根据本发明的另一个实施例,可以切除第二多个引线(26),以允许用户访问振荡器的内部功能。 此配置使单个包可以用于不同的用户应用程序和功能。

    DOUBLE-SIDED OSCILLATOR PACKAGE AND METHOD OF COUPLING COMPONENTS THERETO
    2.
    发明申请
    DOUBLE-SIDED OSCILLATOR PACKAGE AND METHOD OF COUPLING COMPONENTS THERETO 审中-公开
    双面振荡器封装及其耦合元件的方法

    公开(公告)号:WO1995015577A1

    公开(公告)日:1995-06-08

    申请号:PCT/US1994012276

    申请日:1994-10-24

    Applicant: MOTOROLA INC.

    Abstract: A double-sided oscillator package and method of coupling components thereto. A package (100) having an open-top receptacle (112) adapted to receive electronic components (126, 128, 130) and an open-bottom receptacle (114) adapted to receive a piezoelectric element (134) and a cover (116) for hermetically sealing the open-bottom receptacle (114). The electronic components (126, 128, 130) and piezoelectric element (134) are electrically connected. A hermetic environment (118) is established by coupling the cover (116) and open-bottom receptacle (114).

    Abstract translation: 一种双面振荡器封装及其组件耦合的方法。 具有适于容纳电子部件(126,128,130)的开口插座(112)和适于容纳压电元件(134)和盖子(116)的开放底部插座(114)的封装件(100) 用于气密地密封开口底部容器(114)。 电子部件(126,128,130)和压电元件(134)电连接。 通过联接盖(116)和开口底部容器(114)来建立密封环境(118)。

    SHIELDING APPARATUS FOR NON-CONDUCTIVE ELECTRONIC CIRCUIT PACKAGE
    3.
    发明申请
    SHIELDING APPARATUS FOR NON-CONDUCTIVE ELECTRONIC CIRCUIT PACKAGE 审中-公开
    非导电电子电路封装的屏蔽装置

    公开(公告)号:WO1992016095A1

    公开(公告)日:1992-09-17

    申请号:PCT/US1992001218

    申请日:1992-02-13

    Applicant: MOTOROLA, INC.

    CPC classification number: H05K9/0039 H01L2924/1617 Y10T29/42

    Abstract: A shielding apparatus for a non-conductive package having an insulated lid (102) is disclosed. The insulated lid (102) is retained in contact with a substrate (104) which holds an electrical circuit. The shielding apparatus includes a first conductive flash (201) deposited on the interior surface of the insulated lid (102), to produce a substantially contiguous conduction layer, and a second conductive flash (203) deposited over a film (110) disposed on the edge of the insulated lid (102), to produce a partially contiguous conduction layer. The shielding apparatus also includes a means (108) for affixing the insulated lid (102) to the substrate (104), to produce an enclosure for isolating the electrical circuit from extraneous radio frequency (RF) energy.

    Abstract translation: 公开了一种用于具有绝缘盖(102)的非导电封装的屏蔽装置。 绝缘盖(102)与保持电路的基板(104)保持接触。 屏蔽装置包括沉积在绝缘盖(102)的内表面上的第一导电闪光(201),以产生基本上邻接的传导层,以及沉积在设置在所述绝缘盖上的膜(110)上的第二导电闪光(203) 绝缘盖(102)的边缘,以产生部分邻接的导电层。 屏蔽装置还包括用于将绝缘盖(102)固定到基板(104)的装置(108),以产生用于将电路与外部射频(RF)能量隔离的外壳。

    AN ULTRASONICALLY MOUNTED PIEZOELECTRIC DEVICE AND METHOD OF MAKING SAME
    4.
    发明申请
    AN ULTRASONICALLY MOUNTED PIEZOELECTRIC DEVICE AND METHOD OF MAKING SAME 审中-公开
    超声波安装压电器件及其制造方法

    公开(公告)号:WO1998019349A1

    公开(公告)日:1998-05-07

    申请号:PCT/US1997015106

    申请日:1997-08-27

    Applicant: MOTOROLA INC.

    CPC classification number: H03H9/0519

    Abstract: A method and device for mounting a piezoelectric element in a package without the use of adhesives. The piezoelectric device includes a substrate (104) with at least two electrical traces (118), a piezoelectric element (102) with a top electrode (108) and a bottom electrode (106), and a wirebond ball bump (100). The ball bump is ultrasonically bonded to one of the electrical traces (118) on the substrate (104), and the bottom electrode (106) of the piezoelectric element (102) is ultrasonically bonded to the ball bump (100). A wirebond (110) connects the top electrode (108) with the remaining electrical trace (118) of the substrate (104). The device is provided in a conventionally sealed package.

    Abstract translation: 一种用于在不使用粘合剂的情况下将压电元件安装在包装中的方法和装置。 所述压电器件包括具有至少两个电迹线(118)的基底(104),具有顶部电极(108)和底部电极(106)的压电元件(102)和引线键球凸点(100)。 将球凸块超声波接合到基板(104)上的一个电迹线(118)上,并将压电元件(102)的底部电极(106)超声波接合到球凸块(100)上。 引线键(110)将顶部电极(108)与衬底(104)的剩余电迹线(118)连接。 该设备以常规密封的包装提供。

    METHOD OF MOUNTING A PIEZOELECTRIC ELEMENT TO A SUBSTRATE
    5.
    发明申请
    METHOD OF MOUNTING A PIEZOELECTRIC ELEMENT TO A SUBSTRATE 审中-公开
    将压电元件安装到基板的方法

    公开(公告)号:WO1995015013A1

    公开(公告)日:1995-06-01

    申请号:PCT/US1994012032

    申请日:1994-10-21

    Applicant: MOTOROLA INC.

    Abstract: A method of mounting a piezoelectric element (102) with a substrate (106). First, a compliant material is dispensed on at least one side of the substrate and cured. Next, a first conductive adhesive (112) is applied on the other side of the substrate. Third, a piezoelectric element is positioned over the substrate. Thereafter, a second compliant conductive adhesive (113) is selectively dispensed such that it contacts an upper portion of one side of the piezoelectric element and the substrate.

    Abstract translation: 一种用基板(106)安装压电元件(102)的方法。 首先,将柔性材料分配在基材的至少一侧并固化。 接下来,将第一导电粘合剂(112)施加在基板的另一侧上。 第三,压电元件位于衬底上。 此后,选择性地分配第二柔性导电粘合剂(113),使得其接触压电元件和基板的一侧的上部。

    SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION
    6.
    发明申请
    SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION 审中-公开
    密封电子包提供现场冶金

    公开(公告)号:WO1993016577A1

    公开(公告)日:1993-08-19

    申请号:PCT/US1992010366

    申请日:1992-11-27

    Applicant: MOTOROLA, INC.

    Abstract: In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by names of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (22). By attachment of appropriate electric potentials (2), electrode molecules can be sputtered onto the electrode surfaces adjusting the resonant frequency characteristics of a crystal filter.

    Abstract translation: 诸如压电元件(40)的电子设备的频率特性的现场调节可以通过封装在由基座(12)和盖(14)组成的封装内的预定气氛(18)来实现,并且 包含量的可溅射电极材料(22)。 通过附加适当的电位(2),可以将电极分子溅射到调节晶体滤波器的谐振频率特性的电极表面上。

    SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION
    7.
    发明公开
    SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION 失效
    ABGEDICHTETE ELEKTRONIK-PACKUNG ZUR IN-SITU METALLISIERUNG。

    公开(公告)号:EP0580826A1

    公开(公告)日:1994-02-02

    申请号:EP93900797.0

    申请日:1992-11-27

    Applicant: MOTOROLA, INC.

    Abstract: Un dispositif électronique tel qu'un élément piézoélectrique (40) peut être ajusté in situ à des caractéristiques de fréquence données à l'aide d'une atmosphère prédéterminée (18) enfermée dans un emballage composé d'une base (12) et d'un couvercle, (14) et d'une quantité incluse de matériau d'électrode pour métallisation au vide (22) L'application de potentiels électriques appropriés (2) permet de puvériser des mollécules d'électrode sur des surfaces d'électrode et d'ajuster ainsi les caractéristiques de fréquence de résonance d'un filtre à quartz.

    Abstract translation: 诸如压电元件(40)的电子设备的频率特性的原位调整可以通过封装在由基座(12)和盖(14)组成的封装内的预定气氛(18)来实现,并且 包含量的可溅射电极材料(22)。 通过附加适当的电位(2),可以将电极分子溅射到调节晶体滤波器的谐振频率特性的电极表面上。

    SURFACE MOUNTABLE PIEZOELECTRIC DEVICE WITH IN SITU FINISH PLATE MASK
    9.
    发明公开
    SURFACE MOUNTABLE PIEZOELECTRIC DEVICE WITH IN SITU FINISH PLATE MASK 失效
    压电器件用于安装在表面原位ENDMASKENPLATTE。

    公开(公告)号:EP0535219A1

    公开(公告)日:1993-04-07

    申请号:EP92912322.0

    申请日:1992-03-27

    Applicant: MOTOROLA, INC.

    IPC: H03H9

    CPC classification number: H03H9/1007 H03H9/56

    Abstract: Un dispositif piezoélectrique montable en surface comprenant un masque se présentant sous la forme d'une plaque de finition in situ est monté sur un substrat (20) comprenant des trous de traversée (26, 28 et 30) permettant de conduire des signaux d'un élément piezoélectrique (40) pouvant comporter des étages de résonateurs multiples (48, 46, 50 et 56). Une structure de support métallique (70) faisant office de masque sous forme de plaque de finition comprend des fenêtres ou des trous traversants (72, 74 et 76), elle permet la syntonisation du dispositif piezoélectrique par chargement en masse pendant la production, elle supporte de manière adaptable l'élément piezoélectrique (40), elle assure une protection HF pour les résonateurs, et elle constitue un masque se présentant sous la forme d'une plaque de finition in situ.

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