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    Predeposited transient phase electronic interconnect media
    11.
    发明授权
    Predeposited transient phase electronic interconnect media 失效
    预沉积的瞬态电子互连介质

    公开(公告)号：US5964395A

    公开(公告)日：1999-10-12

    申请号：US868846

    申请日：1997-06-09

    Applicant: Andrew Z. Glovatsky ,  Mohan R. Paruchuri

    Inventor： Andrew Z. Glovatsky ,  Mohan R. Paruchuri

    IPC: B23K35/02 ,  B23K35/26 ,  C23C4/00 ,  C23C26/02 ,  H05K3/32 ,  H05K3/34 ,  B23K31/02 ,  B23K35/12

    CPC classification number: H05K3/3463 ,  B23K35/0222 ,  C23C26/02 ,  C23C4/00 ,  H05K3/328 ,  B23K35/26 ,  H05K2201/0373 ,  H05K2203/0495

    Abstract: A method of attaching an electronic component to a substrate comprising the steps of depositing a spray metal coating atop a substrate. An electronic component is placed atop a coating. A liquid metal is dispensed on or near the component. The liquid metal wets the component and the coating. The metal is reacted with the coating to form an electrically conductive bond with the substrate and adheres the component to the substrate. The reactive metal may be heated to a temperature which makes it liquid and facilitates wetting the coating and component. Suitable materials for the spray metal coating include copper, nickel, tin, bismuth, lead and silver and mixtures thereof. Suitable liquid metals generally include low melting temperature metals such as gallium and indium and mixtures thereof.

    Abstract translation: 一种将电子部件附接到基板的方法，包括以下步骤：在基板顶上沉积喷涂金属涂层。 将电子部件放置在涂层的顶部。 液体金属被分配在部件上或附近。 液体金属润湿组分和涂层。 金属与涂层反应以与基底形成导电结合并将组分粘合到基底上。 反应性金属可以被加热到使其成为液体并有助于润湿涂层和组分的温度。 用于喷涂金属涂层的合适材料包括铜，镍，锡，铋，铅和银及其混合物。 合适的液态金属通常包括低熔点金属如镓和铟及其混合物。

    Low-temperature solder compositions
    12.
    发明授权
    Low-temperature solder compositions 失效
    低温焊料组成

    公开(公告)号：US5871690A

    公开(公告)日：1999-02-16

    申请号：US939644

    申请日：1997-09-29

    Applicant: Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

    Inventor： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

    IPC: B23K35/26 ,  C22C13/02

    CPC classification number: B23K35/268 ,  B23K35/262

    Abstract: Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154.degree.-162.degree. C. The solder compositions have microstructure similarly to Sn/Pb eutectic microstructure which makes them have excellent properties like higher yield strength and better creep resistance providing long term reliability to solder joints.

    Abstract translation: 具有45-60％Sn之间的低温电焊料组成（重量百分比） 25-40％Pb; 5-15％Bi; 和0.5-2.5％。 优选地，焊料组合物的熔融温度为约154°-162℃。焊料组合物具有类似于Sn / Pb共晶组织的微结构，这使得它们具有优异的性能，例如更高的屈服强度和更好的抗蠕变性，为焊料提供长期的可靠性 关节。

    Lead-free solder compositions
    13.
    发明授权
    Lead-free solder compositions 失效
    无铅焊料组成

    公开(公告)号：US5863493A

    公开(公告)日：1999-01-26

    申请号：US771351

    申请日：1996-12-16

    Applicant: Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

    Inventor： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

    IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

    CPC classification number: C22C13/00 ,  B23K35/262 ,  B23K2201/36

    Abstract: Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.

    Abstract translation: 锡焊料组成（重量百分比）为91.5-96.5％Sn; 2-5％Ag; 0.1-3％Ni; 和0-2.9％Cu; 熔点220℃以下。 焊料组合物具有均匀分散的Sn-Ni，Sn-Cu和Sn-Cu-Ni金属间相的微细颗粒的微观结构，其在热循环期间提供对晶粒生长的抵抗力。

    Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates
    20.
    发明授权
    Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates 失效
    使用碱溶液（包括亚硝酸盐，硼酸盐或溴酸盐）蚀刻Al-Cu层以形成电子电路

    公开(公告)号：US06168725A

    公开(公告)日：2001-01-02

    申请号：US08996007

    申请日：1997-12-22

    Applicant: Achyuta Achari ,  Mohan R. Paruchuri

    Inventor： Achyuta Achari ,  Mohan R. Paruchuri

    IPC: C23F102

    CPC classification number: C23F1/36 ,  H05K3/062 ,  H05K3/067 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376

    Abstract: The invention is an aluminum etchant and method for chemically milling aluminum from, according to a preferred embodiment, a copper-aluminum-copper tri-metal layer to form three-dimensional circuits. The tri-metal comprises copper circuit patterns present on opposing surfaces of an aluminum foil, one of the copper patterns being laminated on a substrate. The etchant comprises an aqueous solution of 60 to 500 g/l base selected from (a) sodium hydroxide, (b) potassium hydroxide, and (c) their mixture; and 30 to 500 g/l of an additive selected from nitrite salt, a borate salt, a bromate salt, or mixture of any of them. The method comprises contacting the tri-metal with the etchant at a temperature between 25 and 95° C. for a time sufficient to remove a desired amount of the aluminum layer and provide (rigid, flexible, or 3-dimensional) electronic circuitry which may contain multiple conductive circuit layers.

    Abstract translation: 本发明是一种铝蚀刻剂和方法，用于根据优选实施方案从铜 - 铝 - 铜三金属层化学研磨铝以形成三维电路。 三金属包括存在于铝箔的相对表面上的铜电路图案，其中一个铜图案层压在基板上。 蚀刻剂包括选自（a）氢氧化钠，（b）氢氧化钾和（c）它们的混合物的60至500g / l碱的水溶液; 和30-500g / l的选自亚硝酸盐，硼酸盐，溴酸盐或它们的混合物的添加剂。 该方法包括使三金属与蚀刻剂在25℃和95℃之间的温度下接触足够的时间以除去所需量的铝层，并提供（刚性，柔性或3维）电子电路，其可以 包含多个导电电路层。

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