公开(公告)号：EP2978009A4

公开(公告)日：2016-12-28

申请号：EP14873693

申请日：2014-12-16

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  IWASAKI YASUNORI ,  TAKAGAKI TATSURO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H01L21/02 ,  C01F7/02 ,  C04B35/115 ,  C04B35/64 ,  C04B37/00 ,  H01L21/683 ,  H01L21/762 ,  H01L23/15 ,  H01L27/12 ,  H01L29/06

CPC classification number: H01L21/76254 ,  C01F7/02 ,  C01P2006/60 ,  C04B35/10 ,  C04B35/115 ,  C04B35/64 ,  C04B37/001 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/662 ,  C04B2235/786 ,  C04B2237/343 ,  C04B2237/70 ,  C04B2237/704 ,  H01L21/02002 ,  H01L21/6835 ,  H01L23/15 ,  H01L27/12 ,  H01L29/06 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381

Abstract: It is provided a handle substrate of a composite substrate for a semiconductor. The handle substrate is composed of a translucent polycrystalline alumina. A purity of alumina of the translucent polycrystalline alumina is 99.9% or higher, an average of a total forward light transmittance of the translucent polycrystalline alumina is 60% or higher in a wavelength range of 200 to 400 nm, and an average of a linear light transmittance of the translucent polycrystalline alumina is 15% or lower in a wavelength range of 200 to 400 nm.

公开(公告)号：EP2953157A4

公开(公告)日：2016-02-24

申请号：EP14877410

申请日：2014-10-15

Applicant: NGK INSULATORS LTD

Inventor： TAKAGAKI TATSURO ,  IWASAKI YASUNORI ,  MIYAZAWA SUGIO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H01L21/02 ,  C04B35/111 ,  C04B35/115 ,  H01L27/12

CPC classification number: H01L21/683 ,  C04B35/111 ,  C04B35/115 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6023 ,  C04B2235/6025 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/662 ,  C04B2235/945 ,  C04B2235/963 ,  C30B29/06 ,  H01L21/02002 ,  H01L21/2007 ,  H01L27/12 ,  H01L29/16 ,  Y10T428/21 ,  Y10T428/219 ,  Y10T428/24777

公开(公告)号：EP1491926A4

公开(公告)日：2006-05-17

申请号：EP03712968

申请日：2003-03-26

Applicant: NGK INSULATORS LTD

Inventor： FUKUYAMA MASASHI ,  IWASAKI YASUNORI ,  IDE AKIYOSHI

IPC: G02B6/12 ,  G02B6/36 ,  G02B6/42

CPC classification number: G02B6/3636 ,  G02B6/3652 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4249 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An optical device (100) comprising a first substrate (104) in which V-grooves (102) are made, four optical fibers (106), for example, having a reflective function and fixed in the V-grooves (102) of the first substrate (104), an optical element (110) bonded, through an adhesive layer (108), onto the optical path of a reflected light at least generated by the reflective function on the outside of the clad of each optical fiber (106), and a second substrate (112) for mounting the optical element (110), wherein the second substrate (112) is disposed such that the mounting surface (112a) of the optical element (110) faces the first substrate (104).

Abstract translation: 具有反射功能的光纤（106）固定在基板（104）的V形槽（102）中。 光学元件（110）通过粘合剂层（108）与纤维结合。 衬底（112）布置在光学元件（110）上，使得表面（112a）面向衬底（104）。 还包括用于光学器件制造方法的独立权利要求。

公开(公告)号：EP2916346A4

公开(公告)日：2016-04-20

申请号：EP14826358

申请日：2014-07-10

Applicant: NGK INSULATORS LTD

Inventor： IWASAKI YASUNORI ,  IDE AKIYOSHI ,  MIYAZAWA SUGIO

IPC: H01L21/02 ,  B32B18/00 ,  C04B35/115 ,  C04B35/634 ,  C04B37/00

CPC classification number: C04B35/44 ,  B32B18/00 ,  B32B2250/02 ,  B32B2305/026 ,  B32B2457/14 ,  C04B35/115 ,  C04B35/634 ,  C04B37/005 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/662 ,  C04B2235/775 ,  C04B2235/786 ,  C04B2235/963 ,  C04B2237/062 ,  C04B2237/30 ,  C04B2237/343 ,  C04B2237/52 ,  H01L21/2007 ,  H01L27/1203

公开(公告)号：EP2736065A4

公开(公告)日：2015-02-11

申请号：EP13820306

申请日：2013-07-16

Applicant: NGK INSULATORS LTD

Inventor： IWASAKI YASUNORI ,  IDE AKIYOSHI ,  HORI YUJI ,  TAI TOMOYOSHI ,  MIYAZAWA SUGIO

IPC: H01L21/02

CPC classification number: H01L29/06 ,  H01L21/02002 ,  H01L21/2007 ,  H01L21/762 ,  H01L21/76251

公开(公告)号：EP2116889A4

公开(公告)日：2011-10-05

申请号：EP08711429

申请日：2008-02-12

Applicant: NGK INSULATORS LTD

Inventor： MITOMI OSAMU ,  AOKI KENJI ,  KONDO JUNGO ,  IWATA YUICHI ,  EJIRI TETSUYA ,  IDE AKIYOSHI

IPC: G02F1/035

CPC classification number: G02F1/0356 ,  G02F1/0316 ,  G02F2203/50

公开(公告)号：EP3107116A4

公开(公告)日：2018-01-03

申请号：EP15748537

申请日：2015-01-13

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  IWASAKI YASUNORI ,  TAKAGAKI TATSURO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H01L21/02

CPC classification number: H01L29/16 ,  C04B35/115 ,  C04B35/6264 ,  C04B35/632 ,  C04B35/634 ,  C04B37/001 ,  C04B37/005 ,  C04B37/008 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6023 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/662 ,  C04B2235/786 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/52 ,  C04B2237/588 ,  C30B29/06 ,  C30B33/06 ,  H01L21/2007 ,  H01L29/0649 ,  Y10T428/24355

Abstract: A handle substrate of a composite substrate for a semiconductor is provided. The handle substrate is composed of polycrystalline alumina. The handle substrate includes an outer peripheral edge part with an average grain size of 20 to 55 µm and a central part with an average grain size of 10 to 50 µm. The average grain size of the outer peripheral edge part is 1.1 times or more and 3.0 times or less of that of the central part of the handle substrate.

公开(公告)号：EP3113586A4

公开(公告)日：2017-10-25

申请号：EP15754711

申请日：2015-02-20

Applicant: NGK INSULATORS LTD

Inventor： TAKAGAKI TATSURO ,  IWASAKI YASUNORI ,  MIYAZAWA SUGIO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H05K1/03 ,  C04B35/111 ,  H05K3/00

CPC classification number: H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.

公开(公告)号：EP2960925A4

公开(公告)日：2016-06-22

申请号：EP14754763

申请日：2014-02-18

Applicant: NGK INSULATORS LTD

Inventor： IDE AKIYOSHI ,  TAKAGAKI TATSURO ,  MIYAZAWA SUGIO ,  HORI YUJI ,  TAI TOMOYOSHI ,  HATTORI RYOSUKE

IPC: H01L21/02 ,  H01L21/683 ,  H03H3/08 ,  H03H9/145 ,  H03H9/25

CPC classification number: H01L21/6835 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/04 ,  B32B18/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/283 ,  B32B37/10 ,  B32B38/10 ,  B32B2264/105 ,  B32B2307/20 ,  B32B2307/206 ,  B32B2307/538 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/78 ,  H01L41/1873 ,  H03H3/08 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/25 ,  Y10T428/12597

Abstract: A composite substrate 10 includes a semiconductor substrate 12 and an insulating support substrate 14 that are laminated together. The support substrate 14 includes first and second substrates 14a and 14b made of the same material and bonded together with a strength that allows the first and second substrates 14a and 14b to be separated from each other with a blade. The semiconductor substrate 12 is laminated on a surface of the first substrate 14a opposite a surface thereof bonded to the second substrate 14b.

公开(公告)号：EP2863545A4

公开(公告)日：2016-02-24

申请号：EP13804294

申请日：2013-06-11

Applicant: NGK INSULATORS LTD

Inventor： HORI YUJI ,  TAI TOMOYOSHI ,  IDE AKIYOSHI ,  MIYAZAWA SUGIO

IPC: H01L41/313 ,  H03H9/02

CPC classification number: H01L41/081 ,  H01L41/053 ,  H01L41/1873 ,  H01L41/313 ,  H03H9/02574 ,  H03H9/25

Abstract: A composite substrate 10 includes a supporting substrate 12 and a piezoelectric substrate 14 which are bonded to each other. In this embodiment, the supporting substrate 12 and the piezoelectric substrate 14 are bonded to each other by an adhesive layer 16. In the composite substrate 10, since the supporting substrate 12 is composed of a translucent alumina ceramic, alignment is easily performed during FCB compared with the case where the supporting substrate is composed of an opaque ceramic. Furthermore, preferably, the linear transmittance and the total light transmittance from the front of the supporting substrate 12 in the visible light range (360 to 750 nm) are 10% or more and 70% or more, respectively.