公开(公告)号：EP2570803A1

公开(公告)日：2013-03-20

申请号：EP11181700.3

申请日：2011-09-16

Applicant: NXP B.V.

Inventor： Merz, Matthias ,  Tak, Coen ,  Hoofman, Romano

IPC: G01N27/30 ,  G01N27/414

CPC classification number: G01N27/302 ,  G01N27/4148 ,  G01N27/4167 ,  G01N33/02 ,  G01N33/04 ,  G01N33/12 ,  H01L2224/48091 ,  H01L2924/1815 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: Disclosed is a pH sensor comprising a carrier (10) comprising a plurality of conductive tracks and an exposed conductive area (40) defining a reference electrode connected to one of said conductive tracks; a sensing device (30) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation (20) covering the carrier, said encapsulation comprising a first cavity (22) exposing a surface (32) of the sensing device and a second cavity (24) exposing the exposed conductive area, said second cavity comprising a reference electrode material (42) and an ion reservoir material (44) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material. A method of manufacturing such a pH sensor is also disclosed.

Abstract translation: 公开了一种pH传感器，其包括包括多个导电轨道的载体（10）和限定连接到所述导电轨道中的一个的参考电极的暴露导电区域（40） 感测装置（30），其安装在所述载体上并连接至少另一个所述导电轨道; 覆盖所述载体的封装（20），所述封装包括暴露所述感测装置的表面（32）的第一空腔（22）和暴露所述暴露的导电区域的第二空腔（24），所述第二空腔包括参考电极材料 42）和与所述参考电极材料共享至少一种离子型离子储存器材料（44），所述参考电极材料夹在所述暴露的导电区域和所述离子储存器材料之间。 还公开了制造这种pH传感器的方法。

公开(公告)号：EP2554980A1

公开(公告)日：2013-02-06

申请号：EP11176484.1

申请日：2011-08-03

Applicant: NXP B.V.

Inventor： Merz, Matthias

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N27/128 ,  G01N25/18 ,  G01N27/121 ,  G01N27/125 ,  G01N27/22 ,  G01N33/004 ,  G01N33/18 ,  G01N33/1826 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24, 26, 28) covering the metallization stack; a gas sensor including a sensing material portion (32, 74) on the passivation stack; a first conductive portion (38) extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion (40) extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an lC is also disclosed.

Abstract translation: 公开的是包括承载的电路元件的多个A基片（10）的集成电路; 互连上述电路元件的金属化叠层（12，14，16），所述金属化叠层包括图案化上金属层包括第一金属部分（20）和第二金属部分（21）; 一钝化叠层（24，26，28）覆盖所述金属化叠层; 的气体传感器，包括钝化叠层上的感测材料部分（32，74）; 第一导电部分（38）通过在部分连接所述感测材料的第一区域到所述第一金属部分的钝化叠层延伸; 和第二导电部分（40）通过在部分连接所述感测材料的第二区域，以第二金属部分钝化叠层延伸。 在制造IC IST盘检验的方法，游离缺失。

公开(公告)号：EP2336758B1

公开(公告)日：2012-08-29

申请号：EP09179409.9

申请日：2009-12-16

Applicant: NXP B.V.

Inventor： Humbert, Aurelie ,  Merz, Matthias ,  Ponomarev, Youri, Victorovitch ,  Daamen, Roel ,  Van Dal, Marcus,Johannes,Henricus

IPC: G01N27/22

CPC classification number: G01N27/223 ,  G01R27/2605

公开(公告)号：EP2390203A1

公开(公告)日：2011-11-30

申请号：EP10164438.3

申请日：2010-05-31

Applicant: NXP B.V.

Inventor： Hoofman, Romano ,  Daamen, Roel ,  Ponomarev, Youri Victorovitch ,  Fotopoulou, Kyriaki ,  Merz, Matthias ,  Curatola, Gilberto ,  Tombeur, Anton

IPC: B65D79/02 ,  B32B3/08 ,  B32B7/02

CPC classification number: B65D79/02 ,  B65D2203/10 ,  G01N33/0062 ,  G01N33/02

Abstract: A container (100) for containing a perishable substance has a container wall (104) with an inner side (106) and an outer side (108). The wall has an electrically conductive layer (110) extending between the inner side and the outer side. The inner side faces the space (102) containing the substance. The container comprises electronic circuitry (116) having a sensor (118) for sensing a physical property or condition of the substance, and an antenna (120) for communicating an RF signal to a receiver (122), external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.

公开(公告)号：EP2302327A1

公开(公告)日：2011-03-30

申请号：EP09290734.4

申请日：2009-09-25

Applicant: NXP B.V.

Inventor： Daamen, Roel ,  Humbert, Aurelie ,  Merz, Matthias ,  Victorovitch, Youri

IPC: G01D5/14 ,  H01L23/00

Abstract: A sensor (100) comprising a silicon substrate (102; 202; 302; 402) having a first (202a; 302a; 402a) and a second surface (202b; 302b; 402b), integrated circuitry (104; 206; 306; 406) provided on the first surface (202a; 302a; 402a) of the silicon substrate (102; 202; 302; 402), and a sensor structure (106; 205; 305; 405) provided on the second surface (202b; 302b; 402b) of the silicon substrate (102; 202; 302; 402). The sensor structure (106; 205; 305; 405) and the integrated circuitry (104; 206; 306; 406) are electrically coupled to each other.

Abstract translation: 一种包括具有第一（202a; 302a; 402a）和第二表面（202b; 302b; 402b）的硅衬底（102; 202; 402; 402）的传感器（100），集成电路（104; 206; 306; 406 ）设置在硅衬底（102; 202; 302; 402）的第一表面（202a; 302a; 402a）上，以及设置在第二表面（202b; 302b; 402b）上的传感器结构（106; 205; 305; 402b）的硅衬底（102; 202; 302; 402）。 传感器结构（106; 205; 305; 405）和集成电路（104; 206; 306; 406）彼此电耦合。

公开(公告)号：EP2302327B1

公开(公告)日：2020-02-26

申请号：EP09290734.4

申请日：2009-09-25

Applicant: NXP B.V.

Inventor： Daamen, Roel ,  Humbert, Aurelie ,  Merz, Matthias ,  Victorovitch, Youri

IPC: G01D5/14 ,  H01L23/00

公开(公告)号：EP2913667A1

公开(公告)日：2015-09-02

申请号：EP15151261.3

申请日：2015-01-15

Applicant: NXP B.V.

Inventor： Merz, Matthias ,  Soccol, Dimitri

IPC: G01N27/403 ,  G01N27/407

CPC classification number: G01N27/30 ,  G01N27/4045 ,  G01N27/407 ,  G01N33/004 ,  Y10T29/49117

Abstract: An electrochemical sensor for sensing a target substance is disclosed. In one example, the sensor discloses an electrolyte matrix, wherein the matrix reposits an electrolyte; a working electrode coupled to the electrolyte matrix at a first location; a counter electrode coupled to the electrolyte matrix at a second location; an electrical circuit, coupled to the working electrode and the counter electrode, and capable of generating an output signal in response to an electrical current which flows between the working electrode and the counter electrode in response to a presence of the target substance.

Abstract translation: 公开了一种用于感测目标物质的电化学传感器。 在一个示例中，传感器公开了一种电解质基质，其中基质储存电解质; 在第一位置处耦合到所述电解质基质的工作电极; 在第二位置处耦合到电解质基质的对电极; 耦合到工作电极和对电极的电路，并响应于目标物质的存在而响应于在工作电极和对电极之间流动的电流产生输出信号。

公开(公告)号：EP2573554A1

公开(公告)日：2013-03-27

申请号：EP11182105.4

申请日：2011-09-21

Applicant: NXP B.V.

Inventor： Frederix, Filip ,  Merz, Matthias

IPC: G01N27/414 ,  G01N33/543 ,  G01N33/487

CPC classification number: G01N33/54373 ,  G01N33/48721 ,  G01N33/54313

Abstract: A bead based assay detection method (and apparatus) is for detecting an analyte, and using a device which comprises a substrate (50), a source region (S), a drain region (D) and a gate region, a channel region (65) between the source and drain regions and a nanopore passing through the substrate in electrical connection with the gate or channel region. A sample under test is drawn through the nanopore, and the sample under test comprises bioreceptors attached to a bead or a bead complex, in proportion to the presence of an analyte to be detected. A count of the beads or bead complexes is made based on modulation of a gate current.

Abstract translation: 基于珠的测定检测方法（和装置）用于检测分析物，并且使用包括基底（50），源区（S），漏区（D）和栅区的器件，沟道区（ 65）和通过衬底的纳米孔与栅极或沟道区域电连接。 待测样品通过纳米孔被拉伸，并且待测试样品包含与待检测的分析物的存在成比例的与珠粒或珠子复合物连接的生物感受器。 基于栅极电流的调制进行珠或珠复合体的计数。

公开(公告)号：EP2390203B1

公开(公告)日：2013-01-16

申请号：EP10164438.3

申请日：2010-05-31

Applicant: NXP B.V.

Inventor： Hoofman, Romano ,  Daamen, Roel ,  Ponomarev, Youri Victorovitch ,  Fotopoulou, Kyriaki ,  Merz, Matthias ,  Curatola, Gilberto ,  Tombeur, Anton

IPC: B65D79/02 ,  B32B3/08 ,  B32B7/02

CPC classification number: B65D79/02 ,  B65D2203/10 ,  G01N33/0062 ,  G01N33/02

公开(公告)号：EP2492240A1

公开(公告)日：2012-08-29

申请号：EP11155694.0

申请日：2011-02-23

Applicant: NXP B.V.

Inventor： Merz, Matthias ,  Ponomarev, Youri Victorovitch

IPC: B81C1/00

CPC classification number: B81C1/00246 ,  B81B2201/0264 ,  B81B2207/015 ,  B81C2203/0714

Abstract: Disclosed is an integrated circuit (IC) comprising a body (10) including a plurality of circuit elements; and a metallization stack over said circuit elements for interconnecting said circuit elements, wherein the metallization stack comprises a conductive layer portion (22) opposite a flexible further conductive layer portion (24) and separated therefrom by a fluid medium (26), a surface of the said flexible further conductive layer portion being exposed to an external pressure; wherein at least some of the circuit elements are arranged to determining the external pressure by measuring a capacitance across the conductive layer portion and the flexible further conductive layer portion. A method of manufacturing such an IC is also disclosed.

Abstract translation: 公开了一种集成电路（IC），包括：主体（10），包括多个电路元件; 以及用于互连所述电路元件的所述电路元件上的金属化堆叠，其中所述金属化堆叠包括与柔性的另外的导电层部分（24）相对的导电层部分（22），并通过流体介质（26）与其分离， 所述柔性进一步的导电层部分暴露于外部压力; 其中至少一些电路元件被布置成通过测量导电层部分和柔性的另外的导电层部分的电容来确定外部压力。 还公开了制造这种IC的方法。