Abstract:
The invention relates to an electrochemical sensor integrated on a substrate, the electrochemical sensor comprising: a field effect transistor integrated on the substrate and having a source (S), gate (G) and drain (D) connections, said gate of the field effect transistor comprising: a sensing gate (18) conductively coupled to a sensing electrode (16); and a bias gate (20), wherein the sensing gate is capacitively coupled to the bias gate and the bias gate is capacitively coupled to the substrate.
Abstract:
Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12,14,16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24,26,28) covering the metallization stack; a gas sensor including a sensing material portion (32,74) on the passivation stack; a first conductive portion (38) extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion (40) extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an IC is also disclosed. The gas sensor measures the gas concentration either by measuring the resistivity of the sensing material as the test gas is absorbed in the sensing material or by measuring the temperature change of the sensing material due to changes of thermal conductivity of the test gas.
Abstract:
Disclosed is an integrated circuit comprising an electrode arrangement (30, 32) for detecting the presence of a liquid, said electrode arrangement comprising a first electrode (30) and a second electrode (32), wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound (40) that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.
Abstract:
An electrochemical sensor device (35) comprising: a sensor chip (30) having an integrated electrochemical sensor element (34); and a substrate (20) having a first surface (23) on which the sensor chip (30) is mounted, the substrate (20) comprising a reference electrode structure (36) for the integrated electrochemical sensor element (34), the reference electrode structure (36) connected to the sensor chip (30) via an electrical connection (21a) on the first surface.(23) of the substrate (20).
Abstract:
Disclosed is a semiconductor device comprising a stack of patterned metal layers (12) separated by dielectric layers (14), said stack comprising a first conductive support structure (20) and a second conductive support structure (21) and a cavity (42) in which an inertial mass element (22) comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions (24), at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.
Abstract:
An environmental sensor (200) comprising: a semiconductor die (110) having a transducer (120) provided on a surface thereof; a carrier substrate (210) comprising electrical connections (230) connected to the semiconductor die surface; and a layer (250) of a sealing compound covering the semiconductor die surface and providing a seal between the die and the carrier substrate, wherein the transducer is configured to detect a change in an environmental parameter to which the sealing compound is exposed.
Abstract:
Disclosed is a pH sensor comprising a carrier (10) comprising a plurality of conductive tracks and an exposed conductive area (40) defining a reference electrode connected to one of said conductive tracks; a sensing device (30) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation (20) covering the carrier, said encapsulation comprising a first cavity (22) exposing a surface (32) of the sensing device and a second cavity (24) exposing the exposed conductive area, said second cavity comprising a reference electrode material (42) and an ion reservoir material (44) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material. A method of manufacturing such a pH sensor is also disclosed.
Abstract:
There is disclosed an electrochemical sensor device (10) comprising: an integrated electrochemical sensor element (12) having: a substrate (20); first (16) and second (18) electrodes formed on the upper surface of the substrate (20); and an electrolyte layer (19) formed on the first (16) and second (18) electrodes so as to electrically contact both the first (16) and second (18) electrodes; and a sensor integrated circuit (14) electrically connected to the first (16) and second (18) electrodes of the integrated electrochemical sensor element (12). The integrated electrochemical sensor element (12) and the sensor integrated circuit (14) are provided in a single package.