公开(公告)号：US10584418B1

公开(公告)日：2020-03-10

申请号：US15440093

申请日：2017-02-23

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Edward M. Silverman ,  Hsiao-Hu Peng

IPC: C23C16/50 ,  C23C16/30 ,  C23C16/56

Abstract: A method for creating a randomly-oriented, non-woven carbon nanotube (CNT) sheet with reduced reflectance includes: providing a randomly-oriented, non-woven CNT sheet; and performing plasma treatment of the randomly-oriented, non-woven CNT sheet, thereby creating a randomly-oriented, non-woven CNT sheet with reduced reflectance.

公开(公告)号：US10128022B1

公开(公告)日：2018-11-13

申请号：US15791730

申请日：2017-10-24

Applicant: Northrop Grumman Systems Corporation

Inventor： Bradley J. Lyon ,  Nana Kim ,  Hsiao-Hu Peng ,  John A. Starkovich ,  Edward M. Silverman

IPC: H01B7/02 ,  H01B7/18 ,  C25D3/38 ,  C25D7/06 ,  C01B32/168 ,  H01B13/06 ,  H01B13/22 ,  H01B13/02 ,  H01B1/04

Abstract: A carbon nanotube (CNT) cable includes a pair of plated twisted wires, wherein each wire includes one or more sub-cores, wherein at least one sub-core includes CNT yarn; a dielectric surrounding the plated twisted wires; and an electrical layer surrounding the dielectric, wherein the electrical layer is configured to shield the CNT cable. A method for making a CNT cable includes the steps of controlling a deposition rate, depositing plating so as to surround a pair of wires, wherein each wire includes one or more sub-cores, wherein at least one sub-core includes CNT yarn, twisting the plated wires together, and surrounding the plated twisted wires with an electrical layer configured to shield the plated twisted wires, thereby creating the CNT cable.

公开(公告)号：US20180206328A1

公开(公告)日：2018-07-19

申请号：US15633994

申请日：2017-06-27

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Xianglin Zeng ,  Andrew D. Kostelec ,  Hsiao-Hu Peng ,  Edward M. Silverman

IPC: H05K1/02 ,  F28F21/02

CPC classification number: H05K1/0204 ,  F28F21/02 ,  F28F21/086 ,  F28F21/089 ,  F28F2255/06 ,  F28F2275/02 ,  H05K1/0207 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/06

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

公开(公告)号：US09736923B1

公开(公告)日：2017-08-15

申请号：US15407299

申请日：2017-01-17

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Xianglin Zeng ,  Andrew D. Kostelec ,  Hsiao-Hu Peng ,  Edward M. Silverman

IPC: H05K1/02 ,  F28F21/02

CPC classification number: H05K1/0204 ,  F28F21/02 ,  F28F2255/06 ,  F28F2275/02 ,  H05K1/0207 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/06

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

公开(公告)号：US20170146302A1

公开(公告)日：2017-05-25

申请号：US15422602

申请日：2017-02-02

Applicant: Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： John A. Starkovich ,  Edward M. Silverman ,  Jesse B. Tice ,  Hsiao-Hu Peng ,  Michael T. Barako ,  Kenneth E. Goodson

IPC: F28F3/02 ,  B23P15/26 ,  B23K1/00

CPC classification number: F28F3/022 ,  B23K1/0012 ,  B23K20/023 ,  B23K2101/14 ,  B23P15/26 ,  B82Y30/00 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/0607 ,  C25D9/02 ,  F28F2255/20 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27462 ,  H01L2224/27466 ,  H01L2224/29078 ,  H01L2224/29211 ,  H01L2224/29244 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2224/83238

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material: placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

公开(公告)号：US09613882B2

公开(公告)日：2017-04-04

申请号：US15268980

申请日：2016-09-19

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Edward M. Silverman ,  Hsiao-Hu Peng

IPC: H01L23/373 ,  H01L23/367 ,  C09K5/14 ,  H01L23/42 ,  B82Y30/00 ,  F28F13/00

CPC classification number: H01L23/3733 ,  B82Y30/00 ,  C09K5/14 ,  F28F2013/006 ,  F28F2255/20 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L2924/0002 ,  Y10S977/734 ,  Y10S977/742 ,  Y10S977/762 ,  Y10S977/81 ,  Y10S977/833 ,  H01L2924/00

Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

公开(公告)号：US10923716B1

公开(公告)日：2021-02-16

申请号：US16811248

申请日：2020-03-06

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Hsiao-Hu Peng ,  Edward M. Silverman

IPC: H01M4/36 ,  H01M4/04 ,  H01M10/0525 ,  H01M4/587 ,  H01M4/66

Abstract: A hybrid electrode and an energy storage device are disclosed. The hybrid electrode is applicable to use in advanced rechargeable energy storage and power sources. A non-woven sheet of carbon-nanotubes (CNTs) and a layer of lithiated graphene nanoparticles deposited on the sheet of CNTs are provided.

公开(公告)号：US10182493B2

公开(公告)日：2019-01-15

申请号：US15633994

申请日：2017-06-27

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Xianglin Zeng ,  Andrew D. Kostelec ,  Hsiao-Hu Peng ,  Edward M. Silverman

IPC: H05K1/02 ,  H05K3/46 ,  F28F21/02 ,  F28F21/08

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

公开(公告)号：US10180288B2

公开(公告)日：2019-01-15

申请号：US15422602

申请日：2017-02-02

Applicant: Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： John A. Starkovich ,  Edward M. Silverman ,  Jesse B. Tice ,  Hsiao-Hu Peng ,  Michael T. Barako ,  Kenneth E. Goodson

IPC: H01L23/00 ,  F28F3/02 ,  B23K1/00 ,  B23K20/02 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/06 ,  C25D9/02 ,  B82Y30/00 ,  H01L23/373 ,  B23P15/26 ,  B23K101/14

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

公开(公告)号：US09741636B1

公开(公告)日：2017-08-22

申请号：US15270078

申请日：2016-09-20

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Edward M. Silverman ,  Hsiao-Hu Peng

IPC: H01L23/373

CPC classification number: F28F21/085 ,  C09K5/14 ,  F28F2013/006 ,  F28F2255/20 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/42 ,  H01L2924/00 ,  H01L2924/0002

Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.