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公开(公告)号：US09608409B2
公开(公告)日：2017-03-28
申请号：US14912196
申请日：2014-08-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tilman Eckert
CPC classification number: H01S5/4031 , G02B7/025 , G02B27/0966 , H01S5/0201 , H01S5/02252 , H01S5/02272 , H01S5/02288 , H01S5/4025
Abstract: A laser component assembly includes a carrier including first and second component portions wherein each component portion has a chip mounting surface, a lens mounting surface and a stop surface, the stop surface of each component portion includes first and second stop partial surfaces, the first stop partial surface is formed on a first stop element and the second stop partial surface is formed on a second stop element, the chip mounting surface is arranged between the first stop element and the second stop element, the stop surface is oriented perpendicularly to the chip mounting surface, a laser chip arranged on the chip mounting surface, the laser component assembly as a lens bar comprising an optical lens component portion and the lens bar is arranged on the lens mounting surfaces of the component portions and bears against the stop surfaces of the component portions.
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公开(公告)号：US09472923B2
公开(公告)日：2016-10-18
申请号：US14780846
申请日：2014-03-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tilman Eckert
CPC classification number: H01S5/02252 , G02B7/025 , G02B27/0966 , H01L2224/48091 , H01L2224/73265 , H01S5/02208 , H01S5/02272 , H01S5/02288 , H01L2924/00014
Abstract: A laser component includes a carrier having a lens carrier surface and a chip carrier surface raised relative to the lens carrier surface, wherein an optical lens is arranged on the lens carrier surface, a laser chip is arranged on the chip carrier surface, the chip carrier surface and the lens carrier surface are formed by materially uniformly continuous sections of the carrier, the carrier includes a plastic material, and the laser component is configured as a surface-mountable SMD component.
Abstract translation: 激光器部件包括具有透镜载体表面和相对于透镜载体表面升高的芯片载体表面的载体，其中光学透镜布置在透镜载体表面上，激光芯片布置在芯片载体表面上，芯片载体 表面和透镜载体表面由载体的物质均匀连续的部分形成，载体包括塑料材料，并且激光组件被配置为可表面安装的SMD部件。
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Patent Agency Ranking
公开(公告)号：US20190049073A1
公开(公告)日：2019-02-14
申请号：US16075360
申请日：2016-02-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tilman Eckert
CPC classification number: F21K9/232 , F21K9/90 , F21V29/85 , F21V29/87 , F21Y2101/00 , F21Y2103/10 , F21Y2107/70 , F21Y2115/10
Abstract: A filament for a filament lamp includes a plurality of light emitting semiconductor chips, wherein the light emitting semiconductor chips are located on a carrier board, the light emitting semiconductor chips are electrically connected, and the carrier board is a flexible carrier board.
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公开(公告)号：US20170179016A1
公开(公告)日：2017-06-22
申请号：US15327297
申请日：2015-07-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Brandl , Tilman Eckert
IPC: H01L23/498 , H01L21/48 , H01S5/022 , H01L23/00 , H01L33/62
CPC classification number: H01L23/49838 , H01L21/4846 , H01L23/49811 , H01L23/49894 , H01L24/32 , H01L24/83 , H01L33/62 , H01L2224/32221 , H01L2224/83801 , H01L2924/0002 , H01L2924/05042 , H01L2924/05442 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2933/0066 , H01S5/02268 , H01S5/02272 , H01L2924/00
Abstract: A carrier for an electrical component, including a substrate having a surface, with an electrically conductive contact zone arranged on the surface of the substrate, a solder pad disposed on the contact zone, and a solder stop structure disposed laterally next to the solder pad. The solder stop structure has a surface that is less wettable with liquid solder than a surface of the contact zone. The solder stop structure subdivides the contact zone into a first zone region and a second zone region, with the first zone region having the solder pad. The solder stop structure extends over a portion of a total length of the contact zone such that the contact zone has a free connecting region that is free of the solder stop structure. The first and second zone regions are connected to one another by means of the free connecting region.
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15.发明申请OPTOELECTRONIC SEMICONDUCTOR ELEMENT, OPTOELECTRONIC SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR ELEMENTS 有权光电子半导体元件，光电子半导体器件和用于生产多个光电半导体元件的方法公开(公告)号：US20170025574A1
公开(公告)日：2017-01-26
申请号：US15121072
申请日：2015-03-12
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Tilman Eckert , Stefan Brandl
CPC classification number: H01L33/22 , H01L33/10 , H01L33/44 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/48471 , H01L2224/49113 , H01L2933/0025 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: An optoelectronic semiconductor element may include at least one LED chip which emits infrared radiation via a top side during operation. The radiation has a global intensity maximum at wavelengths between 800 nm and 1100 nm. The radiation has, at most 5% of the intensity of the intensity maximum at a limit wavelength of 750 nm. The radiation has a visible red light component. The semiconductor element may further include a filter element, which is arranged directly or indirectly on the top side of the LED chip and which has a transmissivity of at most 5% for the visible red light component of the LED chip, wherein the transmissivity of the filter element is at least 80%, at least in part, for wavelengths between the limit wavelength and 1100 nm, and a radiation exit surface provided for emitting the filtered radiation.
Abstract translation: 光电半导体元件可以包括在操作期间经由顶侧发射红外辐射的至少一个LED芯片。 辐射在800nm至1100nm之间的波长处具有全局强度最大值。 在750nm的极限波长处，辐射具有最大强度的5％。 辐射具有可见的红光分量。 半导体元件还可以包括直接或间接地布置在LED芯片的顶侧上并且对于LED芯片的可见红光分量具有至多5％的透射率的滤光元件，其中透射率 滤波器元件至少部分地为极限波长和1100nm之间的波长以及用于发射滤波的辐射的辐射出射表面的至少80％。
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公开(公告)号：US20160056607A1
公开(公告)日：2016-02-25
申请号：US14780846
申请日：2014-03-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tilman Eckert
CPC classification number: H01S5/02252 , G02B7/025 , G02B27/0966 , H01L2224/48091 , H01L2224/73265 , H01S5/02208 , H01S5/02272 , H01S5/02288 , H01L2924/00014
Abstract: A laser component includes a carrier having a lens carrier surface and a chip carrier surface raised relative to the lens carrier surface, wherein an optical lens is arranged on the lens carrier surface, a laser chip is arranged on the chip carrier surface, the chip carrier surface and the lens carrier surface are formed by materially uniformly continuous sections of the carrier, the carrier includes a plastic material, and the laser component is configured as a surface-mountable SMD component.
Abstract translation: 激光器部件包括具有透镜载体表面和相对于透镜载体表面升高的芯片载体表面的载体，其中光学透镜布置在透镜载体表面上，激光芯片布置在芯片载体表面上，芯片载体 表面和透镜载体表面由载体的物质均匀连续的部分形成，载体包括塑料材料，并且激光组件被配置为可表面安装的SMD部件。
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公开(公告)号：US20150318664A1
公开(公告)日：2015-11-05
申请号：US14798999
申请日：2015-07-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tilman Eckert
IPC: H01S5/022
CPC classification number: H01S5/02208 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01S5/02228 , H01S5/02236 , H01S5/02272 , H01S5/02276 , Y10T29/49147 , H01L2924/00014
Abstract: A laser component includes a housing and a laser chip arranged in the housing, wherein the housing includes a first soldering contact and a second soldering contact at a first outer surface, and a third soldering contact and a fourth soldering contact at a second outer surface, the first soldering contact connects to the third soldering contact in an electrically conductive manner and the second soldering contact connects to the fourth soldering contact in an electrically conductive manner, the housing includes a carrier substrate and a cover, a bottom side of the laser chip is arranged on the carrier substrate, the cover includes an encapsulation material, the laser chip is covered by the encapsulation material, and a beam direction of the laser chip is oriented in parallel to the bottom side of the laser chip.
Abstract translation: 激光部件包括壳体和布置在壳体中的激光芯片，其中壳体包括在第一外表面处的第一焊接接触和第二焊接接头，以及在第二外表面处的第三焊接接触和第四焊接接触， 第一焊接接头以导电方式连接到第三焊接接头，并且第二焊接接头以导电方式连接到第四焊接接头，壳体包括载体基板和盖，激光芯片的底侧是 布置在载体基板上，盖包括封装材料，激光芯片被封装材料覆盖，激光芯片的光束方向平行于激光芯片的底侧。
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