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    Process for stabilizing autocatalytic metal plating solutions
    15.
    发明专利
    Process for stabilizing autocatalytic metal plating solutions 未知

    公开(公告)号：GB1121282A

    公开(公告)日：1968-07-24

    申请号：GB2627465

    申请日：1965-06-22

    Applicant: PHOTOCIRCUITS CORP

    Inventor： SCHNEBLE FREDERICK W ,  ZEBLISKY RUDOLPH J ,  MCCORMACK JOHN F ,  WILLIAMSON JOHN DUFF

    IPC: C23C18/31 ,  C23C18/36 ,  C23C18/40 ,  C23C18/52

    Abstract: In the electroless deposition of e.g. Cu, Ni, Co, Cd, and Sn, a cyanide compound is added in an amount less than 500 milligrams/1. The substrate may be paper, glass, ceramic, synthetic resins or a metal, e.g. Ni, Co, Fe, steel, Pd, Pt, Au, Cu, brass, Mn, Cr, W, Ti, Sn, Ag or Mo. An oxidizing agent, e.g. borohydrides, amine boranes, hydrazines, hypophosphites, hydrosulphites, hydroxyl amines, and formaldehyde may be added. A sequestering agent e.g. ethylene diamine, diethylene triamine, triethylene tetramine, E.D.T.A., citric and tartaric acid, ammonia, Rochelle salts, nitrilo triacetic acid, gluconic acid and gluconates, and triethanolamine, and a surfactant e.g. organic phosphate esters or oxyethylated sodium salts may also be added. Noncatalytic surfaces may be sensitized with stannous chloride and a precious metal salt.

    Autocatalytic metal plating
    19.
    发明专利
    Autocatalytic metal plating 未知

    公开(公告)号：GB1058915A

    公开(公告)日：1967-02-15

    申请号：GB2627365

    申请日：1965-06-22

    Applicant: PHOTOCIRCUITS CORP

    Inventor： MCCORMACK JOHN F

    IPC: C23C18/40 ,  C23C18/44

    Abstract: A group 1B metal, e.g. copper is electrolessly deposited from a solution pH 10 to 14 comprising (moles 1 litre) 0.002 to 0.6 water soluble metal salt, 0.002 to 2.5 alkali metal borohydride or amine borane, and a complexing agent in an amount between 0.7 and 10 times the moles of the water soluble salt. In an example a solution comprises copper sulphate 0.05 moles/1., E.D.T.A.0.12 moles 1 litre, sodium cyanide 0.008 moles/1., and sodium borohydride 80 mg/1. The substrate may be Ni, Co, Fe or steel, Pd, Pt, Cu or brass, Mn, Cr, Mo, W, Ti, Sn, Ag paper, glass, ceramic or plastics. A surfactant, e.g. organic phosphate esters or oxyethylated sodium salts may be present up to 5 g.11.

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