公开(公告)号：US3907621A

公开(公告)日：1975-09-23

申请号：US22744672

申请日：1972-02-18

Applicant: PHOTOCIRCUITS CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J ,  NUZZI FRANCIS J

IPC: C23C18/16 ,  C23C18/26 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02 ,  C23F1/00

CPC classification number: H05K3/185 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/26 ,  H05K3/181 ,  H05K3/182 ,  H05K3/381 ,  H05K3/387 ,  H05K2203/0783 ,  H05K2203/122

Abstract: There is provided a new process for the production of printed circuits. The process comprises coating a base with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., thermal or chemical reducing agents are converted to a layer of metal nuclei that is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

Abstract translation: 为生产印刷电路提供了新的工艺。 该方法包括用一层铜，镍，钴或铁盐或盐组合物涂覆碱，其在暴露于辐射能（例如热，光等）的情况下，将热或化学还原剂转化为金属层 核，其是非导电的，但是能够从与金属核接触的无电金属沉积溶液催化金属沉积到基底上。

公开(公告)号：DK136840B

公开(公告)日：1977-11-28

申请号：DK397365

申请日：1965-08-02

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH

IPC: C23C18/16 ,  C23C18/40 ,  H05K3/18 ,  H05K1/02

Abstract: Method for metallizing basic insulation materials, characterized in that it comprises the adhesive bond to the surfaces of the basic material of solid particles of a catalytic agent for the reception of non-electrolytic copper, and the subsequent immersion of the basic material in an alkaline deposit of non-electrolytic copper comprising water, a water soluble cupric salt, an alkali metal hydroxide, a complexing agent for the cupric ion, formaldehyde, and a complexing agent for the cuprous ion, to thereby establish a ductile layer and copper adherent deposited electrolytically in the places where the catalytic agent is exposed to the bath. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：DK133960B

公开(公告)日：1976-08-16

申请号：DK423365

申请日：1965-08-18

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  POLICHETTE JOSEPH ,  LEECH EDWARD JOHN

IPC: C23C18/20 ,  C23C18/40 ,  H05K1/11 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  H05K3/10

公开(公告)号：CA939831A

公开(公告)日：1974-01-08

申请号：CA63648

申请日：1969-09-30

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK W JR ,  MCCORMACK JOHN F ,  ZEBLISKY RUDOLPH J ,  WILLIAMSON JOHN D ,  POLICHETTE JOSEPH

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46

公开(公告)号：CA900072A

公开(公告)日：1972-05-09

申请号：CA900072D

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD J ,  POLICHETTE JOSEPH

公开(公告)号：CA968610A

公开(公告)日：1975-06-03

申请号：CA206694

申请日：1974-08-09

Applicant: PHOTOCIRCUITS CORP

Inventor： POLICHETTE JOSEPH

公开(公告)号：DE1696603A1

公开(公告)日：1972-01-05

申请号：DE1696603

申请日：1968-01-03

Applicant: PHOTOCIRCUITS CORP

Inventor： WILLIAM SCHNEBLE FREDERICK ,  LEECH EDWARD ,  BAY OYSTER ,  POLICHETTE JOSEPH

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  D06Q1/04 ,  H05K1/03 ,  H05K3/18 ,  H05K3/42 ,  C23C3/02

公开(公告)号：DE1665374B1

公开(公告)日：1971-09-09

申请号：DE1665374

申请日：1967-06-27

Applicant: PHOTOCIRCUITS CORP

Inventor： W SCHNEBLE FREDERICK ,  F MCCORMACK JOHN ,  J DR ZEBLINSKY RUDOLPH ,  WILLIAMSON DUFF ,  POLICHETTE JOSEPH

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/42 ,  H05K3/00

公开(公告)号：DE1521441B

公开(公告)日：1970-04-30

申请号：DE1521441D

申请日：1965-07-19

Applicant: PHOTOCIRCUITS CORP

Inventor： POLICHETTE JOSEPH

IPC: H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4053 ,  H05K3/1275 ,  H05K3/422 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/0763

公开(公告)号：CA835579A

公开(公告)日：1970-02-24

申请号：CA835579D

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD J ,  POLICHETTE JOSEPH