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公开(公告)号：WO2022125374A1
公开(公告)日：2022-06-16
申请号：PCT/US2021/061600
申请日：2021-12-02
Applicant: QUALCOMM INCORPORATED [US]/[US]
Inventor： HASSAN, Muhammad , ASURI, Bhushan Shanti , DUNWORTH, Jeremy Darren , SRIDHARA, Ravi
Abstract: According to certain aspects, a chip includes a pad, a power amplifier, a transformer coupled between an output of the power amplifier and the pad, a transistor coupled between the transformer and a ground, and a first clamp circuit coupled between a gate of the transistor and a drain of the transistor.
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公开(公告)号：WO2022015533A2
公开(公告)日：2022-01-20
申请号：PCT/US2021/040474
申请日：2021-07-06
Applicant: QUALCOMM INCORPORATED
Inventor： BELLAOUAR, Abdellatif , BALASUBRAMANIYAN, Arul , SAHOTA, Gurkanwal Singh , HASSAN, Muhammad , GARCIA, Jorge , ASURI, Bhushan Shanti , SRIDHARA, Ravi , EL-AASSAR, Omar Essam , MISHRA, Chinmaya
Abstract: In certain aspects, a method is provided for measuring power using a resistive element (210) coupled between a power amplifier (110) and an antenna (130). The method includes squaring, using a first squaring circuit (215), a voltage (VAt) from a first terminal of the resistive element to obtain a first signal, squaring a voltage from a second terminal of the resistive element to obtain a second signal, and generating a measurement signal based on a difference between the first signal and the second signal. In some implementations, the resistive element is implemented with a power switch.
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13.发明申请DUAL STAGE CARRIER-AGGREGATION (CA) LOW NOISE AMPLIFIER (LNA) HAVING HARMONIC REJECTION AND HIGH LINEARITY 审中-公开双级载波聚合（CA）低噪声放大器（LNA）具有谐波抑制和高线性
公开(公告)号：WO2015183847A1
公开(公告)日：2015-12-03
申请号：PCT/US2015/032504
申请日：2015-05-27
Applicant: QUALCOMM INCORPORATED
Inventor： WANG, Chuan , PAN, Dongling , TANG, Yiwu , VAN ZALINGE, Klaas , HASSAN, Muhammad
CPC classification number: H03F1/26 , H03F1/223 , H03F1/3205 , H03F1/565 , H03F3/19 , H03F3/193 , H03F3/245 , H03F2200/111 , H03F2200/165 , H03F2200/168 , H03F2200/171 , H03F2200/294 , H03F2200/411 , H03F2200/451 , H04B1/40
Abstract: A device (600) includes a load circuit (630) configured to receive an amplified communication signal (615), the load circuit (630) having a center tapped inductor structure (632, 634) configured to divide the amplified communication signal (615) into a first portion (641) and a second portion (642), the load circuit (630) configured to resonate at a harmonic of the amplified communication signal (615).
Abstract translation: 一种设备（600）包括被配置为接收放大的通信信号（615）的负载电路（630），所述负载电路（630）具有中心抽头电感结构（632,634），其被配置为将放大的通信信号（615） 进入第一部分（641）和第二部分（642），负载电路（630）被配置为以放大的通信信号（615）的谐波谐振。
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公开(公告)号：EP4487482A2
公开(公告)日：2025-01-08
申请号：EP23833910.5
申请日：2023-02-08
Applicant: QUALCOMM INCORPORATED
Inventor： WANG, Chuan , LIU, Li , CHEN, Wu-Hsin , PANIKKATH, Vinod , FENG, Yunfei , HASSAN, Muhammad
IPC: H04B1/40
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公开(公告)号：EP4327463A2
公开(公告)日：2024-02-28
申请号：EP22716660.0
申请日：2022-03-24
Applicant: QUALCOMM INCORPORATED
Inventor： HASSAN, Muhammad
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Patent Agency Ranking
公开(公告)号：EP4260371A2
公开(公告)日：2023-10-18
申请号：EP21835505.5
申请日：2021-12-02
Applicant: QUALCOMM Incorporated
Inventor： HASSAN, Muhammad , ASURI, Bhushan Shanti , DUNWORTH, Jeremy Darren , SRIDHARA, Ravi
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公开(公告)号：EP3105851B1
公开(公告)日：2018-04-25
申请号：EP15706999.8
申请日：2015-02-12
Applicant: Qualcomm Incorporated
Inventor： HASSAN, Muhammad , TANG, Yiwu , VAN ZALINGE, Klaas , WANG, Chuan , PAN, Dongling
CPC classification number: H04W52/0261 , H03F1/0205 , H03F3/189 , H03F3/191 , H03F3/193 , H03F2200/294 , H03F2200/451 , H03G3/00 , H04B1/40 , H04W88/06 , Y02D70/1242 , Y02D70/1262 , Y02D70/142 , Y02D70/144 , Y02D70/164
Abstract: A device includes a multi-mode low noise amplifier (LNA) having a first amplifier stage, and a second amplifier stage coupled to the first amplifier stage, the second amplifier stage having a plurality of amplification paths configured to amplify a plurality of carrier frequencies, the first amplifier stage configured to bypass the second amplifier stage when the first amplifier stage is configured to amplify a single carrier frequency.
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公开(公告)号：EP4406056A1
公开(公告)日：2024-07-31
申请号：EP22777928.7
申请日：2022-09-02
Applicant: QUALCOMM INCORPORATED
Inventor： WANG, Chuan , HEDAYATI, Maziar , ASURI, Bhushan Shanti , HASSAN, Muhammad , MISHRA, Chinmaya , DAVIERWALLA, Anosh
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公开(公告)号：EP4338295A1
公开(公告)日：2024-03-20
申请号：EP22751482.5
申请日：2022-06-22
Applicant: QUALCOMM INCORPORATED
Inventor： HASSAN, Muhammad , DUNWORTH, Jeremy, Darren
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公开(公告)号：EP4244987A1
公开(公告)日：2023-09-20
申请号：EP21805776.8
申请日：2021-10-15
Applicant: QUALCOMM Incorporated
Inventor： HASSAN, Muhammad , GOLDBLATT, Jeremy , ASURI, Bhushan Shanti , DUNWORTH, Jeremy, Darren , BELLAOUAR, Abdellatif , SRIDHARA, Ravi , GARCIA, Jorge
IPC: H04B1/44
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