公开(公告)号：WO2016118250A1

公开(公告)日：2016-07-28

申请号：PCT/US2015/065535

申请日：2015-12-14

Applicant: QUALCOMM INCORPORATED

Inventor： SAEIDI, Mehdi ,  MITTAL, Rajat ,  MITTAL, Arpit ,  COUTTS, Ryan Michael

IPC: G05D23/19 ,  G06F1/20 ,  G01K3/08 ,  G01K7/42

CPC classification number: G05D23/1917 ,  G01K3/08 ,  G01K3/10 ,  G05B15/02 ,  G06F1/206

Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.

Abstract translation: 在一个实施例中，温度控制的方法包括从芯片上的温度传感器接收温度读数，基于温度读数计算温度相对于时间的一个或多个二阶导数，以及确定是否在基于芯片的基础上执行温度降低 在一个或多个计算的温度的二阶导数上。

公开(公告)号：WO2016053470A1

公开(公告)日：2016-04-07

申请号：PCT/US2015/043752

申请日：2015-08-05

Applicant: QUALCOMM INCORPORATED

Inventor： COUTTS, Ryan Michael ,  MITTAL, Arpit ,  MITTAL, Rajat ,  ALLAM, Mohamed Waleed ,  SAEIDI, Mehdi

IPC: G06F17/50

CPC classification number: G06F17/5009 ,  G06F17/15 ,  G06F17/5068 ,  G06F2217/78 ,  G06F2217/80

Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.

Abstract translation: 用于执行系统的热仿真的系统和方法在本文中公开。在一个实施例中，用于热仿真的计算机实现的方法包括确定系统中的电路的泄漏功率分布，将泄漏功率分布添加到动态功率分布 以获得组合的功率曲线，以及将组合的功率曲线与脉冲响应进行卷积以在系统上的位置处获得热响应。

公开(公告)号：WO2015038985A1

公开(公告)日：2015-03-19

申请号：PCT/US2014/055527

申请日：2014-09-12

Applicant: QUALCOMM INCORPORATED

Inventor： MITTAL, Arpit

IPC: G06F3/01 ,  G06K9/00 ,  G06F3/00

CPC classification number: G06F3/017 ,  G06F3/005 ,  G06K9/00355

Abstract: Methods and apparatuses of the present disclosure are presented for recognizing a gesture of a gesture object in a plurality of recorded data objects, with the recorded data objects being recorded over time. In some embodiments, a method includes computing at least one set of gesture angles using the plurality of recorded data objects, wherein each of the gesture angles in the at least one set comprises an angle measurement between two positions of the gesture object, the two positions recorded in successive data objects in the plurality of recorded data objects, and recognizing the gesture based on the at least one set of gesture angles. In some embodiments, the method includes recognizing the gesture is based further on comparing the at least one set of gesture angles to a gesture model.

Abstract translation: 呈现本公开的方法和装置用于在多个记录的数据对象中识别手势对象的手势，随着时间的推移记录所记录的数据对象。 在一些实施例中，一种方法包括使用所述多个记录的数据对象来计算至少一组手势角度，其中所述至少一个组中的每个所述手势角度包括所述手势对象的两个位置之间的角度测量， 记录在所述多个记录数据对象中的连续数据对象中，以及基于所述至少一组姿势角识别所述手势。 在一些实施例中，该方法包括识别手势进一步基于将至少一组手势角度与手势模型进行比较。

公开(公告)号：WO2017053067A1

公开(公告)日：2017-03-30

申请号：PCT/US2016/050576

申请日：2016-09-07

Applicant: QUALCOMM INCORPORATED

Inventor： MITTAL, Arpit ,  SAEIDI, Mehdi ,  MAHMOUDI, Farsheed

IPC: G06F1/32

CPC classification number: G06F1/206 ,  G05B15/02 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172

Abstract: A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.

Abstract translation: 一种用于温度缓解的方法包括从设置在计算设备内的温度传感器接收信号。 计算设备内的处理器芯片产生热量。 温度传感器的信号转换为温度数据。 该方法还包括处理温度数据以产生装置的外表面温度的估计。 该处理包括对温度数据应用低通滤波器，对温度数据施加幅度衰减，以及对温度数据应用延迟。 该方法还包括响应于设备的外表面的估计温度来减小处理器芯片的操作参数，例如工作频率。

公开(公告)号：WO2016183099A1

公开(公告)日：2016-11-17

申请号：PCT/US2016/031671

申请日：2016-05-10

Applicant: QUALCOMM INCORPORATED

Inventor： MITTAL, Rajat ,  PARK, Hee Jun ,  WANG, Peng ,  SAEIDI, Mehdi ,  MITTAL, Arpit

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/34 ,  H01L23/38

CPC classification number: G06F1/206 ,  G01K7/04 ,  G05D23/1906 ,  H01L23/34 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1094 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

Abstract translation: 封装封装（PoP）器件包括第一封装，第二封装和双向热电冷却器（TEC）。 第一封装包括第一基板和耦合到第一基板的第一管芯。 第二个包装耦合到第一个包装。 第二包装包括第二基板和耦合到第二基板的第二管芯。 TEC位于第一模具和第二基板之间。 TEC适于在第一包装和第二包装之间动态地散发热量。 TEC适于在第一时间段内将热量从第一管芯散热到第二管芯。 TEC进一步适于在第二时间段内将热量从第二管芯传送到第一管芯。 TEC适于通过第二衬底将热量从第一裸片散发到第二裸片。

公开(公告)号：WO2015123146A1

公开(公告)日：2015-08-20

申请号：PCT/US2015/015041

申请日：2015-02-09

Applicant: QUALCOMM INCORPORATED

Inventor： MITTAL, Arpit ,  LOKE, Alvin Leng Sun ,  SAEIDI, Mehdi ,  DRENNAN, Patrick

IPC: H01L23/367 ,  H01L49/02 ,  H01L23/522

CPC classification number: H05K1/0204 ,  H01C1/01 ,  H01C1/08 ,  H01C1/084 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5228 ,  H01L28/20 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

Abstract translation: 金属热源用于散热集成电路电阻。 可以使用线路层的前端，例如氮化钛层来形成电阻器。 金属区域（例如，在第一金属层中）位于电阻器上方以形成散热器。 连接到金属区域的热柱的区域也位于电阻器上方。 金属区域可以连接到集成电路的基板，以提供出集成电路外的低阻抗热路径。

公开(公告)号：WO2015103623A1

公开(公告)日：2015-07-09

申请号：PCT/US2015/010346

申请日：2015-01-06

Applicant: QUALCOMM INCORPORATED

Inventor： PEDLEY, Christopher ,  WARD, Jonathan David ,  MITTAL, Arpit ,  MACIOCCI, Giuliano

IPC: H04N13/04

CPC classification number: G06T19/006 ,  G02B27/0093 ,  G02B27/017 ,  G02B2027/0138 ,  G02B2027/014 ,  G02B2027/0187 ,  G06F3/0346 ,  G06T7/30 ,  G06T2207/20101 ,  G06T2207/30204 ,  H04N13/327 ,  H04N13/344

Abstract: Two-dimensional or three-dimensional augmented reality (AR) markers are provided for alignment with a target object in calibrating an optical see-through display, such as a head-mounted display (HMD), in an AR system. A calibrated projection matrix for calibration of the optical see-through display is computed based upon a user's repeated alignments of the AR markers with the target object.

Abstract translation: 提供二维或三维增强现实（AR）标记，用于在AR系统中校准光学透视显示器（例如头戴式显示器（HMD））中的对象。 基于用户对AR标记与目标对象的重复比对来计算用于校准光学透视显示器的校准投影矩阵。

公开(公告)号：EP3800516A1

公开(公告)日：2021-04-07

申请号：EP20209297.9

申请日：2016-06-10

Applicant: QUALCOMM Incorporated

Inventor： SAEIDI, Mehdi ,  RAHIM, Emil ,  MITTAL, Rajat ,  MITTAL, Arpit

IPC: G04G17/00 ,  G06F1/20

Abstract: A beat transfer component of a smart watch captures at least a portion of heat emitted by one or more electronic components located within an enclosure of the smart watch. The heat transfer component transfers at least a portion of the captured heat to a wrist band outside the enclosure of the smart watch. The wrist hand allows for dissipation of at least a portion of the transferred heat through at least one surface of the wrist band.

公开(公告)号：EP3201806A1

公开(公告)日：2017-08-09

申请号：EP15749946.8

申请日：2015-08-05

Applicant: QUALCOMM INCORPORATED

Inventor： COUTTS, Ryan Michael ,  MITTAL, Arpit ,  MITTAL, Rajat ,  ALLAM, Mohamed Waleed ,  SAEIDI, Mehdi

IPC: G06F17/50

CPC classification number: G06F17/5009 ,  G06F17/15 ,  G06F17/5068 ,  G06F2217/78 ,  G06F2217/80

Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.

Abstract translation: 本文公开了用于执行系统的热模拟的系统和方法。在一个实施例中，用于热模拟的计算机实现的方法包括确定系统中的电路的泄漏功率分布，将泄漏功率分布添加到动态功率分布 以获得组合功率分布，以及将组合功率分布与脉冲响应卷积以获得系统位置处的热响应。

公开(公告)号：EP3323024B1

公开(公告)日：2020-11-25

申请号：EP16733782.3

申请日：2016-06-10

Applicant: Qualcomm Incorporated

Inventor： SAEIDI, Mehdi ,  RAHIM, Emil ,  MITTAL, Rajat ,  MITTAL, Arpit

IPC: G04G17/00 ,  G06F1/20