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公开(公告)号：WO2017099987A1
公开(公告)日：2017-06-15
申请号：PCT/US2016/063125
申请日：2016-11-21
Applicant: QUALCOMM INCORPORATED
Inventor： MITTAL, Rajat , SAEIDI, Mehdi , MITTAL, Arpit , RAHIM, Emil
CPC classification number: G05F1/463 , G01K13/00 , G06F1/206 , G06F1/3206
Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.
Abstract translation: 在一个实施例中，温度管理系统包括芯片上的多个温度传感器和温度管理器。 温度管理器被配置为从温度传感器接收多个温度读数，基于温度读数确定多个功率值，基于确定的功率值确定多个温度值，所确定的温度值对应于 芯片上的多个不同位置，并且基于所确定的温度值来估计芯片上的热点的温度。
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2.发明申请THERMAL SOLUTION FOR WEARABLE DEVICES BY USING WRIST BAND AS HEAT SINK 审中-公开通过使用手把带作为散热器的耐用设备的热解决方案
公开(公告)号：WO2017011112A1
公开(公告)日：2017-01-19
申请号：PCT/US2016/037065
申请日：2016-06-10
Applicant: QUALCOMM INCORPORATED
Inventor： SAEIDI, Mehdi , RAHIM, Emil , MITTAL, Rajat , MITTAL, Arpit
Abstract: A heat transfer component of a smart watch captures at least a portion of heat emitted by one or more electronic components located within an enclosure of the smart watch. The heat transfer component transfers at least a portion of the captured heat to a wrist band outside the enclosure of the smart watch. The wrist band allows for dissipation of at least a portion of the transferred heat through at least one surface of the wrist band.
Abstract translation: 智能手表的传热部件捕获位于智能手表的外壳内的一个或多个电子部件发出的至少一部分热量。 传热部件将至少一部分捕获的热量传递到智能手表的外壳外部的腕带。 腕带允许通过手腕带的至少一个表面散发所传送的热量的至少一部分。
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公开(公告)号：WO2014126966A1
公开(公告)日：2014-08-21
申请号：PCT/US2014/015946
申请日：2014-02-12
Applicant: QUALCOMM INCORPORATED
Inventor： MITTAL, Arpit , MACIOCCI, Giuliano , TUNMER, Michael L. , MABBUTT, Paul
CPC classification number: G06F3/011 , G02B27/0093 , G02B27/017 , G02B2027/0138 , G02B2027/014 , G02B2027/0178 , G02B2027/0187 , G06F3/017 , G06F3/0304 , G06F3/04842 , G06T19/006
Abstract: Methods, systems, computer-readable media, and apparatuses for selecting an Augmented Reality (AR) object on a head mounted device (HMD) are presented. In some embodiments, an HMD may define a Region-of-Interest (ROI) based on a gesture formed by at least one hand of a user. Subsequently the HMD may display to the user a shape on the HMD. In at least one arrangement, the shape outlines the ROI. Additionally, the HMD may display to the user a plurality of AR objects, each of the plurality of AR objects being associated with a target inside the ROI. Furthermore, the HMD may reduce the size of the ROI based on a first movement of the at least one hand of the user to form a reduced-sized ROI. In at least one arrangement, the reduced-sized ROI is used to select a specific AR object from the plurality of AR objects.
Abstract translation: 提出了用于在头戴式装置（HMD）上选择增强现实（AR）对象的方法，系统，计算机可读介质和装置。 在一些实施例中，HMD可以基于由用户的至少一只手形成的手势来定义感兴趣区域（ROI）。 随后，HMD可以向用户显示HMD上的形状。 在至少一个布置中，形状概述了ROI。 此外，HMD可以向用户显示多个AR对象，多个AR对象中的每一个与ROI内的目标相关联。 此外，HMD可以基于用户的至少一只手的第一移动来减小ROI的大小以形成减小尺寸的ROI。 在至少一个布置中，缩小尺寸的ROI用于从多个AR对象中选择特定的AR对象。
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公开(公告)号：WO2017039977A1
公开(公告)日：2017-03-09
申请号：PCT/US2016/046130
申请日：2016-08-09
Applicant: QUALCOMM INCORPORATED
Inventor： RAHIM, Emil , SAEIDI, Mehdi , MITTAL, Arpit , MITTAL, Rajat
CPC classification number: G06F1/163 , G02B27/0176 , G06F1/203 , G06F3/011 , H05K7/20127 , H05K7/20509
Abstract: Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.
Abstract translation: 系统和方法涉及电子耳机的热管理，例如虚拟现实耳机。 电子耳机包括可容纳处理系统的主体。 散热器附接到身体，其中散热器包括烟囱。 烟囱旨在消散处理系统产生的热量。 可以根据能够与用户皮肤接触的电子耳机的外表面感知到的热量来控制散热器来扩展烟囱。 烟囱包括气隙，并提供被动冷却系统。
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公开(公告)号：WO2016200521A1
公开(公告)日：2016-12-15
申请号：PCT/US2016/031143
申请日：2016-05-06
Applicant: QUALCOMM INCORPORATED
Inventor： SAEIDI, Mehdi , MITTAL, Arpit , RAHIM, Emil , MITTAL, Rajat , SAMADI, Kambiz
CPC classification number: H05K1/0203 , G05B15/02 , H05K1/0209 , H05K1/0272 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K2201/064
Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.
Abstract translation: 提供了用于实施合成射流以冷却装置的方法和装置。 这些技术的示例使得器件的壳体足够冷却成为手持式，同时允许位于壳体中的电路元件的较高温度以最大化电路性能。 在一个示例中，提供了包括被配置为在移动设备内传递热量的合成射流的移动设备。 合成射流可以嵌入在移动装置内的电路板中，使得电路板限定合成射流的室的至少一部分并且限定合成射流的孔口。 设备壳体可以在移动设备内定义至少一个流体通道。 此外，电路板可以限定配置成在至少一个流体通道处引导流体的合成射流出口。 还提供了用于控制合成射流的方法。
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Patent Agency Ranking
公开(公告)号：EP2956843B1
公开(公告)日：2019-08-28
申请号：EP14711329.4
申请日：2014-02-12
Applicant: Qualcomm Incorporated
Inventor： MITTAL, Arpit , MACIOCCI, Giuliano , TUNMER, Michael L. , MABBUTT, Paul
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公开(公告)号：EP3323024A1
公开(公告)日：2018-05-23
申请号：EP16733782.3
申请日：2016-06-10
Applicant: Qualcomm Incorporated
Inventor： SAEIDI, Mehdi , RAHIM, Emil , MITTAL, Rajat , MITTAL, Arpit
Abstract: A heat transfer component of a smart watch captures at least a portion of heat emitted by one or more electronic components located within an enclosure of the smart watch. The heat transfer component transfers at least a portion of the captured heat to a wrist band outside the enclosure of the smart watch. The wrist band allows for dissipation of at least a portion of the transferred heat through at least one surface of the wrist band.
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公开(公告)号：EP3518080A1
公开(公告)日：2019-07-31
申请号：EP19162420.4
申请日：2014-02-12
Applicant: QUALCOMM INCORPORATED
Inventor： MITTAL, Arpit , MACIOCCI, Giuliano , TUNMER, Michael L. , MABBUTT, Paul
Abstract: Methods, systems, computer-readable media, and apparatuses for selecting an Augmented Reality (AR) object on a head mounted device (HMD) are presented. In some embodiments, an HMD may define a Region-of-Interest (ROI) based on a gesture formed by at least one hand of a user. Subsequently the HMD may display to the user a shape on the HMD. In at least one arrangement, the shape outlines the ROI. Additionally, the HMD may display to the user a plurality of AR objects, each of the plurality of AR objects being associated with a target inside the ROI. Furthermore, the HMD may reduce the size of the ROI based on a first movement of the at least one hand of the user to form a reduced-sized ROI. In at least one arrangement, the reduced-sized ROI is used to select a specific AR object from the plurality of AR objects.
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9.发明申请CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING IN-PACKAGE SENSOR 审中-公开使用内置传感器为计算设备提供温度降低的电路和方法
公开(公告)号：WO2017053066A1
公开(公告)日：2017-03-30
申请号：PCT/US2016/050572
申请日：2016-09-07
Applicant: QUALCOMM INCORPORATED
Inventor： SAEIDI, Mehdi , ROSHANDELL, Melika , MITTAL, Arpit , MAHMOUDI, Farsheed
IPC: G06F1/20
Abstract: A method includes: receiving an electrical signal from a temperature sensor, wherein the temperature sensor is disposed within a package including a processor chip, further wherein the temperature sensor is thermally separated from the processor chip by materials within the package, generating temperature information from the electrical signal, processing the temperature information to determine that a performance of the processor chip should be mitigate, and mitigating the performance of the processor chip in response to the temperature information, wherein processing the temperature information and mitigating the performance of the processor are performed by the processor chip.
Abstract translation: 一种方法包括：从温度传感器接收电信号，其中所述温度传感器设置在包括处理器芯片的封装内，其中所述温度传感器通过所述封装内的材料与所述处理器芯片热分离，从所述温度传感器产生温度信息 电信号，处理温度信息以确定应该缓解处理器芯片的性能，并且响应于温度信息来减轻处理器芯片的性能，其中处理温度信息和减轻处理器的性能由 处理器芯片。
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10.发明申请
公开(公告)号：WO2017048472A1
公开(公告)日：2017-03-23
申请号：PCT/US2016/048465
申请日：2016-08-24
Applicant: QUALCOMM INCORPORATED
Inventor： SAEIDI, Mehdi , MITTAL, Arpit , MAHMOUDI, Farsheed , MITTAL, Rajat
CPC classification number: G06F1/206 , G06F1/3206 , G06F1/3234 , G06F1/3237 , G06F1/324 , Y02D10/126 , Y02D10/128 , Y02D10/16
Abstract: A method includes: generating a power consumption reading indicative of power consumption of a device, comparing the power consumption reading to a power threshold, wherein the power threshold represents a level of power consumption corresponding to a rise in temperature of an exterior surface of the device; in response to determining that the power consumption reading exceeds the power threshold, measuring cumulative power consumption over time from the power consumption reading; comparing the cumulative power consumption over time to an energy threshold, wherein the energy threshold corresponds to a temperature threshold for the exterior surface of the device; and in response to determining that the cumulative power consumption over time exceeds the energy threshold, reducing an operating parameter of the device to reduce power consumption.
Abstract translation: 一种方法包括：产生指示设备的功耗的功耗读取，将功耗读取与功率阈值进行比较，其中功率阈值表示对应于设备的外表面的温度升高的功耗水平 ; 响应于确定所述功耗读数超过所述功率阈值，从所述功耗读取中测量随时间的累积功耗; 将随时间的累积功耗与能量阈值进行比较，其中所述能量阈值对应于所述装置的外表面的温度阈值; 并且响应于确定随着时间的累积功率消耗超过能量阈值，减少设备的操作参数以降低功耗。
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