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    TRACE ANYWHERE INTERCONNECT
    11.
    发明申请
    TRACE ANYWHERE INTERCONNECT 审中-公开
    跟踪任何互连

    公开(公告)号：WO2017039790A1

    公开(公告)日：2017-03-09

    申请号：PCT/US2016/038687

    申请日：2016-06-22

    Applicant: R&D CIRCUITS, INC.

    Inventor： WARWICK, Thomas, P. ,  TURPUSEEMA, Dhananjaya ,  RUSSELL, James, V.

    IPC: H01R12/00 ,  B33Y80/00 ,  H01R12/14 ,  H01R13/02 ,  H05K1/14 ,  H05K3/36 ,  H01L23/522 ,  H01L23/535

    CPC classification number: H01R12/52 ,  H01L23/522 ,  H01L23/535 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/09118 ,  H05K2201/10287

    Abstract: The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side

    Abstract translation: 本发明提供了用于在两个或更多个并联电路平面上的离散点之间形成三维布线的电介质线的方法和结构。 导线可以在三维空间中自由布线，以在两个或多个并联电路平面上的两个任意定义的点之间创建最有效的路由。 将这些三维电介质线的外表面金属化，将离散导线电耦合到它们各自的离散接触点。 这些线中的两个或更多个可以彼此紧密接触，彼此电耦合以及两个或更多个离散的接触垫。 这些电耦合接触焊盘可以在结构的相对侧或同一侧上，并且所形成的金属化导线可以源于一侧并且终止于另一侧或从相同侧产生并终止

    RESURFACEABLE CONTACT PAD REDISTRIBUTION INTERPOSER FOR SEMICONDUCTOR PROBING
    14.
    发明申请
    RESURFACEABLE CONTACT PAD REDISTRIBUTION INTERPOSER FOR SEMICONDUCTOR PROBING 审中-公开
    用于半导体探头的可重复接触垫重新分配插接器

    公开(公告)号：WO2016209386A1

    公开(公告)日：2016-12-29

    申请号：PCT/US2016/031751

    申请日：2016-05-11

    Applicant: R&D CIRCUITS, INC.

    Inventor： RUSSELL, James, V.

    IPC: H01L23/50 ,  H01L21/50

    CPC classification number: H01L23/50 ,  G01R1/07378 ,  H01L21/50 ,  H01L23/49827

    Abstract: The present invention relates to a method and an apparatus for a resurfaceable contact pad that uses; an epoxy to encapsulate contact pads so that the epoxy and encapsulated contact pads are coplanar on a silicon redistribution interposer. These redistribution interposers electrically connect a wafer semi-conductor to a probe card where it is necessary to convert the course pad arrangement of one with a fine pad arrangement of the other through the use of an interposer board. The present invention relates to an apparatus and a method creates resurfaceable contact pads which may be resurfaced one or multiple times with an abrasive sanding operation to recreate a coplanar surface should any contact pad surfaces become damaged, allowing for a more cost- effective repair.

    Abstract translation: 本发明涉及一种使用的可再现接触焊盘的方法和装置; 环氧树脂以封装接触焊盘，使得环氧树脂和封装的接触焊盘在硅再分布插入件上共面。 这些再分布插入器将晶片半导电体电连接到探针卡，其中需要通过使用插入板来将另一个的导线板布置与另一个的精细焊盘布置相结合。 本发明涉及一种设备和方法，其产生可重新接触的接触垫，其可以通过磨料砂磨操作重新浮雕一次或多次，以在任何接触垫表面损坏时重建共面，从而允许更具成本效益的修复。

    A METHOD AND AN ELECTRICAL INTERCONNECT MECHANISM
    15.
    发明申请
    A METHOD AND AN ELECTRICAL INTERCONNECT MECHANISM 审中-公开
    一种方法和电气互连机制

    公开(公告)号：WO2013158162A1

    公开(公告)日：2013-10-24

    申请号：PCT/US2013/000096

    申请日：2013-03-28

    Applicant: R&D CIRCUITS, INC.

    Inventor： WARWICK, Thomas, P. ,  RUSSELL, James, V. ,  MCMULLIN, Dermick ,  QUICK, William

    IPC: H01R12/00

    CPC classification number: H01R13/03 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/26 ,  Y10T29/49208 ,  Y10T29/4921

    Abstract: A method and an electrical interconnect mechanism in which elastomeric pins are printed onto metal retainer tabs having at least one protrusion or tab extending laterally therefrom to engage a catch or recess of the laminated housing so as to locate each of the elastomeric pins and secure them within the housing. In one embodiment a champher may be employed with a catch or recess to engagely secure a second protrusion or tab extending laterally from another side of said elastomeric pin. In another embodiment the elastomeric pin may have a solid metal ring or a slide collar around the center of the pin wherein the ring has one or two tabs for engaging the recess in the housing and if preferred also the recess of a champfer.

    Abstract translation: 一种方法和电互连机构，其中弹性销被印刷到具有至少一个从其横向延伸的突起或突片的金属保持器突片上，以接合层叠壳体的卡扣或凹部，以便定位每个弹性销并将其固定在 住房。 在一个实施例中，可以使用带有卡扣或凹槽的凸轮来接合地固定从所述弹性销的另一侧横向延伸的第二突起或突出部。 在另一个实施例中，弹性体销可以具有围绕销的中心的实心金属环或滑动环，其中环具有用于接合壳体中的凹部的一个或两个突出部以及冠状器的凹部。

    AN ELECTRICAL CONNECTOR FOR CONNECTING AN ADAPTOR BOARD OR ELECTRICAL COMPONENT TO A MAIN PRINTED CIRCUIT BOARD
    16.
    发明申请
    AN ELECTRICAL CONNECTOR FOR CONNECTING AN ADAPTOR BOARD OR ELECTRICAL COMPONENT TO A MAIN PRINTED CIRCUIT BOARD 审中-公开
    一种用于将适配器板或电子元件连接到主印刷电路板的电连接器

    公开(公告)号：WO2011115662A2

    公开(公告)日：2011-09-22

    申请号：PCT/US2011/000454

    申请日：2011-03-11

    Applicant: R&D CIRCUITS INC.

    Inventor： RUSSELL, James, V.

    IPC: H01R12/51 ,  H05K1/11

    CPC classification number: H01R12/7082 ,  H01R12/57

    Abstract: An electrical connector electrically connects either an adaptor board or an electrical component to a main circuit board through the use of a thin printed circuit having an array of pads one each side where on one side the pads are connected to a main circuit board by solder balls, solder columns conductive epoxy or any other way practiced in the art and on the other side of the thin circuit the pads are connected to an adaptor board by a conductive compliant elastomeric material. The sides of the thin printed circuit are electrically connected to one another in ways practiced in the art.

    Abstract translation: 电连接器通过使用具有焊盘阵列的薄印刷电路将适配器板或电气部件电连接到主电路板，其中在每一侧焊盘连接在一侧上 通过焊球，导电环氧树脂或本领域中实践的任何其他方式通过焊球，在薄电路的另一侧上通过导电顺应性弹性体材料将焊盘连接至适配器板。 薄印刷电路的侧面以本领域实践的方式相互电连接。

    METHOD AND APPARATUS FOR IMPROVING POWER AND LOSS FOR INTERCONECT CONFIGURATIONS
    18.
    发明申请
    METHOD AND APPARATUS FOR IMPROVING POWER AND LOSS FOR INTERCONECT CONFIGURATIONS 审中-公开
    用于改善互连配置功率和损耗的方法和装置

    公开(公告)号：WO2010129002A1

    公开(公告)日：2010-11-11

    申请号：PCT/US2010/000043

    申请日：2010-01-08

    Applicant: R&D CIRCUITS INC. ,  RUSSELL, James, V.

    Inventor： RUSSELL, James, V.

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: H05K1/185 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K1/112 ,  H05K3/4046 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.

    Abstract translation: 本公开涉及嵌入诸如电极内部的电容或电阻内部的功率修改部件，其位于延伸超过PCB的通孔的位置以使得包含嵌入的电容或电阻的焊盘的一部分位于 通道或百叶窗位于。 每个垫将包括位于通孔或百叶窗中的给定一个上的开口，以允许该通孔穿过开口。 以这种方式，电容和电阻将具有更接近的电气部件的接触点。

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