Abstract:
A light activated AND gate (10) is disclosed which generates a light signal at a first output port (14) in response to the simultaneous presence of light signals at an input port (12) and a control port (18). With a light signal present at the control port (18), a light beam at the input port (12) is reflected from an interface between two regions (13, 15) having different indices of refraction, and the reflected light beam then exits through a first output port (16). In the absence of a light signal at the control port (18), the two regions (13, 15) of the switching device (10) have the same index of refraction, and the light beam at the input port (12) passes through both regions (13, 15) and exits through a second output port (14).
Abstract:
A memory (500) based on a ferroelectric FET, the ferroelectric FET includes a gate electrode (14), a layer of ferroelectric material (16), layer of semiconducting material (18), a source electrode (21) and a drain electrode (22). The layer of ferroelectric material (16) is sandwiched between the gate electrode (14) and the layer of semiconducting material (18), the source and drain electrodes being in contact with the layer of semiconducting material and spaced apart from one another. The memory (500) includes a circuit for setting the ferroelectric FET to one of two states. The first state is set by applying a first voltage to the source and drain electrodes and a second voltage to the gate electrode. The second state is set by applying a third voltage to the gate and drain electrodes and fourth voltage to the source electrode. This arrangement reduces the number of pass transistors needed per ferroelectric FET to one plus a simple pulsing circuit that must be included with each word of memory.
Abstract:
A memory (500) for storing a plurality of words of data. Each of the words includes N data bits, where N is an integer greater than 1. The memory (500) includes a plurality of storage cells, each of the word storage cells having N + 1 single bit memory cells (512, 513, 514, 517). The single bit memory cells (512, 513, 514, 517) are numbered from 1 to N + 1. Each of the single bit memory cells (512, 513, 514, 517) connects a conductor in a word bus common to all of the memory cells in that word to a bit line that is connected in common to all of the single bit memory cells (512, 513, 514, 517) having the same number. The word bus also includes a conductor for transmitting a signal indicating that this connection is to be made. Each of the single bit memory cells (512, 513, 514) having a number between 1 and N stores one of the N data bits. The memory (500) also includes N sense amplifiers (550, 560, 570), one of the sense amplifiers (550, 560, 570) being connected to each of the bit lines to which the bits numbered 1 to N are connected. Each of the sense amplifiers (550, 560, 570) compares a signal on the bit line (551-553) connected thereto to a signal on the bit line (557) connected to the single bit memory cells (517) numbered (N + 1). When data is written into the data bits of the word, a predetermined value is preferably written into the single bit memory cell (517) number N + 1. Embodiments of the present invention based on ferroelectric FET memory cells (10) or ferroelectric capacitor-based memory cells (100) are preferred.
Abstract:
A method for making an improved LSCO stack in the generation of small platinum features (46) on the surface of a substrate (32) by sputtering of the LSCO material (54) and utilizing a photoresist mask to pattern the LSCO (54) in accordance with the platinum features (46). The problems and expense associated with high-temperature deposition of LSCO on platinum and the etching thereof are overcome by sputtering the LSCO at room temperature.
Abstract:
The invention is applicable to integrated circuit having ferroelectric layers that are switched between two states during the operation of the integrated circuit. In the present invention (10), a capacitor (19) has a ferroelectric layer (22) constructed from a material having a Curie point below 400 DEG C. In the typical integrated circuit fabrication process, the final step in the process before packaging involves annealing the circuit at a temperature above the Curie point of the ferroelectric layer used in an integrated circuit according to the present invention. Hence, any accumulated asymmetric charge distribution in the ferroelectric layer resulting from the processing of the integrated circuit after the deposition of the ferroelectric layer is eliminated. If the normal fabrication process does not involve a final annealing step at a temperature above the Curie point of the ferroelectric layer, a final annealing step in which the ferroelectric is annealed at a temperature above its Curie point is used.
Abstract:
A method for coating the surface of a substrate with a thin film of ferroelectric material. A flow of a metalorganic vapor such as tetraethyl lead, zirconium t-butoxide, and titanium isopropoxide is directed towards a silicon substrate. Also, a flow of ionized particles is generated by subjecting a gas to an rf electromagnetic field. The afterglow of excited state species particles intersects the path of the flow of metalorganic vapor at a location displaced from the surface of the substrate producing a flow of activated metalorganic vapor which then deposits on the heated substrate. The figure illustrates a plasma enhanced chemical vapor deposition reactor which consists of a plasma generator (10) where the excited species is generated, a precursor activation chamber (20), the deposition region where the heated substrate (32) is located, and an exhaust system (40).
Abstract:
A light activated switching device (10) is disclosed in which the receipt of a light signal is used to switch a light beam between two output ports (14) and (16). The input light beam is reflected from an interface between two regions having different indices of refraction when the light signal is present. The reflected light beam then exits through the first output port (16). In the absence of the light signal, the two regions have the same index of refraction, and the light beam passes through both regions and exits through the second output port (14).