公开(公告)号：DE3147729A1

公开(公告)日：1983-06-09

申请号：DE3147729

申请日：1981-12-02

Applicant: SIEMENS AG

Inventor： BRENNER HERMANN ,  HADERSBECK HANS ING GRAD

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L21/92 ,  H01L23/50

公开(公告)号：DE2949184A1

公开(公告)日：1981-07-23

申请号：DE2949184

申请日：1979-12-06

Applicant: SIEMENS AG

Inventor： HADERSBECK HANS ING GRAD ,  ZUKIER HUBERT

IPC: H05K1/18 ,  H05K3/34 ,  H05K13/04 ,  H05K7/08

Abstract: A printed circuit board has temperature-stable electric components, such as resistance networks, disposed on the soldering side of the circuit board. The components mounted on the soldering side of the board are mounted as a unit containing the network, which unit has a recess which partially surrounds the solder connection location of the circuit board, at which point the unitary component is electrically and mechanically connected to the board. The recesses are beveled to facilitate solder flow, and cover approximately half of the connection location of the circuit board.

公开(公告)号：DE2840973A1

公开(公告)日：1980-03-27

申请号：DE2840973

申请日：1978-09-20

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HADERSBECK HANS ING GRAD ,  HACKE HANS-JUERGEN DIPL ING

IPC: H01L23/08 ,  H01L21/50 ,  H01L21/603 ,  H01L21/607 ,  H01L23/057 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/28 ,  H01C1/02 ,  H01L23/48

公开(公告)号：DE3579282D1

公开(公告)日：1990-09-27

申请号：DE3579282

申请日：1985-08-23

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HADERSBECK HANS ING GRAD

IPC: H01L21/60 ,  H01L23/48 ,  H01L23/485

Abstract: A method for producing a copper platform on integrated circuits formed on a semiconductor wafer wherein an aluminum layer is back-sputtered over the circuits to provide contact surfaces thereon, followed by sputtering on successive layers of titanium and copper on the aluminum layer. A copper platform is electrolytically built up above the aluminum layer and thereafter the copper layer is etched away. The copper platform is then metallized by electroless deposition, and finally the titanium layer is etched away.

公开(公告)号：DE3237394A1

公开(公告)日：1984-04-12

申请号：DE3237394

申请日：1982-10-08

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HADERSBECK HANS ING GRAD ,  WALLENHORST FRIEDHELM DIPL CHE

IPC: C23C18/44 ,  C23C3/02

Abstract: A chemical gilding bath is formulated on the basis of an alkaline, aqueous solution of an alkali gold cyanide complex and has a reducing agent and a stabilizing agent therein. The reducing agent is an organic compound containing at least one enol group within the molecular structure thereof, such as ascorbic acid or salts thereof. The pH value of the bath is adjusted by a buffer solution so as to range between about 7.5 to 12 and preferably is about 8.

公开(公告)号：DE2940769A1

公开(公告)日：1981-04-16

申请号：DE2940769

申请日：1979-10-08

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HACKE HANS-JUERGEN DIPL ING ,  HADERSBECK HANS ING GRAD

IPC: H01L33/38 ,  H01L33/62 ,  H01L21/60 ,  H01L33/00

Abstract: Light emitting diodes, consisting of a light emitting chip, a metal system carrier with two terminals, and an encapsulation are contacted by a process involving surface metallisation. The light emission takes place at the chip side surfaces, orthogonal to the pn - junction surface. Both chip main surfaces are completely metallised. The system carrier has shanks, forming an anode (5) and a cathode (1), between which the metallised chip is inserted. The resilience of the shanks provides the holding pressure. Then the assembled component is provided with a known encapsulation. Subsequently the contact is preferably finallised by adhesion, soldering, or welding (2). The system carrier may be comb-shaped and may be fitted with fastening sockets.

公开(公告)号：DE2716545A1

公开(公告)日：1978-10-19

申请号：DE2716545

申请日：1977-04-14

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  GROEBER ALFRED ING GRAD ,  HAASE WOLFGANG ING GRAD ,  HACKE HANS-JUERGEN DIPL ING ,  HADERSBECK HANS ING GRAD ,  ZUKIER HUBERT

IPC: H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06

公开(公告)号：DE2641540A1

公开(公告)日：1978-03-16

申请号：DE2641540

申请日：1976-09-15

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ING GRAD ,  HADERSBECK HANS ING GRAD ,  HACKE HANS-JUERGEN DIPL ING ,  KULIGOWSKI GERD ING

IPC: G09F9/33 ,  H01L25/04 ,  H01L25/075 ,  H01L33/00 ,  H01L27/14 ,  H01L27/15 ,  H01L31/00

公开(公告)号：DE2541280A1

公开(公告)日：1977-03-17

申请号：DE2541280

申请日：1975-09-16

Applicant: SIEMENS AG

Inventor： HACKE HANS-JUERGEN DIPL ING ,  HADERSBECK HANS ING GRAD

IPC: H05K3/28 ,  H05K3/06 ,  H05K3/34 ,  H05K3/42

Abstract: A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, characterized by galvanically applying a solderable etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub-zones with a solder rejecting property with the aid of passivation without impairing the solderability of the etch-resistant metal layers of the first sub-zones.

公开(公告)号：DE2524581A1

公开(公告)日：1976-12-23

申请号：DE2524581

申请日：1975-06-03

Applicant: SIEMENS AG

Inventor： HADERSBECK HANS ING GRAD ,  ANDRASCEK ERNST ING GRAD ,  GROEBER ALFRED ING GRAD

IPC: H01R12/04 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/36

Abstract: A flexible printed circuit board has conductors on opposite sides thereof which are through-contacted by die-punching the board to form an angularly-displaced tongue portion about which solder is flowed to contact both conductors. A terminal pin is optionally inserted through the board to connect a component, the pin being engaged by the angularly-displaced tongue to ensure reliable mechanical and electrical contact in the soldered joint. The through-contact is formed with a bevel-faced die in conjunction with a cutting plate.