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公开(公告)号：JPH05218135A
公开(公告)日：1993-08-27
申请号：JP4024392
申请日：1992-01-30
Applicant: SONY CORP
Inventor： SOGO KEIKO , HAKUTA TATSUO , ASAGI OSAMU , TAWARA HIROKI
Abstract: PURPOSE:To obtain a height of a soldered part of an IC chip from a board and to improve reliability of its connection by providing a photoresist cured layer for controlling the height of the chip on the board. CONSTITUTION:A surface of the side formed with a land 5 of a board 4 is coated with photoresist 12, and a photomask is mounted at a predetermined position in close contact on the photoresist 12. The photoresist 12 is exposed through the photomask, thereby forming a cross-shaped cured layer 12a. Then, a solder bump 3 supplied to an electrode pad 2 of an IC chip 1 is aligned with the land 5 on the board 4, made to abut on the land 5, heated, and the bump 3 reflows. In this case, even if the chip 1 is sunk by its own weight, the height of the chip 1 on the board 4 at the time of mounting is controlled by the layer 12a of the photoresist 12 so that the solder is not laterally spread. Even when an interval of the lands 5 is narrow, generation of a bridge can be prevented.
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公开(公告)号：JP2002368408A
公开(公告)日：2002-12-20
申请号：JP2001168795
申请日：2001-06-04
Inventor： WATANABE HARUO , HANIYU KAZUTAKA , ASAGI OSAMU
Abstract: PROBLEM TO BE SOLVED: To provide a method for evaluating the solderability of a component, based on the heat capacity of the component from latent heat caused by the phase change of a material, and to provide a method for improving the solderability of the component applied to soldering using solder whose melting point is very high such as unleaded solder.
SOLUTION: In the method for evaluating the solderability of the component, the heat capacity of the component is grasped from latent heat caused by the phase change of the material. In the soldering method of the component, the heat capacity of the component is grasped from latent heat caused by the phase change of the material and solder is heat-supplied in accordance with the heat capacity of the component at the time of soldering the component.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种用于评估部件的可焊性的方法，其基于由材料的相变导致的潜热的部件的热容量，并且提供一种提高应用的部件的可焊性的方法 使用熔点非常高的焊料进行焊接，例如无铅焊料。 解决方案：在用于评估部件的可焊性的方法中，部件的热容量由材料的相变引起的潜热所掌握。 在部件的焊接方法中，部件的热容量由材料的相变引起的潜热掌握，并且焊料在焊接部件时根据部件的热容量进行热供给。
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公开(公告)号：JPH104299A
公开(公告)日：1998-01-06
申请号：JP17555396
申请日：1996-06-14
Applicant: SONY CORP
Inventor： ONAKA TAIJIROU , ASAGI OSAMU
IPC: H05K13/04
Abstract: PROBLEM TO BE SOLVED: To absorb the shock, etc., produced in case of connecting or disconnecting back up pins by a method wherein a substrate back up means is lifted at low rate in case the back up pins are connected or disconnected to and from a substrate while at high rate in the other cases. SOLUTION: A substrate back up means is composed of back up pins 12 and a lifting means. The lifting means is provided with an air cylinder (HC) 20 for high rate and another air cylinder (LC) for low rate while an angle plate 23 is connected to the shaft 20a of HC 20 for connecting to LC 21. Besides, a driving plate 15 is fixed to the shaft 21a of LC 21 while the driving plate 15 is provided with a lower back up plate 13b and an upper back up plate 13a, etc., for connecting to the back up pins 12. In the initial lifting term, the HC 20 is lifted at high rate but when the HC 20 approaches to the substrate 17, HC 20 is switched to LC 21 so as to lift up the plate 15 at low rate for supporting the substrate 17. During the other time, the HC only is operated as the lifting means.
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公开(公告)号：JPH05206383A
公开(公告)日：1993-08-13
申请号：JP1130692
申请日：1992-01-24
Applicant: SONY CORP
Inventor： TAWARA HIROKI , HAKUTA TATSUO , ASAGI OSAMU , SOGO KEIKO
IPC: H01L21/66 , H01L21/822 , H01L27/04
Abstract: PURPOSE:To provide a semiconductor wafer which easily allows easy inspection and measurement of the electric characteristic of an IC which is densely mounted and an inspection method thereof. CONSTITUTION:Electrode pads 7A are formed around the IC surface of a section 6A surrounded by dicing lines 3, 3A and 4, 4A on a semiconductor wafer whereupon the IC is formed by the prescribed arrangement. Test pads 8 are formed in response to the pads 7A on an area sandwiched by the two dicing lines 3, 3A and 4, 4A on the opposite side of the IC forming plane, a test pin is permitted to make contact with the pads so as to inspect and measure the electric characteristics. Since the test pads can be formed by the same dimensions and the pitch of the IC electrode pads of the conventional technique, the inspection and measurement of the IC are easily performed.
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公开(公告)号：JPH0536445A
公开(公告)日：1993-02-12
申请号：JP19037591
申请日：1991-07-30
Applicant: SONY CORP
Inventor： KOMATSU SHIGERU , ASAGI OSAMU
Abstract: PURPOSE:To improve the working efficiency in mounting and wiring by highly precisely soldering and fixing a dip type connector to a printed wiring board. CONSTITUTION:A plurality of elastic projections 6a, 6b (or 6c, 6d) provided on the holder 3 of a dip type connector 1 are elastically press-fitted to positioning holes 9a, 9b provided on a printed wiring board 8. The dip type connector 1 is mounted on and fixed to the printed wiring board 8, and a connector terminal is soldered to the conductive pattern of the printed wiring board 8. Thus, working efficiency in the mounting and wiring of the dip type connector can be improved.
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Patent Agency Ranking
公开(公告)号：JPH04320389A
公开(公告)日：1992-11-11
申请号：JP8874491
申请日：1991-04-19
Applicant: SONY CORP
Inventor： ASAGI OSAMU
Abstract: PURPOSE:To obtain a printed board which can be easily molded along a sewing line at the time of dividing by holding the board to be divided rigidly from manufacture of the board, mounting and to an end of soldering. CONSTITUTION:A board 6 in which a tool can be easily inserted and removed at a sewing line 3, is provided, the tool is inserted from a punched window of the board to cut connecting parts 4a, 4b for rigidly connecting separate boards 1, 2, and the board is divided along the line 3.
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公开(公告)号：JPH0985489A
公开(公告)日：1997-03-31
申请号：JP26785895
申请日：1995-09-20
Applicant: SONY CORP
Inventor： ASAGI OSAMU , EBIZUKA MORIYUKI , SHIOZAWA KOICHI , ICHIKAWA SEIJI
IPC: B23K35/22 , B23K1/20 , B23K35/02 , B23K35/363 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To obtain solder with which bridging does not arise and a soldering method by intimately mixing a photosetting flux with a solder material. SOLUTION: The solder paste formed by intimately mixing the solder material and the photosetting flux which is cured by irradiation with UV rays is used for a reflow soldering method. The photosetting flux contains a flux base, flux base solvent, photopolymn. initiator and photosetting prepolymer. The surfaces of the soldered parts of a printed circuit board are printed and stuck with the solder paste intimately mixed with such photosetting flux and are brought into tight contact with the pad parts of the leads of the electronic parts to be soldered. The exposed solder paste surfaces are irradiated with the UV rays, by which the surfaces are gelatinized. The surfaces are thereafter perheated, by which the solder is melted and heated (reflow heated) and the soldering is executed. Since the solder paste surfaces are cured by the irradiation with the UV rays, solder droop does not arise at the time of the preheating and the bridging defect by such droop is prevented.
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公开(公告)号：JPH0946040A
公开(公告)日：1997-02-14
申请号：JP21528795
申请日：1995-08-01
Applicant: SONY CORP
Inventor： ASAGI OSAMU , MIIKEDA KAORU , SHIOZAWA KOICHI , ICHIKAWA SEIJI
IPC: H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a reflow soldering method, by which short-circuit defects caused by solder bridges is eliminated. SOLUTION: In reflow soldering process, a step (3), which solidifies the solder paste of a substrate on which the solder paste is printed (1) beforehand before preheating (4), is provided. The surface of the solder paste and even in the inside of the solder paste are solidified. As the method of the solidification, the solder paste is heated at the temperature where the surface of the solder paste is not fluidized and the solder paste is solidified by natural drying. As another method, the solder paste can be heated under the ventilation at the temperature where the solder paste is not fluidized and the solder paste is solidified under the pressure reduced state at the room temperature. The sagging of the solder at the preheating can be prevented by solidifying the solder paste by preheating. Therefore, the short-circuit detects caused by bridges can be prevented even in the reflow soldering of a narrow-pitched part.
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公开(公告)号：JPH06233176A
公开(公告)日：1994-08-19
申请号：JP3464593
申请日：1993-01-29
Applicant: SONY CORP
Inventor： ASAGI OSAMU , ISHII MASAMI
IPC: H04N5/232
Abstract: PURPOSE:To obtain the same photographing image as in the case that as if photographing by the video camera is executed by holding an angle intended by a photographer, irrespective of an actual inclination of the video camera by adjusting an angle of a prism in which a photographing element is arranged, based on a result of detection from an inclination detecting means of the video camera. CONSTITUTION:When 5 deg. is set, a voltage value of an angle designating signal S3 is outputted at a voltage value which coincides with a voltage value of an angle detecting signal S1 outputted from an angle encoder 32, when a video camera 10 is inclined by 5 deg.. Accordingly, a comparing circuit 33 detects a difference between a degree of inclination of the camera 10 at this time and the designated angle 5 deg. by comparing the angle detecting signal S1 obtained from the encoder 32 with the angle designating signal S3 obtained through a switch circuit 35, and sends out a signal S2 for driving a motor 21 by a difference to the motor 21. The motor 21 is driven, and a rotary member 15 is rotated so as to become a designated angle in an angle designating part 34, by which a prism 16 with photographing elements 17A, 17B and 17C fixed can always be held at a designated angle.
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公开(公告)号：JPH0689481A
公开(公告)日：1994-03-29
申请号：JP26814592
申请日：1992-09-09
Applicant: SONY CORP
Inventor： KAWATANI NORIO , NAKAMURA TOSHIFUMI , TAKAMIZAWA YUTAKA , ASAGI OSAMU , OGAWA MICHIKO
Abstract: PURPOSE:To reproduce a signal recorded in a sound groove on a record disk under the noncontact state without using any record needle. CONSTITUTION:The sound groove 3 on the record disk 2 is irradiated with a slit beam 4b from a laser diode 1 of an optical head 25, and reflecting light reflected by disk surfaces 2a on both sides of the sound groove 3 is received by photodetectors 6 and 7. Based on these light receiving results, the optical head 25 is controlled to be positioned in a prescribed distant place right above the sound groove 3. Moreover, both side wall parts 3a and 3b of the sound groove 3 are irradiated with laser beams 10 and 11 from laser diodes 8 and 9 of the optical head 25, and these reflected beams of light are received by photodetectors 14 and 15, and based on these light receiving results, signals recorded on the side wall parts 3a and 3b are read out.
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