公开(公告)号：JPH11316908A

公开(公告)日：1999-11-16

申请号：JP12491898

申请日：1998-05-07

Applicant: SONY CORP

Inventor： SASAKI SATOSHI ,  KUDO HISASHI ,  SHIBAYAMA TETSUYA

IPC: G11B5/31

Abstract: PROBLEM TO BE SOLVED: To decrease etching quantity of a 2nd pole which serves as a mask at the time of etching. SOLUTION: A method for manufacturing a thin-film magnetic head made by forming a 1st and a 2nd magnetic core so as to opposite to each other through a magnetic gap is provided with a 1st magnetic layer forming process for forming a 1st magnetic layer 4 becoming a 1st magnetic core on a base body, a nonmagnetic layer forming process for forming a nonmagnetic layer 6 becoming a magnetic gap on the 1st magnetic layer 4, a 2nd magnetic layer forming process for forming a 2nd magnetic layer 11 in a specific shape becoming a 2nd magnetic core on the nonmagnetic layer 6 and an etching process for making the nonmagnetic layer 6 and 1st magnetic layer 4 integrally in a specific shape by etching the nonmagnetic layer 6 and 1st magnetic layer 4 by using the 2nd magnetic layer as a mask. In the etching process, when the nonmagnetic layer 6 is etched, etching is carried out by reactive ion etching and when the 1st magnetic layer 4 is etched, etching is carried out by ion beam etching.

公开(公告)号：JPH1036963A

公开(公告)日：1998-02-10

申请号：JP19333296

申请日：1996-07-23

Applicant: SONY CORP

Inventor： KUDO HISASHI ,  SUGANO YOSHIHIRO

IPC: C23C14/34

Abstract: PROBLEM TO BE SOLVED: To provide a sputtering device capable of forming soft magnetic coating free from magnetic anisotropy and small in coercive force at the time of forming thin coating film by a sputtering method and to provide a method for forming soft magnetic coating film using this. SOLUTION: This device is provided with a target 5 arranged on a cathode part 3, a substrate 6 arranged opposite to the target 5 and a coating thickness correcting board 7 arranged between the target 5 and the substrate 6, and the coating thickness correcting board 7 has an opening part 7a having a shape by which the distribution of the coating film thickness is considered. Then, the opening part 7a has plural slits partitioned by walls in the approximately orthogonal direction to the substrate face.

公开(公告)号：JP2008141180A

公开(公告)日：2008-06-19

申请号：JP2007277867

申请日：2007-10-25

Applicant: Sony Corp ,  ソニー株式会社

Inventor： FURUSHIMA YUJI ,  ABE HIROAKI ,  KUDO HISASHI ,  FUJIMOTO TSUTOMU ,  AOSHIMA KENTARO

IPC: H01S5/022

CPC classification number: H01S5/4043 ,  B82Y20/00 ,  G11B7/1275 ,  G11B2007/0006 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02476 ,  H01S5/0425 ,  H01S5/2214 ,  H01S5/2224 ,  H01S5/3432 ,  H01S5/34326 ,  H01S5/34333 ,  H01S5/4087 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device miniaturized by devising the location of connection pads. SOLUTION: A second light emitting device 30 comprises a stripe-shaped semiconductor layer 32 which is formed by superposing with a first light emitting device 20 and is formed in the opposite surface side to the first substrate of the second substrate 31, a stripe-shaped p lateral electrode 36 which supplies current to the semiconductor layer 32, stripe-shaped opposed electrodes 42, 44 which are located one-by-one opposite to respective p lateral electrodes 26A, 26B of the first light emitting device 20, and electrically connected with each other, connection pads 46, 48 electrically connected with the respective opposed electrodes 42, 44, and a connection pad 39 electrically connected with the p lateral electrode 36. The connection pads 39, 46, 48 are located in parallel with the opposed electrodes 42, 44. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供通过设计连接焊盘的位置来小型化的半导体发光器件。 解决方案：第二发光器件30包括条形半导体层32，其通过与第一发光器件20重叠形成并形成在与第二衬底31的第一衬底相反的表面侧中， 向半导体层32供给电流的条状p侧面电极36，与第一发光装置20的各个p侧面电极26A，26B相反一个位置的条状的对置电极42,44，以及 彼此电连接，与相应的相对电极42,44电连接的连接焊盘46,48以及与p侧电极36电连接的连接焊盘39.连接焊盘39,46,48与 对置电极42,43。（C）2008，JPO＆INPIT

公开(公告)号：JPH11350171A

公开(公告)日：1999-12-21

申请号：JP15481998

申请日：1998-06-03

Applicant: SONY CORP

Inventor： SASAKI SATOSHI ,  KUDO HISASHI ,  SHIBAYAMA TETSUYA

IPC: C23F4/00 ,  G11B5/31

Abstract: PROBLEM TO BE SOLVED: To uniformly irradiate a substrate with a beam and to eliminate the variation of the etching quantity within the substrate by largely repetitively turning the substrate in an intra-surface direction in an etching stage using the ion beam. SOLUTION: When the substrate is not turned, the substrate is irradiated with the ion beam 30 approximately parallel with the longs side on the upper surface of a second pole 8. The substrate is repetitively turned and moved back and forth between the position of 180 deg. in a plus direction and a position of 180 deg. in a minus direction. As the substrate is turned, the irradiation direction of the ion beam 30 with second pole 8 changes and the portion which is the shade of the second pole 8 changes accordingly. The direction where the irradiation direction of the ion beam 30 with the second pole 8 is successively varied by repetitively moving the substrate within a specified range. Even if, therefore, the shape of the second pile 8 is asymmetrical on the front side and the rear side, the uniform irradiation with the ion beam 30 is made possible.

公开(公告)号：JPH11316907A

公开(公告)日：1999-11-16

申请号：JP12491798

申请日：1998-05-07

Applicant: SONY CORP

Inventor： SASAKI SATOSHI ,  KUDO HISASHI ,  SHIBAYAMA TETSUYA

IPC: G11B5/31

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin-film magnetic head whose the record fringing is reduced by preventing a nonmagnetic layer and a 1st magnetic body which are left at the time of trim etching and removed matters from being restuck. SOLUTION: This method is provided with a 1st magnetic body forming process for forming a 1st magnetic body 4 becoming a 1st magnetic core on a base body, a nonmagnetic layer forming process for forming a nonmagnetic layer 6 becoming a magnetic gap on the 1st magnetic body, a 2nd magnetic body forming process for forming a 2nd magnetic body 11 in a specific shape becoming a 2nd magnetic core on the nonmagnetic layer 6 and an etching process for making the nonmagnetic layer 6 and the 1st magnetic body 4 integrally in a specific shape by ion beam etching by using the 2nd magnetic body 11 as a mask. Then, in the etching process, 1st etching is carried out while the base body is slanted at a specific angle to the incidence direction of the ion beam and is repeatedly rotated within a specific angle range and 2nd etching is carried out while the base body is slanted within an angle range larger than that of the 1st etching and is repeatedly rotated within an angle range larger than that of the 1st etching.