Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a memory element that prevents degradation in characteristics due to high temperature annealing after formation of element, and can be applied as a multi-use memory device. SOLUTION: A high resistance layer 3A consisting of an oxide of a metal element, and an ion source layer 3B containing metal elements (Cu, Ag, Zn) becoming an ion source are provided in this order between a lower electrode 2 and an upper electrode 4. When the high resistance layer 3A is formed after the lower electrode 2, superfluous oxygen in the high resistance layer 3A is discharged by performing annealing at a temperature equal to or higher than the annealing temperature in subsequent annealing (after formation of element). An oxide of such an element as Ta, Hf, Si, Ni or Co, or an rare earth element (e.g., Gd or Ce) is employed in the high resistance layer 3A. Annealing may be performed after forming the lower electrode 2 and before forming the high resistance layer 3A. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To decrease etching quantity of a 2nd pole which serves as a mask at the time of etching. SOLUTION: A method for manufacturing a thin-film magnetic head made by forming a 1st and a 2nd magnetic core so as to opposite to each other through a magnetic gap is provided with a 1st magnetic layer forming process for forming a 1st magnetic layer 4 becoming a 1st magnetic core on a base body, a nonmagnetic layer forming process for forming a nonmagnetic layer 6 becoming a magnetic gap on the 1st magnetic layer 4, a 2nd magnetic layer forming process for forming a 2nd magnetic layer 11 in a specific shape becoming a 2nd magnetic core on the nonmagnetic layer 6 and an etching process for making the nonmagnetic layer 6 and 1st magnetic layer 4 integrally in a specific shape by etching the nonmagnetic layer 6 and 1st magnetic layer 4 by using the 2nd magnetic layer as a mask. In the etching process, when the nonmagnetic layer 6 is etched, etching is carried out by reactive ion etching and when the 1st magnetic layer 4 is etched, etching is carried out by ion beam etching.
Abstract:
PROBLEM TO BE SOLVED: To provide a storage element which satisfies both the number of repeating operation and low voltage operating characteristics in the relation of trade-off. SOLUTION: The storage element includes a high-resistance layer 4 and an ion source layer 5 between an lower electrode 3 and an upper electrode 6. The high-resistance layer 4 is constituted by an oxide containing Te. An element other than the Te, for example, either Al, Zr, Ta, Hf, Si, Ge, Ni, Co, Cu or Au may be added. When the Al is added to the Te, and further the Cu and the Zr are added, it is desirable that a composition ratio of the high-resistance layer 4 is adjusted in a range of, excepting oxygen, 30≤Te≤100 atm%, 0≤Al≤70 atm% and 0≤Cu+Zr≤36 atm%. The ion source layer 5 is constituted of at least one kind of metal element and at least one kind of chalcogen element out of Te, S and Se. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve data retaining characteristic at writing, in a memory device of resistance varying type. SOLUTION: A memory layer 17 comprising a high-resistance layer 17A and an ion source layer 17B is provided between a lower electrode 14 and an upper electrode 18. The ion source layer 17B contains an O (oxygen) as an additional element together with an ion conductive material such as an S (sulfur), Se (selenium) and Te (tellurium) (chalcogenide element) and a metal element, which ionize, such as a Zr (zirconium). Since the oxygen is contained in the ion source layer 17B, retention performance for a high resistance condition at writing is improved. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a memory element that prevents deterioration in characteristics resulting from hot annealing after formation of an element. SOLUTION: A high resistance layer 3A consisting of an oxide of a metal element, and an ion source layer 3B containing metal elements (Cu, Ag, Zn) becoming an ion source are formed in this order between a lower electrode 2 and an upper electrode 4. The high resistance layer 3A includes an oxygen concentration gradient in the thickness direction, and the oxygen concentration at a part of the high resistance layer 3A touching the ion source layer 3B is below the oxygen concentration in the center of the high resistance layer 3A. Oxygen diffused from an overoxygen portion in the center of the high resistance layer 3A does not reach the ion source layer 3B during subsequent annealing, and variation in characteristics resulting from hot annealing in a subsequent step can be controlled. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface emission semiconductor laser element in which electrode wiring has no possibility of disconnection, fabrication time can be shortened, yield can be prevented from lowering, and reliability can be enhanced. SOLUTION: A mesa portion 10 consisting of columnar portions C1 and C2 and a prism portion S1 is formed on a substrate 11. A p-side electrode layer 20 is provided on the mesa portion 10. The p-side electrode layer 20 consists of a joint 20A being connected electrically with a p-side electrode contact layer 18, a pad 20B for wire bonding, and an interconnect line 20C for connecting the joint 20A and the pad 20B electrically wherein the joint 20A is provided with an opening 20D for ejecting light. The joint 20A, the pad 20B and the interconnect line 20C are provided, respectively, on the columnar portion C1, the columnar portion C2 and the prism portion S1. A current injection region (AlAs layer) 17A exists only in a region opposing the opening 20D. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To perform a proper operation in a high frequency band by suppressing the reduction of inductance L as much as possible in the high frequency band, and maintaining high head efficiency in the high frequency band. SOLUTION: When a core connecting height equivalent to the length of a part for connection between lower and upper layer cores 14 and 17 is (h), and the core thickness of the thinner film thickness of the lower layer core 14 or the upper layer core 17 is (t), the size of the core connection height (h) is defined so as to set a value (h/t) obtained by standardizing the core connection height (h) by the core thickness (t) in the range of 0.6
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film magnetic head capable of accurately etching the bottom part of an upper layer core for constituting the thin film magnetic head and preventing the over-etching of the peak part of the upper layer core and re-deposition to the side face of the upper layer core. SOLUTION: At the time of successively forming a gap layer and a upper layer core 24 in a prescribed shape on the surface of a substrate 20 of a lower layer core, masking the upper layer core 24 and etching the gap layer and the substrate 20 of the lower layer core by an ion beam, the substrate 20 of the lower layer core is inclined so as to have a prescribed angle formed by the normal line L of the surface of the substrate 20 and the ion beam B and is swung at the prescribed angle with the normal line of the surface of the substrate 20 as the center.
Abstract:
PROBLEM TO BE SOLVED: To provide an element of high quality which does not produce burrs and can be lifted off accurately, by forming a patterning layer on a substrate with a lift-off method, and by forming in the patterning layer a plural kinds of discriminating patterns for discriminating the state of lift-off and having different widths when it is lifted off. SOLUTION: A laminated body 13 comprising a soft magnetic film 10, a nonmagnetic film 11, and a magnetoresistance film (MR film) 12 is formed on a substrate 1 and is later made a MR element of a predetermined shape. A resist film 14 is formed on the laminated body 13 and is baked, and another resist film 15 is formed thereon. Then the laminated body 13 is exposed to a discriminating pattern and the resist films 14, 15 are developed. The resist film 15 is removed by the development except for the part corresponding to the discriminating pattern, and the resist film 14 is etched at the side to form the plural kinds of discriminating resists 17. The laminated body 13 except for the region of the discriminating resist 17 is removed by etching to expose a lower gap layer 4, which prevents the generation of burr.
Abstract:
PROBLEM TO BE SOLVED: To provide a vertical cavity surface emitting laser which is constructed so that a single transversal mode of a large output can be stably kept and an optical apparatus which is equipped with a light source composed of the vertical cavity surface emitting laser. SOLUTION: A scattering loss structure made up of low refraction areas are located around a main current passage in the vertical cavity surface emitting laser, i.e. a cavity composition, and the low refraction index areas are intermittently located, and the shape of the tip toward the center is tapered, e.g. an acute angle. Thereby, the loss of the light emitting laser of a higher mode, which is positioned in a further surrounding portion among the cavity compositions, is large, then, the vertical cavity surface emitting laser oscillating a good single mode laser can be made up. COPYRIGHT: (C)2005,JPO&NCIPI