公开(公告)号：JP2000039530A

公开(公告)日：2000-02-08

申请号：JP20627698

申请日：1998-07-22

Applicant: SONY CORP

Inventor： OGAWA TAKESHI

IPC: G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/43

Abstract: PROBLEM TO BE SOLVED: To improve connection efficiency of input/output beams even when a surface light emitting element and a surface light receiving element are used in an optical signal transmission system having an optical waveguide. SOLUTION: A high refractive index propagation control layer 6 with a refractive index higher than it is laminated on the upper surface of the clad 2 of the optical waveguide, and an incident side recessed surface part 7 and an emission side recessed surface part 8 are formed on a part that the interface between the clad 2 and the high refractive index propagation control layer 6 is overlapped by an optical path in order to suppress the radiation of a propagation beam on the optical path from a light emitting element 9 to an incident side mirror 4 and the optical path from an emission side mirror 5 to a light receiving element 10. Since the propagation beam going toward the incident side mirror 4 and the light receiving element 10 is converged by the refractive index of the high refractive index propagation control layer 6 and the lens effect of the recessed surface part, the connection efficiency is improved, and reliability in signal transmission is improved. In the case of laminating the propagation control layer of the refractive index lower than this on the clad 2, a projected surface part instead of the recessed surface part is formed.

公开(公告)号：JPH10153805A

公开(公告)日：1998-06-09

申请号：JP31236896

申请日：1996-11-22

Applicant: SONY CORP

Inventor： OGAWA TAKESHI

IPC: G02F1/37

Abstract: PROBLEM TO BE SOLVED: To obtain a resonator which is small in size and facilitates alignment and a wavelength converter which is capable of generating second harmonic waves with high efficiency by providing the resonator with a pair of mirrors, a nonlinear optical crystal and quarter-wave plates which are respectively disposed between the nonlinear optical crystal 13 and the respective mirrors and make a pair. SOLUTION: This resonator consists of the nonlinear optical crystal 13, a pair of the mirrors 14, 15 which are disposed before and behind the nonlinear optical crystal 13 by disposing their reflection surfaces opposite to each other and the two quarter-wave plates (λ/4) plates 16, 17 making a pair. The one quarter-wave plate 17 is disposed between the nonlinear optical crystal 13 and the one mirror (front side mirror) 15. The other quarter-wave plate 16 is disposed between the nonlinear optical crystal 13 and the other mirror (rear side mirror) 14. The quarter-wave plates 16, 17 generate a phase difference π/2 in a basic wave. A light source means is combined with the resonator, by which the wavelength converter is constituted.

公开(公告)号：JPH0980497A

公开(公告)日：1997-03-28

申请号：JP23295895

申请日：1995-09-11

Applicant: SONY CORP

Inventor： OGAWA TAKESHI ,  NADA NAOJI ,  YAMADA MASAHIRO

IPC: G02F1/37 ,  H01S3/06 ,  H01S3/109 ,  H01S5/00 ,  H01S3/18

Abstract: PROBLEM TO BE SOLVED: To increase wavelength conversion light power by changing the polarization direction of an oscillation mode of a semiconductor laser as a basic wave light source. SOLUTION: A laser light generating device is provided with a light source 3 and a non-linear optical element, that is, a non-linear optical crystal element provided with a light waveguide 2, a first end surface 2a and a second end surface 2b. Then, the light source 3 consists of the semiconductor laser, and the propagation of the light waveguide 2 has light polarization dependency, and outgoing light from the semiconductor laser is made incident on the light waveguide 2 from the first end surface 2a, and the polarization of the light source 3 is converted to the orthogonal polarization. That is, the semiconductor laser as the basic wave light source is converted from TE mode oscillation to TM mode oscillation, and by such a manner, the overlap between the TM mode electric field distribution of the semiconductor laser and the same of the waveguide is improved, and connection efficiency of an incident light quantity of a wavelength conversion element to the waveguide is increased remarkably.

公开(公告)号：JPH07270732A

公开(公告)日：1995-10-20

申请号：JP6156394

申请日：1994-03-30

Applicant: SONY CORP

Inventor： OGAWA TAKESHI

IPC: G02B6/12 ,  G02F1/035

Abstract: PURPOSE:To provide an optical waveguide type wavelength selector which is capable of surely executing wavelength selection by a simple constitution, in wide in central wavelength varying range of its wavelength selection in the case of varying the central wavelength, lessens optical damage and has excellent light power durability. CONSTITUTION:This optical waveguide type wavelength selector has an optical waveguide 3 having first and second end faces 21 and 22 and consisting of a first optical waveguide part 1 and a second optical waveguide part 2 and a periodic refractive index disturbing structural part 4 where this optical waveguide 3 periodically forms refractive index disturbance in the propagating direction of this optical waveguide 3. The first optical waveguide part 1 has a refractive index higher than the refractive index of the second optical waveguide part 2 and at least a part thereof is disposed in contact with the surface of the second optical waveguide part 2.

公开(公告)号：JPH06314836A

公开(公告)日：1994-11-08

申请号：JP12786893

申请日：1993-04-30

Applicant: SONY CORP

Inventor： OGAWA TAKESHI ,  KOGA YUJI ,  KIJIMA KOUICHIROU ,  TAGUCHI AYUMI

IPC: H01S3/109 ,  H01S5/00 ,  H01S3/18

Abstract: PURPOSE:To reduce retrogressive light from an outgoing end face or the like of a non-linear optical element facing a semiconductor laser while making the semiconductor laser always stably oscillate a fundamental wave laser light. CONSTITUTION:A semiconductor laser 1 and a non-linear type optical element 2 are butt-coupled so that the outgoing end face of the semiconductor laser and the incident end face of the non-linear type optical element may be adjacent. The non-linear type optical element performs wavelength conversion of a foundation wave laser light from the semiconductor laser 1. An electrode 3 is attached to this non-linear type optical element 2. An oscillator impresses an oscillation electric field of 100Hz to 10MHz on the non-linear type optical element through the electrode 3 so that a refractive index of the non-linear type optical element can be changed.

公开(公告)号：JP2007287803A

公开(公告)日：2007-11-01

申请号：JP2006111216

申请日：2006-04-13

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OGAWA TAKESHI ,  NAKAYAMA HIROKAZU ,  MIYAZAKI HIROHITO ,  TAKESHIMA NAMIKO

IPC: H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/18161 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a process for manufacturing a three-dimensional semiconductor package mounting semiconductor devices three-dimensionally, while shortening the interconnection between respective semiconductor devices and attaining scaling-down and densification. SOLUTION: A unit wafer layer substrate 3 of each layer is produced in separate step by burying a semiconductor device 10, an interconnection layer 11, and a conductive post 12 in a sealing resin layer 13 on a dummy substrate 4 and making them thin by polishing; and a step is repeated for producing a laminate by stripping a dummy substrate 4 from an upper unit wafer layer substrate 3 laminated on a lower unit wafer layer 2 produced by stripping a dummy substrate 4 from the unit wafer layer substrate 3, thus producing a semiconductor package 1 mounting semiconductor devices 10 three-dimensionally. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供三维半导体封装的制造方法，同时缩短各个半导体器件之间的互连并实现缩小和致密化。 解决方案：通过在虚拟衬底4上的密封树脂层13中埋入半导体器件10，互连层11和导电柱12，在单独的步骤中制造每层的单位晶片层衬底3，并使它们 抛光细 并且通过从层叠在通过从单元晶片层基板3剥离虚设基板4而制造的下单元晶片层2上的上单元晶片层基板3剥离虚设基板4，重复制造层叠体的步骤，由此制造半导体 封装1三维安装半导体器件10。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006270036A

公开(公告)日：2006-10-05

申请号：JP2005296734

申请日：2005-10-11

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OGAWA TAKESHI ,  NAKAYAMA HIROKAZU ,  MIYAZAKI HIROHITO ,  TAKESHIMA NAMIKO

IPC: H01L25/18 ,  G02B6/122 ,  G02B6/42 ,  H01L25/04

CPC classification number: H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To mount different packaging components while reducing a thickness, and to enhance packaging precision, efficiency and reliability. SOLUTION: The hybrid module comprises: a silicon substrate 3 having a plurality of opening 8 for loading components; a plurality of kinds of packaging component 4 being loaded in the component loading openings 8 and secured by a sealing resin layer 9; and a wiring layer 5 formed on the silicon substrate 3. The packaging component 4 is loaded in the component loading opening 8 while directing the surface 10 for forming an I/O portion outward, and packaged in a state buried in the silicon substrate 3 with the outer circumferential portion being secured by a sealing resin layer 9. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：在减小厚度的同时安装不同的包装部件，并提高包装精度，效率和可靠性。 解决方案：混合模块包括：具有用于加载部件的多个开口8的硅基板3; 多种包装部件4被装载在部件装载口8中并被密封树脂​​层9固定; 以及形成在硅基板3上的布线层5.将包装部件4装载到部件装载口8中，同时将形成I / O部分的表面10向外引导，并以埋入硅基板3的状态封装， 外周部分由密封树脂层9固定。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004325520A

公开(公告)日：2004-11-18

申请号：JP2003116208

申请日：2003-04-21

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OGAWA TAKESHI

IPC: G02B6/12 ,  G02B6/13 ,  G02F1/313

Abstract: PROBLEM TO BE SOLVED: To perform switching and conversion of optical signals while reducing transmission loss between a plurality of optical waveguides. SOLUTION: A switching region 8 where superposition bonding of an optical signal mode distribution layered at an opposing interval is generated in an optical signal propagation direction is formed at first and second optical waveguides 10 and 11 which are layered on a base substrate 4. An optical waveguide heating layer 9 changing the refractive index of one optical waveguide 11 is formed in the switching region 8 and switching and conversion of the optical signals are performed between the first and the second optical waveguides 10 and 11. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004193221A

公开(公告)日：2004-07-08

申请号：JP2002357069

申请日：2002-12-09

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OGAWA TAKESHI

IPC: G02B6/12 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L24/97 ,  H01L21/568 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To reduce parasitic capacitance by shortening electrical wiring and realize high speed and large capacity signal transmission. SOLUTION: The hybrid module is formed of an element sealing block body 2 in which semiconductor circuit element 5 and optical elements 6, 7 are sealed and integrated with an insulating resin layer 8, so that the forming surfaces of the input/output portions are set to the same surface; and an electrical wiring block body 3 including a light guiding member 24 for optically connecting an electric wiring layer 17 for electrically connecting the semiconductor circuit element 5 and optical elements 6, 7 and the optical elements 6, 7. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2002374069A

公开(公告)日：2002-12-26

申请号：JP2001179229

申请日：2001-06-13

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OGAWA TAKESHI ,  TOGAWA MIYOSHI

IPC: H05K3/46

CPC classification number: H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19105

Abstract: PROBLEM TO BE SOLVED: To reduce high-frequency element layer of a high-frequency module device in area and size by forming a thin-film pattern with accuracy. SOLUTION: The high-frequency module device comprises a base substrate 2 made of a multilayered organic printed substrate, in which the main surface of the uppermost layer is planarized, a first high-frequency circuit 15 having a first thin film pattern 14, in which a part of the main surface of the uppermost layer of the substrate 2 as a high-frequency passive element via a first insulating layer, and a second high-frequency circuit 19 having a second thin-film pattern 18, in which part of the first high-frequency circuit 15 is formed as a high-frequency passive element as a second thin-film pattern 18 via a second insulating layer 17, in such a manner that a build-up forming surface 15a of the circuit 15, formed with the second circuit 19, is planarized.

Abstract translation: 要解决的问题：通过精确地形成薄膜图案来减小面积和尺寸的高频模块装置的高频元件层。 解决方案：高频模块装置包括由多层有机印刷基板制成的基底基板2，其中最上层的主表面被平坦化，具有第一薄膜图案14的第一高频电路15，其中 通过第一绝缘层作为高频无源元件的基板2的最上层的主表面的一部分，以及具有第二薄膜图案18的第二高频电路19，其中第一 高频电路15通过第二绝缘层17形成为作为第二薄膜图案18的高频无源元件，使得形成有第二绝缘层17的电路15的积聚形成表面15a 电路19平坦化。